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1. 发明授权

US5358017A Method, system and apparatus for forming leads for semiconductors packages 失效
标题翻译：用于形成半导体封装导线的方法，系统和装置
公开(公告)号：US5358017A
公开(公告)日：1994-10-25
申请号：US54438
申请日：1993-04-20
申请人： Shuji Ide
发明人： Shuji Ide
IPC分类号： H01L23/50 , H01L21/48 , H05K13/00 , B21F45/00
CPC分类号： H05K13/0092 , H01L21/4842
摘要： A forming apparatus for bending the leads of a semiconductor package including a body portion, and a plurality of leads extending from the sides of the body portion to a predetermined configuration. The forming die includes a series of walls arranged in a predetermined pattern having a seat for the body portion of the semiconductor package and a series of stepped outer wall portions. A plurality of a elongated spaced rigid portions on the outer surface of the wall portion define a series of grooves for receiving the leads of the semiconductor package. A punch adapted for reciprocating movement relative to the forming die engages and presses the leads into the grooves so that the leads conform to the outer wall portions of the die.
摘要翻译：一种用于弯曲包括主体部分的半导体封装的引线的成形装置，以及从主体部分的侧面延伸到预定构造的多个引线。成型模具包括以预定图案布置的一系列壁，其具有用于半导体封装的主体部分的座和一系列阶梯式外壁部分。在壁部分的外表面上的多个细长间隔的刚性部分限定了一系列用于接收半导体封装引线的凹槽。适于相对于成型模具进行往复运动的冲头将引线接合并压入槽中，使得引线与模具的外壁部分一致。

2. 发明申请

US20070262049A1 Imprinting method and nano-imprinting apparatus 审中-公开
标题翻译：压印方法和纳米压印装置
公开(公告)号：US20070262049A1
公开(公告)日：2007-11-15
申请号：US11798447
申请日：2007-05-14
申请人： Fumio Miyajima , Kazuhiko Kobayashi , Kazuhiko Kobayashi , Hideaki Nakazawa , Naoya Gotoh , Masahiko Fujisawa , Akira Katsuyama , Shuji Ide
发明人： Fumio Miyajima , Kazuhiko Kobayashi , Kazuhiko Kobayashi , Hideaki Nakazawa , Naoya Gotoh , Masahiko Fujisawa , Akira Katsuyama , Shuji Ide
IPC分类号： B44C1/22 , B29C33/40
CPC分类号： B29C33/42 , B29C43/003 , B29C43/021 , B29C43/18 , B29C2043/025 , B29C2043/3605 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： An imprinting method carries out imprinting on a workpiece by clamping UV-curable resin between a nano-imprinting mold and a workpiece and curing the UV-curable resin using UV light. In this method, the workpiece is supported on a setting table provided with through-holes that are disposed in a planar region of the setting table on which the workpiece is set and are connected to a gas pumping/evacuating mechanism. The UV-curable resin is supplied onto the workpiece and the setting table is raised to and stopped at a filling operation position where the mold surface of the nano-imprinting mold and the surface of the workpiece are apart. After this, gas is pumped toward the lower surface of the workpiece from the through-holes and the workpiece is pressed onto the nano-imprinting mold from a center of the workpiece toward a periphery of the workpiece while gradually filling the UV-curable resin between the nano-imprinting mold and the workpiece. The UV-curable resin is cured by irradiating the UV-curable resin with UV light in a state where the workpiece is pressed onto the nano-imprinting mold by the pumping pressure of the gas.
摘要翻译：压印方法通过将UV固化树脂夹在纳米压印模和工件之间并通过UV光固化UV固化树脂，在工件上进行压印。在该方法中，工件被支撑在设置有设置在设置工作台的平面区域中并且与气体抽吸/排气机构连接的通孔的设置台上。将紫外线固化树脂供给到工件上，并且将安装台升高并停止在填充操作位置，其中纳米压印模具的模具表面和工件表面分开。此后，气体从通孔向工件的下表面泵送，并且工件从工件的中心朝向工件的周边压到纳米压印模具上，同时逐渐地将UV可固化树脂填充在纳米压印模具和工件。在通过气体的泵送压力将工件压在纳米压印模上的状态下，通过用UV光照射UV固化树脂来固化紫外线固化树脂。

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