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1. 发明授权

US08609297B2 Flat fuel cell assembly and fabrication thereof 有权
标题翻译：扁平燃料电池组件及其制造
公开(公告)号：US08609297B2
公开(公告)日：2013-12-17
申请号：US10879952
申请日：2004-06-29
申请人： Yeu-Shih Yen , Chiou-Chu Lai , Ju-Pei Chen , Shu-Chen Huang , Ku-Yin Ka
发明人： Yeu-Shih Yen , Chiou-Chu Lai , Ju-Pei Chen , Shu-Chen Huang , Ku-Yin Ka
IPC分类号： H01M4/64 , H01M8/10
CPC分类号： H01M8/2418 , H01M8/0232 , H01M8/0239 , H01M8/0241 , H01M8/0245 , H01M8/0271 , H01M8/241 , H01M8/242 , Y02P70/56
摘要： A connecting structure of a flat fuel cell assembly. The assembly includes a plurality of fuel cells, each of which has a membrane electrode assembly with an anode, a proton exchange membrane and a cathode combined. Two conductive nets are attached to the surfaces of the anode and the cathode of each membrane electrode assembly by thermosetting adhesive and heat pressing to collect and transmit electrons.
摘要翻译：扁平燃料电池组件的连接结构。该组件包括多个燃料电池，每个燃料电池具有带阳极的膜电极组件，质子交换膜和阴极组合。两个导电网通过热固性粘合剂和热压连接到每个膜电极组件的阳极和阴极的表面以收集和传输电子。

2. 发明申请

US20120107409A1 PREPARATION AND USE OF FISH SKIN FERMENTATION PRODUCT 审中-公开
标题翻译：鱼皮发酵产品的制备和使用
公开(公告)号：US20120107409A1
公开(公告)日：2012-05-03
申请号：US13240231
申请日：2011-09-22
申请人： SHU-CHEN HUANG , PEI-JOU LIU , CHIAO-MING LIAO , HING-YUEN CHAN
发明人： SHU-CHEN HUANG , PEI-JOU LIU , CHIAO-MING LIAO , HING-YUEN CHAN
IPC分类号： A61K35/60 , A61P17/00 , A61P9/10 , A61P9/00 , A61P9/12 , A23L1/31 , A61P17/02
CPC分类号： A61K35/60 , A23L17/65
摘要： The present invention relates to a method for fermenting fish skin by using Aspergillus. Also provided is a use of the fermentation product obtained from the method in inhibiting the activity of tyrosinase, inhibiting the activity of angiotensin-converting enzyme and/or improving the survival of fibroblasts.
摘要翻译：本发明涉及使用曲霉菌发酵鱼皮的方法。还提供了从抑制酪氨酸酶的活性，抑制血管紧张素转化酶的活性和/或改善成纤维细胞存活的方法获得的发酵产物的用途。

3. 发明申请

US20070261805A1 Light partition assembly 审中-公开
标题翻译：轻型分隔组件
公开(公告)号：US20070261805A1
公开(公告)日：2007-11-15
申请号：US11433337
申请日：2006-05-12
申请人： Shu-Chen Huang
发明人： Shu-Chen Huang
IPC分类号： E06B9/24
CPC分类号： E04B2/7457 , E04B2/763 , E04B2002/7466
摘要： A partition assembly includes a plurality of parallel arranged upright posts, a plurality of transverse support posts, a plurality of first connecting plates, a plurality of second connecting plates, and a plurality of panels. Thus, the limit slot of each of the panels is hooked on the locking hook of the respective support post so that each of the panels is mounted on the respective support post easily and quickly without needing any screw member, thereby facilitating a user mounting the panels.
摘要翻译：分隔组件包括多个平行布置的直立柱，多个横向支撑柱，多个第一连接板，多个第二连接板和多个面板。因此，每个面板的限制槽被钩在相应支撑柱的锁定钩上，使得每个面板容易且快速地安装在相应的支撑柱上，而不需要任何螺钉构件，从而便于使用者安装面板。

4. 发明授权

US07061103B2 Chip package structure 有权
标题翻译：芯片封装结构
公开(公告)号：US07061103B2
公开(公告)日：2006-06-13
申请号：US10707684
申请日：2004-01-05
申请人： Kai-Chi Chen , Shu-Chen Huang , Hsun-Tien Li , Tzong-Ming Lee , Taro Fukui , Tomoaki Nemoto
发明人： Kai-Chi Chen , Shu-Chen Huang , Hsun-Tien Li , Tzong-Ming Lee , Taro Fukui , Tomoaki Nemoto
IPC分类号： H01L23/22 , H01L23/34
CPC分类号： H01L23/4334 , H01L21/565 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2225/06589 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is flip-chip bonded and electrically connected to the carrier or another chip. There is a flip-chip bonding gap between the chip and the carrier or other chips. A heat sink is positioned on the uppermost chip. The encapsulating material layer fills the flip-chip bonding gap as well as a gap between the uppermost chip and the heat sink. A part of the surface of the heat sink away from the upper-most chip is exposed. Furthermore, the encapsulating material layer is formed in a simultaneous molding process. For example, the chip is separated from the heat sink by a distance between 0.03˜0.2 mm, and the encapsulating material has a thermal conductivity greater than 1.2 W/m.K.
摘要翻译：公开了一种芯片封装结构。芯片封装结构基本上包括载体，一个或多个芯片，散热器和封装材料层。芯片中的至少一个被倒装芯片结合并电连接到载体或另一个芯片。在芯片和载体或其他芯片之间存在倒装芯片接合间隙。散热器位于最上面的芯片上。封装材料层填充倒装芯片接合间隙以及最上面的芯片和散热器之间的间隙。离开最上面的芯片的散热器表面的一部分被暴露。此外，封装材料层以同时成型工艺形成。例如，将芯片与散热器隔开0.03〜0.2mm的距离，封装材料的导热率大于1.2W / m·K。

5. 发明申请

US20050087852A1 Chip package structure and process for fabricating the same 有权
标题翻译：芯片封装结构及其制造工艺
公开(公告)号：US20050087852A1
公开(公告)日：2005-04-28
申请号：US10707683
申请日：2004-01-05
申请人： Kai-Chi Chen , Shu-Chen Huang , Hsun-Tien Li , Tzong-Ming Lee , Taro FUKUI , Tomoaki NEMOTO
发明人： Kai-Chi Chen , Shu-Chen Huang , Hsun-Tien Li , Tzong-Ming Lee , Taro FUKUI , Tomoaki NEMOTO
IPC分类号： H01L21/56 , H01L23/31 , H01L25/065 , H01L21/48 , H01L23/02
CPC分类号： H01L25/0657 , H01L21/565 , H01L23/3128 , H01L24/48 , H01L24/97 , H01L25/16 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/48091 , H01L2224/73204 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.
摘要翻译：公开了一种芯片封装结构及其制造方法。芯片封装结构主要包括载体，芯片和封装材料层。为了制造芯片封装，提供了载体和多个芯片。每个芯片至少具有在其上具有多个凸块的活性表面。芯片和载体电连接。形成填充芯片和载体之间的接合间隙并覆盖芯片和载体的封装材料层。芯片和载体之间的封装材料层具有第一厚度，并且芯片上的封装材料层具有第二厚度。第二厚度具有在第一厚度的一半到两倍之间的值。

6. 发明授权

US06841094B2 Fine conductive particles for making anisotropic conductive adhesive composition 有权
标题翻译：用于制造各向异性导电粘合剂组合物的细小导电颗粒
公开(公告)号：US06841094B2
公开(公告)日：2005-01-11
申请号：US10246460
申请日：2002-09-19
申请人： Hsun-Tien Li , Shu-Chen Huang , Kai-Chi Chen
发明人： Hsun-Tien Li , Shu-Chen Huang , Kai-Chi Chen
IPC分类号： H01B1/22 , H05K3/32
CPC分类号： H01B1/22 , H05K3/323 , H05K2201/0224 , Y10T428/2995
摘要： Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.
摘要翻译：细导电颗粒由金属导电粉末和粉末颗粒上的绝缘有机覆盖层组成。金属导电粉末具有直径范围为1至20微米的晶粒，并且覆盖层具有50-400nm的厚度，其能够通过热压而流动。绝缘有机覆盖层由具有反应性官能团的硅烷，含氟硅烷和具有能够与反应性官能团反应的官能团的化合物或树脂制备。

7. 发明授权

US06707223B1 Stator assembly structure 有权
标题翻译：定子组装结构
公开(公告)号：US06707223B1
公开(公告)日：2004-03-16
申请号：US10395257
申请日：2003-03-25
申请人： Shu-Chen Huang
发明人： Shu-Chen Huang
IPC分类号： H02K112
CPC分类号： H02K1/187 , H02K5/15 , H02K7/14 , H02K11/00 , H02K2211/03
摘要： A stator assembly structure has a latch and coupling design to assemble every element of the stator so that the stator structure may be disassembled and separated. The separated elements may be recycled according to their material nature to reduce waste of resources.
摘要翻译：定子组件结构具有闩锁和联接设计，以组装定子的每个元件，使得定子结构可以被拆卸和分离。分离的元件可以根据其材料性质再循环，以减少资源的浪费。

8. 发明授权

US06229815B1 Method of optimal routing in a bi-directional line switched sonet ring 失效
标题翻译：双向线路交换式超声波环路中最优路由的方法
公开(公告)号：US06229815B1
公开(公告)日：2001-05-08
申请号：US09036392
申请日：1998-03-06
申请人： Jennifer Shu-Chen Huang , Sridhar S. Nathan , Jonathan Weston-Dawkes
发明人： Jennifer Shu-Chen Huang , Sridhar S. Nathan , Jonathan Weston-Dawkes
IPC分类号： H04L12403
CPC分类号： H04Q11/0478 , H04J2203/0042 , H04J2203/0053 , H04J2203/0067 , Y10S370/907
摘要： A method of assigning capacity and routing flow in a bi-directional line switched SONET ring based upon ring topology and demand data defines for each pair of links of the ring a two-edge cut. Each two-edge cut divides the ring into two sets of nodes. For each two-edge cut, the capacity assignment method calculates a demand equal to the sum of all demands between nodes on opposite sides of the two-edge cut. The capacity assignment method then determines the maximum demand and sets the capacity of each link equal to one-half the maximum demand plus one-half of one demand unit. The flow routing method of the present invention calculates a cut difference for each two-edge cut. A critical cut is a two-edge cut having a cut difference equal to or less than one. If there is a critical cut with demands greater than zero on the same side of the critical cut, the method performs a first processing routine. If there is no critical cut with demands greater than zero on the same side of the critical cut, the method performs a second processing routine. The flow routing method performs the first or second processing routine until the occurrence of a terminating condition.
摘要翻译：基于环形拓扑和需求数据在双向线路交换SONET环中分配容量和路由流的方法为环的每对链路定义两边缘切割。每个两边切割将环分成两组节点。对于每个两边切割，容量分配方法计算等于两边切割相对侧的节点之间的所有需求之和的需求。然后，容量分配方法确定最大需求，并将每个链路的容量设置为等于最大需求的一半加上一个需求单元的一半。本发明的流程布置方法计算每个两边切割的切割差。关键切割是具有等于或小于1的切割差的两边切割。如果在临界切割的同一侧存在要求大于零的关键切割，则该方法执行第一处理程序。如果在临界切割的同一侧没有要求大于零的关键切割，则该方法执行第二处理程序。流程路由方法执行第一或第二处理例程直到发生终止条件。

9. 发明授权

US5710459A Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability 失效
标题翻译：集成电路封装，提供多个导热通道，用于增强散热并围绕盖缠绕，以提高完整性和可靠性
公开(公告)号：US5710459A
公开(公告)日：1998-01-20
申请号：US689534
申请日：1996-08-09
申请人： Kun-Tang Teng , Shin-Tang Jian , Shu-Chen Huang
发明人： Kun-Tang Teng , Shin-Tang Jian , Shu-Chen Huang
IPC分类号： H05K7/20 , H01L23/10 , H01L23/12 , H01L23/36 , H01L23/367 , H05K1/02 , H05K3/42 , H01L23/34
CPC分类号： H05K1/0206 , H01L23/10 , H01L23/3675 , H01L23/3677 , H01L2224/32225 , H01L2224/48472 , H01L2224/73265 , H01L2924/01079 , H01L2924/15311 , H01L2924/16152 , H01L2924/3025 , H05K2201/066 , H05K2201/10734 , H05K3/429
摘要： This invention is discloses a packaged integrated circuit (IC) which includes an IC chip supported and securely attached to an adapter board. The package also includes a chip cap for covering and protecting the IC chip therein. The chip cap further forms a concave, step near a lower edge of the cap for wrapping around the edge of the adapter board for increasing the contact areas between the cap and the board and for securely attaching the cap to the board. The chip cap is composed of thermal conductive materials and the chip cap further includes a heat sink for dissipating heat generated from the IC chip. The adapter board further includes a plurality of connecting vias and a plurality of conductive metal balls forming a ball grid array (BGA) underneath the adapter board. The IC chip is in electrical and thermal contact with the BGA by filling the connection vias with conductive materials. A printed circuit board (PCB) is used for supporting and receiving the adapter board thereon, the PCB includes a plurality of thermal vias penetrating therethrough and filled with thermal conductive materials, wherein the thermal vias corresponding to and in contact with a plurality of the conductive metal balls of the BGA for dissipating heat generated from the IC.
摘要翻译：本发明公开了一种封装集成电路（IC），其包括被支撑并牢固地附接到适配器板的IC芯片。封装还包括用于在其中覆盖和保护IC芯片的芯片盖。芯片帽进一步在盖子的下边缘附近形成一个凹进的台阶，用于围绕适配器板的边缘缠绕，以增加盖子和板之间的接触面积，并将帽牢固地连接到板上。芯片盖由导热材料构成，芯片盖还包括散热片，用于耗散IC芯片产生的热量。适配器板还包括多个连接通孔和形成适配器板下方的球栅阵列（BGA）的多个导电金属球。通过用导电材料填充连接通孔，IC芯片与BGA电气和热接触。印刷电路板（PCB）用于在其上支撑和接收适配器板，PCB包括穿过其中并填充有导热材料的多个热通孔，其中对应于并与多个导电材料接触的热通孔用于散发由IC产生的热量的BGA金属球。

10. 外观设计

USD380447S Ethernet switching hub 失效
公开(公告)号：USD380447S
公开(公告)日：1997-07-01
申请号：US42356
申请日：1995-08-08
申请人： Chi-Chuan Chen , Shu-Chen Huang
设计人： Chi-Chuan Chen , Shu-Chen Huang

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