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1. 发明申请

US20070246197A1 Low profile thermosiphon 失效
标题翻译：低调热虹吸
公开(公告)号：US20070246197A1
公开(公告)日：2007-10-25
申请号：US11407452
申请日：2006-04-20
申请人： Ilya Reyzin , Mohinder Bhatti , Shrikant Joshi
发明人： Ilya Reyzin , Mohinder Bhatti , Shrikant Joshi
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit. A refrigerant is disposed within one or more boiling chambers. Heat generated by the electronic device is transferred to the refrigerant by the boiling chambers for liquid-to-vapor transformation. Condenser tubes having a bottom end and a top end extend from the boiling chambers at a diagonally upward angle across the sides between the housing bottom and housing top. The condenser tubes receive and condense vapor boiled off from the refrigerant. Air moving devices axially move air through the housing. Air is flowed across the condenser tubes to facilitate condensation.
摘要翻译：用于耗散由电子设备产生的热量的热虹吸管冷却组件包括具有壳体顶部，壳体底部和相对侧面的壳体。相对的侧面在壳体顶部和壳体底部之间延伸以限定低轮廓入口和低轮廓出口。制冷剂设置在一个或多个沸腾室内。由电子装置产生的热量通过沸腾室转移至制冷剂进行液 - 气转化。具有底端和顶端的冷凝器管从沸腾室以对角线向上的角度延伸穿过壳体底部和壳体顶部之间的侧面。冷凝器管接收并冷凝从制冷剂中蒸发的蒸气。空气移动装置将空气轴向移动通过壳体。空气流过冷凝器管，以便冷凝。

2. 发明申请

US20070144707A1 Cooling assembly with successively contracting and expanding coolant flow 审中-公开
标题翻译：冷却组件随着冷却剂流动逐渐缩小和膨胀
公开(公告)号：US20070144707A1
公开(公告)日：2007-06-28
申请号：US11527054
申请日：2006-09-26
申请人： Mohinder Bhatti , Shrikant Joshi , Ilya Reyzin
发明人： Mohinder Bhatti , Shrikant Joshi , Ilya Reyzin
IPC分类号： H05K7/20
CPC分类号： F28D15/0266 , F28F3/048 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.
摘要翻译：一种流体热交换器组件，其具有在入口和出口之间延伸的上壁和下壁，用于建立冷却电子设备的流动方向。多个突起沿着流动方向线性地横向延伸，以在相邻的突起之间限定具有线性空腔的突出部分，使得当流体流过突起排时，流体流入和流出空腔，以使冷却剂流的收缩和膨胀以最大限度地传热。如横截面所示，突起可以是矩形，三角形或凸形。

3. 发明申请

US20060162903A1 Liquid cooled thermosiphon with flexible partition 审中-公开
标题翻译：液体冷却热虹吸管，带有柔性分隔
公开(公告)号：US20060162903A1
公开(公告)日：2006-07-27
申请号：US11040988
申请日：2005-01-21
申请人： Mohinder Bhatti , Shrikant Joshi , Mark Parisi , Russell Johnson
发明人： Mohinder Bhatti , Shrikant Joshi , Mark Parisi , Russell Johnson
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/06 , F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and is flexible to vary the volume of the upper portion for modulating the flow of coolant fluid through the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.
摘要翻译：流体热交换器组件将电子设备与从散热器供应到壳体的上部的冷却流体冷却。制冷剂设置在壳体的下部以进行液体 - 蒸汽转化。隔板分隔壳体的上部与下部分并且是柔性的以改变上部的体积，以响应于由电子装置传递到下部的热量来调节通过上部的冷却剂流体的流动住房。

4. 发明申请

US20070256433A1 Portable air conditioner 审中-公开
标题翻译：便携式空调
公开(公告)号：US20070256433A1
公开(公告)日：2007-11-08
申请号：US11415576
申请日：2006-05-02
申请人： Mohinder Bhatti , Ilya Reyzin , Shrikant Joshi
发明人： Mohinder Bhatti , Ilya Reyzin , Shrikant Joshi
IPC分类号： F28C1/00 , F28D5/00
CPC分类号： F28D5/00 , F24F1/0007 , F24F5/0035 , F24F6/043 , F24F2005/0064 , Y02B30/545
摘要： A portable air conditioner comprises a tank for storing a liquid therein, a plurality of tubes, and at least one fin disposed between adjacent tubes. The tubes are spaced from one another defining an air passageway therebetween having an air inlet and a dry air outlet. Each tube has a first end extending into the tank in fluid communication with the liquid and a second end extending opposite the tank defining a wet air outlet and a wicking material disposed therein and in fluid communication with the liquid. A sheet valve sealingly engages the dry air outlet and the wet air outlet and is moveable for adjusting an amount of air flow exiting from the dry air outlet and the wet air outlet. At least one aperture is defined within each of the tubes between the ends to divert air flowing through the air passageway into the tubes.
摘要翻译：一种便携式空调包括用于储存液体的罐，多个管以及设置在相邻管之间的至少一个翅片。管彼此间隔开，其间具有空气入口和干燥空气出口。每个管具有延伸到罐中的与液体流体连通的第一端，并且与罐相对延伸的第二端限定湿气出口和布置在其中并与液体流体连通的芯吸材料。片状阀密封地接合干燥空气出口和湿气出口，并且可移动以调节从干燥空气出口和湿气出口排出的空气流量。在每个管之间在端部之间限定至少一个孔，以将流过空气通道的空气转入管中。

5. 发明申请

US20070227701A1 Thermosiphon with flexible boiler plate 审中-公开
标题翻译：热虹吸与柔性锅炉板
公开(公告)号：US20070227701A1
公开(公告)日：2007-10-04
申请号：US11395664
申请日：2006-03-31
申请人： Mohinder Bhatti , Ilya Reyzin , Shrikant Joshi
发明人： Mohinder Bhatti , Ilya Reyzin , Shrikant Joshi
IPC分类号： F28D15/00
CPC分类号： F28D15/0275 , F28D15/02
摘要： A thermosiphon cooling assembly includes a housing having a lower portion and an upper portion. A refrigerant is disposed in the lower portion for liquid-to-vapor transformation. A boiler plate defines an outer bottom wall of the housing for transferring heat from the electronic device to the refrigerant. This transfer of heat to the refrigerant leads to a liquid-to-vapor transformation and a pressure build up in the housing. The boiler plate is flexible for reacting with the electronic device in response to the pressure build up in the housing. The boiler plate includes an inflexible first area for overlying the electronic device and a flexible second area which surrounds the first area of the boiler plate. The second area has a thickness t2 less than the thickness t, of the first area thus allowing the boiler plate to flex in the second area.
摘要翻译：热虹吸管冷却组件包括具有下部和上部的壳体。制冷剂配置在下部进行液 - 蒸汽转化。锅炉板限定了壳体的外底壁，用于将热量从电子装置传递到制冷剂。这种向制冷剂的转移导致液体 - 蒸气转化和在壳体中的压力积聚。锅炉板可灵活地响应于在壳体中的压力而与电子装置反应。锅炉板包括用于覆盖电子设备的不灵活的第一区域和围绕锅炉板的第一区域的柔性第二区域。第二区域的厚度t 2小于第一区域的厚度t，从而允许锅炉板在第二区域中弯曲。

6. 发明申请

US20070074856A1 Multi-layered micro-channel heat sink 失效
标题翻译：多层微通道散热片
公开(公告)号：US20070074856A1
公开(公告)日：2007-04-05
申请号：US11242739
申请日：2005-10-04
申请人： Mohinder Bhatti , Ilya Reyzin , Shrikant Joshi
发明人： Mohinder Bhatti , Ilya Reyzin , Shrikant Joshi
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the channels decreasing in number with an increase in the distance from the electronic device, thus giving the heat sink a trapezoidal cross section perpendicular to the channels.
摘要翻译：本发明提供了一种用于液体冷却系统的散热器。散热器包括用于接触电子设备的扩展板和具有延伸穿过主体并且以层布置的多个通道的主体。每个层包括随着与电子设备的距离增加而数量减少的通道的数量，从而给散热器垂直于通道的梯形横截面。

7. 发明申请

US20060207746A1 Cooling assembly with impingement cooled heat sink 失效
标题翻译：具有冲击冷却散热器的冷却组件
公开(公告)号：US20060207746A1
公开(公告)日：2006-09-21
申请号：US11080012
申请日：2005-03-15
申请人： Mohinder Bhatti , Shrikant Joshi , Ilya Reyzin
发明人： Mohinder Bhatti , Shrikant Joshi , Ilya Reyzin
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto the fins and is disposed above the base plate and below the top extremity of the fins. The flow of cooling fluid is discharged from the nozzle adjacent the base plate and then flows upwardly through the fins to remove the heat from the base plate before removing any heat from the fins.
摘要翻译：本发明提供一种用于从电子设备移除热量的冷却组件。冷却组件包括具有基板和从基板向上延伸到顶端的多个散热片的散热器。喷嘴将冷却流体流引导到翅片上，并且设置在基板的上方并且在翅片的顶端下方。冷却流体的流动从邻近基板的喷嘴排出，然后向上流过翅片，以在从散热片去除任何热量之前从基板除去热量。

8. 发明申请

US20060164807A1 Apparatus for controlling thermal interface between cold plate and integrated circuit chip 失效
标题翻译：用于控制冷板和集成电路芯片之间的热接口的装置
公开(公告)号：US20060164807A1
公开(公告)日：2006-07-27
申请号：US11040623
申请日：2005-01-21
申请人： Ilya Reyzin , Mohinder Bhatti , Lawrence Scherer , Andrew Hayes , Shrikant Joshi
发明人： Ilya Reyzin , Mohinder Bhatti , Lawrence Scherer , Andrew Hayes , Shrikant Joshi
IPC分类号： H05K7/20
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also includes a finger member having a rounded tip centered on the top surface. The heat sink device also includes a force generating device having an anvil spaced from the finger member and a compressible member compressed between the anvil and the finger member. The compressible member generates a pressing force urging the finger member and the top surface together. The heat sink device also includes a moving device operable to move one of the anvil and the finger member relative to the other to change the pressing force generated by the compressible member.
摘要翻译：本发明提供了一种用于接收由电子芯片产生的热量的散热装置。散热装置包括具有用于从电气芯片接收热量的底表面和与底部表面相对的顶表面的冷板。散热装置还包括具有以顶部表面为中心的圆形尖端的指状构件。散热装置还包括具有与指状构件间隔开的砧座的力产生装置和压缩在砧座和指状构件之间的可压缩构件。可压缩构件产生将指状构件和顶表面一起推动的按压力。散热装置还包括可操作以使砧座和指状构件中的一个相对于另一个移动的移动装置，以改变由可压缩构件产生的按压力。

9. 发明申请

US20050247432A1 Heat dissipation element for cooling electronic devices 失效
标题翻译：用于冷却电子设备的散热元件
公开(公告)号：US20050247432A1
公开(公告)日：2005-11-10
申请号：US10840410
申请日：2004-05-06
申请人： Mohinder Bhatti , Ilya Reyzin , Debashis Ghosh , Shrikant Joshi
发明人： Mohinder Bhatti , Ilya Reyzin , Debashis Ghosh , Shrikant Joshi
IPC分类号： F28D15/02 , F28F3/04 , F28F7/00 , F28F13/00
CPC分类号： F28F3/04 , F28D15/0233 , F28F13/00
摘要： A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).
摘要翻译：公开了一种用于冷却电子设备的散热元件。散热元件具有用于安装要冷却的电子设备的顶表面和底表面。顶表面限定了用于从电子设备散热的散热区域，并且多个传热翅片从顶表面向上突出并且与散热区域共同延伸。每个传热翅片限定了具有上升和下降的多个台阶，并且每个台阶延伸穿过散热区域以最大化从电子设备散发的热量。散热元件在与液体冷却单元（LCU）一起使用的冷板组件或与热虹吸冷却单元（TCU）一起使用的锅炉板组件中的任一个中特别有用。

10. 发明申请

US20070246196A1 High performance thermosiphon with internally enhanced condensation 有权
标题翻译：高性能热虹吸内部增强冷凝
公开(公告)号：US20070246196A1
公开(公告)日：2007-10-25
申请号：US11406621
申请日：2006-04-19
申请人： Mohinder Bhatti , Ilya Reyzin , Shrikant Joshi
发明人： Mohinder Bhatti , Ilya Reyzin , Shrikant Joshi
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/02 , F28D2015/0291 , F28F13/125 , F28F2250/08 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may include a vapor stirrer disposed above the liquid of the refrigerant and/or a liquid stirrer disposed in the liquid of the refrigerant for moving the liquid of the refrigerant over a boiler plate.
摘要翻译：热虹吸管冷却组件包括设置在壳体的下部以进行液 - 蒸 - 冷循环的制冷剂。混合装置设置在壳体的下部，用于在液体 - 蒸气 - 冷凝循环期间增加从电子装置的热传递。混合装置可以包括设置在制冷剂的液体上方的蒸气搅拌器和/或设置在制冷剂液体中的液体搅拌器，用于将制冷剂的液体移动到锅炉板上。

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