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1. 发明申请

US20070140563A1 PRINT INSPECTING APPARATUS 审中-公开
标题翻译：打印检查装置
公开(公告)号：US20070140563A1
公开(公告)日：2007-06-21
申请号：US11609252
申请日：2006-12-11
申请人： Keisaku KANO , Shoichi SHIMAMURA , Kei MATSUEDA , Mineo KUBOTA , Hiromitsu TAMURA , Tsukasa KONDO
发明人： Keisaku KANO , Shoichi SHIMAMURA , Kei MATSUEDA , Mineo KUBOTA , Hiromitsu TAMURA , Tsukasa KONDO
IPC分类号： G06K9/46
CPC分类号： B41F33/0036
摘要： A print inspecting apparatus which can perform print inspection flexibly at high precision at high speed without requiring a character recognizing processing is provided. The print inspecting apparatus 1 has a main unit 10 which reads images on a continuous business form conveyed in one direction, and a processing unit 30 which computes feature amounts from character information of characters which can be printed on a form by a system printer 70 and resolution information of the system printer 70, which are preliminarily inputted from a print server 60 to a correspondence dictionary between feature amounts and characters in advance, clips a character image from an image read by the main unit 10 to compute a feature amount of the clipped character, and utilizes correct solution information regarding a character string printed on the form by the printer 70, which is inputted from the print server 60 in advance, to determines a character to be inspected has been correctly printed on the form by the printer 70 when the feature amount of a clipped character is equal to or more than a determination reference value to the feature amount of the character whose correspondence relationship has been defined in the correspondence dictionary.
摘要翻译：提供能够以高精度灵活地执行打印检查而不需要字符识别处理的打印检查装置。打印检查装置1具有主单元10，其读取在一个方向上传送的连续商业形式的图像，以及处理单元30，其通过系统打印机70计算可以被打印在表单上的字符的字符信息的特征量;以及预先从打印服务器60向特征量和字符之间的对应字典预先输入的系统打印机70的分辨率信息从主单元10读取的图像中剪辑字符图像，以计算剪辑的特征量字符，并且利用由打印机70预先从打印服务器60输入的确定被检查的字符的打印机70打印在表格上的正确的解决方案信息已被打印机70正确地打印在打印机70上剪辑字符的特征量等于或大于对角色的特征量的确定参考值在对应字典中已经定义了e对应关系。

2. 发明授权

US06563709B2 Liquid-cooled heat sink and manufacturing method thereof 有权
公开(公告)号：US06563709B2
公开(公告)日：2003-05-13
申请号：US09907805
申请日：2001-07-19
申请人： Takeshi Negishi , Toshiyuki Nagase , Yoshiyuki Nagatomo , Shoichi Shimamura , Asao Tokiwa
发明人： Takeshi Negishi , Toshiyuki Nagase , Yoshiyuki Nagatomo , Shoichi Shimamura , Asao Tokiwa
IPC分类号： H05K720
CPC分类号： F28F3/025 , F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink is obtained that has high thermal conductivity as well as satisfactory moldability and corrosion resistance by using a malleable material made of aluminum or aluminum alloy. Liquid cooled heat sink 11 has a passage 23 in which coolant is able to pass, and is joined to a ceramic substrate. A plurality of through holes 12 extending from one end to the other end are formed by a plurality of dividing walls 13 through 15 in flat casing 12 of which both ends are open, and notches 16 are formed on one or both ends of the plurality of dividing walls. Corrugated fins 17 are respectively inserted into each of the plurality of through holes, and each through hole is demarcated into a plurality of slots 12b extending from one end to the other end of the casing by these fins. Both ends of the casing are closed by a pair of covers 18 and 19, and coolant inlet 18a and outlet 18b are formed in the covers. The above passage is formed by communication of the notches and slots, and the above inlet and outlet are positioned on both ends of the passage.

3. 发明授权

US06310775B1 Power module substrate 有权
标题翻译：电源模块基板
公开(公告)号：US06310775B1
公开(公告)日：2001-10-30
申请号：US09531489
申请日：2000-03-20
申请人： Yoshiyuki Nagatomo , Toshiyuki Nagase , Kazuaki Kubo , Shoichi Shimamura
发明人： Yoshiyuki Nagatomo , Toshiyuki Nagase , Kazuaki Kubo , Shoichi Shimamura
IPC分类号： H05K720
CPC分类号： H05K1/0271 , C04B2237/407 , H01L23/3735 , H01L2224/32225 , H05K1/0306 , H05K3/0061 , H05K2201/0355 , H05K2201/068 , Y10S428/901
摘要： The present invention for solving the problem of suppressing the load caused by heat stress applied on an insulation substrate, reducing the manufacturing coat of a power module substrate, and improving productivity provides a power module substrate in which a buffer layer having a surface area one to three times as large as the surface area of the insulation substrate is laminated and bonded between the insulation substrate and the heat sink, wherein the buffer layer is formed using a material having a thermal expansion coefficient between the thermal expansion coefficients of the insulation substrate and the heat sink, the insulation substrate being preferably formed using AlN, Si3N4 or Al2O3, the buffer layer being preferably formed using AlSiC, and a carbon plate or a composite material of AlC, besides the thickness of the buffer layer being preferably 1.5 to 50 times as large as the thickness of the insulation substrate, and the insulation substrate, the buffer layer and the heat sink being preferably laminated via a brazing foil by bonding.
摘要翻译：本发明解决了由施加在绝缘基板上的热应力引起的负载的抑制问题，降低功率模块基板的制造涂层以及提高生产率的本发明提供了一种功率模块用基板，其中，缓冲层的表面积为1〜将绝缘基板的表面积的3倍层叠并结合在绝缘基板和散热片之间，其中缓冲层使用具有绝热基板的热膨胀系数和散热器，优选使用AlN，Si 3 N 4或Al 2 O 3形成绝缘基板，缓冲层优选使用AlSiC形成，并且碳板或AlC的复合材料除了缓冲层的厚度之外优选为1.5〜50倍绝缘基板的厚度大，绝缘基板，缓冲层和热量大水槽优选通过粘合通过钎焊箔层压。

4. 发明授权

US07019975B2 Power module and power module with heat sink 有权
标题翻译：电源模块和电源模块带散热片
公开(公告)号：US07019975B2
公开(公告)日：2006-03-28
申请号：US10343857
申请日：2001-08-09
申请人： Yoshiyuki Nagatomo , Toshiyuki Nagase , Shoichi Shimamura
发明人： Yoshiyuki Nagatomo , Toshiyuki Nagase , Shoichi Shimamura
IPC分类号： H05K7/20
CPC分类号： H01L24/32 , C04B2237/407 , H01L23/3735 , H01L23/3736 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01058 , H01L2924/0132 , H01L2924/15787 , H01L2924/351 , H05K1/0306 , H05K3/0058 , Y10T428/12007 , H01L2924/01014 , H01L2924/00
摘要： The present invention relates to a power module in which an insulated circuit board is fixed to one main surface of a heat discharge plate. It is an object thereof to provide a power module in which the heat discharge characteristics are improved without any marked warping being generated, and that has an extended heat cycle longevity.In the power module 10 of the present invention, a square insulated circuit board 12 is fixed to one main surface of a heat discharge plate 11. The heat discharge plate 11 is formed of an Al based alloy plate having a thickness A of 3 to 10 mm, and the insulated circuit board 12 having a side B of 30 mm or less in length is brazed directly onto the heat discharge plate 11. It is-preferable that the brazing material used is one or two or more brazing materials selected from Al—Si, Al—Ge, Al—Cu, Al—Mg, and Al—Mn based brazing materials. It is also preferable that the insulated circuit board 12 is formed by a ceramic substrate 12a and Al plates 12b and 12c that are bonded to both surfaces thereof, and that the Al plate 12b has a purity of 99.98 or greater percent by weight.
摘要翻译：本发明涉及一种功率模块，其中绝缘电路板固定在放热板的一个主表面上。其目的在于提供一种功率模块，其中散热特性得到改善而没有产生任何明显的翘曲，并且具有延长的热循环寿命。在本发明的功率模块10中，将正方形绝缘电路基板12固定在散热板11的一个主面上。散热板11由厚度为3〜10mm的Al系合金板形成，并且具有长度为30mm以下的B侧的绝缘电路基板12直接钎焊在散热板11上。所使用的钎料优选为选自Al-Si，Al-Ge，Al-Cu，Al-Mg和Al-Mn基钎焊材料中的一种或两种以上钎焊材料。绝缘电路板12也优选由陶瓷基板12a和Al板12b和12c形成，并且Al板12b的纯度达到99.98或更高的百分比。重量。

5. 发明申请

US20070139703A1 PRINT INSPECTING APPARATUS 审中-公开
标题翻译：打印检查装置
公开(公告)号：US20070139703A1
公开(公告)日：2007-06-21
申请号：US11609301
申请日：2006-12-11
申请人： Shoichi SHIMAMURA , Keisaku KANO , Junichi TAKEMURA , Kei MATSUEDA , Mineo KUBOTA , Toru KITTA , Kouji OGINO , Makoto SHIMIZU , Hitoshi KOBAYASHI , Mitsugi UEDA
发明人： Shoichi SHIMAMURA , Keisaku KANO , Junichi TAKEMURA , Kei MATSUEDA , Mineo KUBOTA , Toru KITTA , Kouji OGINO , Makoto SHIMIZU , Hitoshi KOBAYASHI , Mitsugi UEDA
IPC分类号： G06K15/02 , G06F3/12
CPC分类号： G06K9/036 , B41F33/0036
摘要： A print inspecting apparatus which can perform print inspection flexibly at high precision while excluding influence due to individual differences among printers is provided. A print inspecting apparatus 1 prepares a dictionary defining correspondence relationship between character information of all characters which is preliminarily inputted from a print server 60 and can be printed on a continuous business form by a printer 70 and feature amounts of all characters which are printed on a continuous business form sheet by the printer 70 and are read by a main unit 10 and computed in a processing unit 30 and determines whether or not a feature amount of a character to be inspected which is read from the continuous business form and computed in the processing unit 30 is equal to or more than a determination reference value preliminarily set to the feature amount of the character whose correspondence relationship has been defined in the dictionary utilizing correct solution information regarding a character string preliminarily inputted from the print server 60 and printed on the continuous business form by the printer as index.
摘要翻译：提供一种能够以高精度进行打印检查的打印检查装置，同时排除由于打印机之间的个体差异造成的影响。打印检查装置1准备一个字典，其定义从打印服务器60预先输入的并且可以由打印机70以连续商业形式打印的所有字符的字符信息之间的对应关系，并且打印在所述字符的所有字符的特征量由打印机70连续业务表单，并由主单元10读取并在处理单元30中计算，并确定从连续业务表单读取并在处理中计算的要检查的字符的特征量是否单元30等于或大于预先设置为字符的特征量的确定基准值，该字符的字符对应关系已经在字典中使用关于从打印服务器60预先输入的字符串的正确解决方案信息并打印在连续的业务形式由打印机作为索引。

6. 发明授权

US06483185B1 Power module substrate, method of producing the same, and semiconductor device including the substrate 有权
标题翻译：功率模块用基板及其制造方法以及包含该基板的半导体装置
公开(公告)号：US06483185B1
公开(公告)日：2002-11-19
申请号：US09401410
申请日：1999-09-22
申请人： Toshiyuki Nagase , Yoshiyuki Nagatomo , Kazuaki Kubo , Shoichi Shimamura , Koichi Goshi
发明人： Toshiyuki Nagase , Yoshiyuki Nagatomo , Kazuaki Kubo , Shoichi Shimamura , Koichi Goshi
IPC分类号： H01L2348
CPC分类号： H01L23/4006 , H01L23/24 , H01L23/473 , H01L2023/4056 , H01L2023/4087 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A power module substrate includes a ceramic substrate having a circuit pattern formed thereon, and a metal frame with which the ceramic substrate can be joined to a water-cooling type heat sink. The metal frame has a thickness equal to that of the ceramic substrate or the ceramic substrate having the circuit pattern, and is provided with plural perforations formed therein. Metal thin sheets having through-holes in communication with the corresponding perforations, and containing contacting portions having the undersides thereof contacted to at least a part of the circumferential surface of the ceramic substrate are disposed on the surface of the metal frame. In a semiconductor device, a semiconductor element is mounted onto the circuit pattern, and the power module substrate is joined directly to the water-cooling type heat sink by inserting male screws through the through-holes and the perforations, and screwing the male screws in the female screws of the water-cooling type heat sink.
摘要翻译：功率模块基板包括其上形成有电路图案的陶瓷基板和可以将陶瓷基板与水冷式散热器接合的金属框架。金属框架的厚度等于具有电路图案的陶瓷基板或陶瓷基板的厚度，并且在其中形成有多个穿孔。具有与相应穿孔连通的通孔的金属薄片，并且包含其下侧的接触部分与陶瓷基板的周向表面的至少一部分接触的金属薄片设置在金属框架的表面上。在半导体装置中，将半导体元件安装在电路图案上，并且通过将外螺纹穿过通孔和穿孔将功率模块基板直接接合到水冷式散热器，并将外螺纹水冷式散热器的内螺纹。

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