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1. 发明申请

US20140120457A1 LAMINAR STRUCTURE AND A PRODUCTION METHOD FOR SAME 有权
标题翻译：层压结构及其生产方法
公开(公告)号：US20140120457A1
公开(公告)日：2014-05-01
申请号：US14124702
申请日：2012-06-08
申请人： Han Shin Choi , Hye Sook Joo
发明人： Han Shin Choi , Hye Sook Joo
IPC分类号： H01M4/88
CPC分类号： H01M4/8832 , H01M8/1004 , H01M2008/1095 , Y02E60/521 , Y02P70/56
摘要： The present invention relates to a laminar structure which is used in a microporous layer, an electrode layer or the like of a membrane electrode assembly for a fuel cell, and also relates to a production method for same. The laminar structure is a laminar structure which is comprised in the membrane electrode assembly (MEA) of a polymer electrolyte membrane fuel cell (PEMFC), and comprises an electrosprayed layer which is formed by the lamination of electrospraying ink, that has been charged by means of an electric field, through an electrospraying process in which the electrospraying ink is dispersed and sprayed as electrospraying liquid droplets, and, in the electrospraying process, the electrospraying substance transmission mode is set in accordance with the adjustment of electrospraying process variables. When the present invention is employed, an optimal substance transmission route is formed and three dimensional structure control is allowed through the electrospraying process and/or an inkjet printing process, and thus it is possible to simultaneously ensure economic advantages and durability when producing a laminated structure which is used in a microporous layer, an electrode layer, or the like of a membrane electrode assembly for a fuel cell.
摘要翻译：本发明涉及一种用于燃料电池用膜电极接合体的微孔层，电极层等的层叠结构体及其制造方法。层状结构是包含在聚合物电解质膜燃料电池（PEMFC）的膜电极组件（MEA）中的层状结构，并且包括通过层压电喷雾油墨而形成的电喷雾层，其通过装置通过电喷雾处理，其中电喷雾油墨作为电喷雾液滴分散和喷雾，并且在电喷雾过程中，电喷雾物质传输模式根据电喷雾过程变量的调整而设定。当采用本发明时，形成最佳的物质传输路径，并且通过电喷雾处理和/或喷墨印刷工艺可以进行三维结构控制，从而可以在制造层压结构时同时确保经济优点和耐久性其用于燃料电池的膜电极组件的微孔层，电极层等中。

2. 发明申请

US20120021277A1 Rechargeable battery 有权
标题翻译：可充电电池
公开(公告)号：US20120021277A1
公开(公告)日：2012-01-26
申请号：US12929035
申请日：2010-12-23
申请人： Sang-Won Byun , Jeong-Won Oh , Sang-Shin Choi , Jae-Wook Lee , Yong-Hae Kang
发明人： Sang-Won Byun , Jeong-Won Oh , Sang-Shin Choi , Jae-Wook Lee , Yong-Hae Kang
IPC分类号： H01M2/30
CPC分类号： H01M2/1061 , H01M2/0469 , H01M2/30 , H01M10/0585
摘要： A rechargeable battery including an electrode assembly, the electrode assembly including a separator interposed between a first electrode and a second electrode; a case, the case accommodating the electrode assembly; a cap plate, the cap plate sealing an opening at one end of the case; and electrode terminals, the electrode terminals being electrically connected to the electrode assembly, wherein at least one of the electrode terminals is integrally formed with the cap plate.
摘要翻译：一种包括电极组件的可再充电电池，所述电极组件包括插入在第一电极和第二电极之间的隔板; 壳体，容纳电极组件的壳体; 盖板，盖板在壳体的一端密封开口; 和电极端子，电极端子电连接到电极组件，其中至少一个电极端子与盖板一体地形成。

3. 发明申请

US20110003148A1 PROCESS FOR PRODUCING CELLULOSE MULTI-FILAMENT WITH LOWER COEFFICIENT OF VARIATION OF SECTION DIAMETER 审中-公开
标题翻译：用于生产具有较小系数变化的纤维素多层纤维的方法
公开(公告)号：US20110003148A1
公开(公告)日：2011-01-06
申请号：US12521362
申请日：2007-12-10
申请人： Tae Jung Lee , Jae Shin Choi , Byoung Min Lee
发明人： Tae Jung Lee , Jae Shin Choi , Byoung Min Lee
IPC分类号： D02G3/48 , D01D5/38
CPC分类号： D01F2/00 , Y10T428/2913
摘要： The present invention relates to a cellulose fiber having a highly homogeneous section, particularly to a cellulose fiber with lower Coefficient of Variation of section diameter (CV(%)). Specifically, the present invention relates to a cellulose fiber wherein Coefficient of Variation of section diameter (CV(%)) of a mono-filament constituting a multi-filament prepared by dissolving a cellulose powder in liquid N-methylmorpholine N-oxide (hereinafter referred to “NMMO”) is below 2.5. According to the present invention, a lyocell multi-filament is produced comprising the steps of (i) preparing a spinning solution by homogeneously dispersing, swelling and dissolving cellulose powder in a NMMO solution; (ii) spinning the spinning solution into an air gap through a spinning nozzle; and (iii) coagulating the extruded-spun spinning solution in a coagulation bath. In particular, the coagulating step is adjusted by means of a coagulation coefficient in the range of 0.8 to 1.3 and the coagulation coefficient is expressed as TD/TC, TD=TD+TA 90 and TD TA and Tc mean the temperature of a spinning solution, the temperature of cooling air applied in an air gap and the temperature of a coagulation bath, respectively.
摘要翻译：本发明涉及具有高度均匀截面的纤维素纤维，特别涉及具有较低的截面直径变化系数（CV（％））的纤维素纤维。具体地说，本发明涉及一种纤维素纤维，其中纤维素粉末溶解在液体N-甲基吗啉N-氧化物（以下简称为）中制成的构成多丝的单丝的截面直径变化系数（CV（％））到“NMMO”）低于2.5。根据本发明，制备了莱赛尔复丝，其包括以下步骤：（i）通过将纤维素粉末均匀分散，溶胀和溶解在NMMO溶液中制备纺丝溶液; （ii）通过纺丝喷嘴将纺丝溶液纺丝到气隙中; 和（iii）在凝固浴中使挤出纺丝的纺丝溶液凝结。特别地，通过凝固系数在0.8〜1.3的范围内调整凝固步骤，凝固系数表示为TD / TC，TD = TD + TA 90，TD TA和Tc表示纺丝溶液的温度，分别在空气间隙中施加的冷却空气的温度和凝固浴的温度。

4. 发明申请

US20090141275A1 ALIGNMENT INSPECTION METHOD AND ALIGNMENT INSPECTION APPARATUS 审中-公开
标题翻译：对准检查方法和对齐检查装置
公开(公告)号：US20090141275A1
公开(公告)日：2009-06-04
申请号：US12327066
申请日：2008-12-03
申请人： Il-Young HAN , Mitsuo Umemoto , Ki-Kwon Jeong , Young-shin Choi
发明人： Il-Young HAN , Mitsuo Umemoto , Ki-Kwon Jeong , Young-shin Choi
IPC分类号： G01B11/00 , B32B37/12
CPC分类号： G01B11/272 , B32B37/06 , B32B37/1018 , B32B38/1841 , B32B41/00 , B32B2310/028 , B32B2457/08
摘要： A method of inspecting the alignment of a second structure with respect to a first structure, including emitting light from a first plane of a first structure to a second plane of a second structure in a first direction perpendicular to the first plane of the first structure, the first plane and the second plane facing each other. The incident light can be reflected from the second plane toward the first plane in a second direction parallel with the first direction. The position of the reflected light can be detected to inspect the alignment of the second structure with respect to the first structure.
摘要翻译：一种检查第二结构相对于第一结构的对准的方法，包括在垂直于第一结构的第一平面的第一方向上将光从第一结构的第一平面发射到第二结构的第二平面，第一平面和第二平面彼此面对。入射光可以在与第一方向平行的第二方向上从第二平面朝向第一平面反射。可以检测反射光的位置，以检查第二结构相对于第一结构的对准。

5. 发明申请

US20080122081A1 Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same 审中-公开
标题翻译：具有牺牲阳极的电子器件的制造方法及其制造的电子器件
公开(公告)号：US20080122081A1
公开(公告)日：2008-05-29
申请号：US11902260
申请日：2007-09-20
申请人： Young-Lyong Kim , Young-Shin Choi , Jong-Gi Lee , Kun-Dae Yeom , Eun-Chul Ahn
发明人： Young-Lyong Kim , Young-Shin Choi , Jong-Gi Lee , Kun-Dae Yeom , Eun-Chul Ahn
IPC分类号： H01L23/488 , H01L21/44
CPC分类号： H05K1/02 , H01L23/498 , H01L24/02 , H01L24/03 , H01L24/11 , H01L2224/03 , H01L2224/0401 , H01L2224/11009 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H05K1/09 , H05K3/0052 , H05K3/243 , H05K3/4007 , H05K2201/0391 , H05K2201/09781 , H05K2203/0315 , H05K2203/175
摘要： According to an example embodiment, a method of fabricating an electronic device may include preparing a substrate with a first area and a second area. A metal interconnection may be formed on the substrate extending from the first area to the second area. An insulating layer may be formed on the substrate. A sacrificial pattern electrically connected to the metal interconnection and serving as a sacrificial anode for cathodic protection against corrosion of the metal interconnection may be formed on the second area. An opening to expose the metal interconnection on the first area may be formed by patterning the insulating layer. An electronic device fabricated by a method according to an example embodiment may include a substrate, a metal interconnection, an insulating layer, and/or a sacrificial pattern.
摘要翻译：根据示例性实施例，制造电子设备的方法可以包括制备具有第一区域和第二区域的基板。可以在从第一区域延伸到第二区域的基板上形成金属互连。可以在基板上形成绝缘层。电连接到金属互连并用作用于阴极保护以防止金属互连的腐蚀的牺牲阳极的牺牲图案可以形成在第二区域上。可以通过图案化绝缘层来形成用于暴露第一区域上的金属互连的开口。通过根据示例实施例的方法制造的电子器件可以包括衬底，金属互连，绝缘层和/或牺牲图案。

6. 发明申请

US20070160907A1 Electrode comprising lithium nickel oxide layer, method for preparing the same, and electrochromic device comprising the same 有权
标题翻译：包含锂镍氧化物层的电极，其制备方法和包含该电极的电致变色器件
公开(公告)号：US20070160907A1
公开(公告)日：2007-07-12
申请号：US11650992
申请日：2007-01-09
申请人： Ki Jang , Jae Park , Jae Oh , Jin Park , Shin Choi , Won Kwon , Byoung Lee
发明人： Ki Jang , Jae Park , Jae Oh , Jin Park , Shin Choi , Won Kwon , Byoung Lee
IPC分类号： H01M4/52 , H01M4/02 , G02F1/15
CPC分类号： G02F1/155 , G02F1/1523 , H01M4/131 , H01M4/1391 , H01M4/525
摘要： The present invention provides A method for preparing an electrode containing lithium nickel oxide wherein nickel has a single oxidation number, which comprises the following steps: a) preparing an electrode containing the lithium nickel oxide (LixNi1-yO, 0.4
摘要翻译：本发明提供一种制备含有镍氧化镍的电极的方法，其中镍具有单一氧化数，其包括以下步骤：a）制备含有锂镍氧化物（Li x Ni）在导电基板上形成的1 O，0.4

7. 发明申请

US20070137279A1 Transferring device 审中-公开
标题翻译：传输设备
公开(公告)号：US20070137279A1
公开(公告)日：2007-06-21
申请号：US11603119
申请日：2006-11-22
申请人： Geun-seok Jang , Jae-shin Choi , Jae-rack Choi , Hyo-gyu Kim , Joong-nam Kwon , Tea-jun Sang
发明人： Geun-seok Jang , Jae-shin Choi , Jae-rack Choi , Hyo-gyu Kim , Joong-nam Kwon , Tea-jun Sang
IPC分类号： B21J11/00
CPC分类号： H01L21/67742 , H01L21/68707
摘要： A transferring device including a transferring device main body; a transferring arm which is coupled with the transferring device main body to transfer a workpiece; and a supporting hand which has a plurality of engaging parts coupled with the transferring arm and forming a predetermined angle therebetween to support the workpiece based on a force applied to the workpiece according to varying rotation speeds of the transferring arm. Thus, a transferring device can stably support a workpiece.
摘要翻译：一种转印装置，包括转印装置主体; 传送臂，其与传送装置主体联接以传送工件; 以及支撑手，其具有与所述传送臂联接的多个接合部，并且在根据所述传送臂的变化的转速基于施加到所述工件的力而在其间形成预定角度来支撑所述工件。因此，转印装置可以稳定地支撑工件。

8. 发明申请

US20060078965A1 Chinese hamster ovary cell line transfected with 30K gene 审中-公开
标题翻译：中国仓鼠卵巢细胞系用30K基因转染
公开(公告)号：US20060078965A1
公开(公告)日：2006-04-13
申请号：US10963770
申请日：2004-10-14
申请人： Tai Park , Shin Choi
发明人： Tai Park , Shin Choi
IPC分类号： C12N5/06 , C12P21/06
CPC分类号： C07K14/505 , C07K14/43586 , C12N2510/02
摘要： The present invention relates to a CHO (Chinese hamster ovary) cell line transfected with 30 K gene. More particularly, the present invention is directed to a CHO cell line transfected with 30 K genes obtained from the silkworm Bombyx Mori, which has anti-apoptotic property.
摘要翻译：本发明涉及用30K基因转染的CHO（中国仓鼠卵巢）细胞系。更具体地，本发明涉及由具有抗凋亡特性的家蚕家蚕获得的30K基因转染的CHO细胞系。

9. 发明授权

US06969906B2 Multi-chip package and method for manufacturing the same 失效
标题翻译：多芯片封装及其制造方法
公开(公告)号：US06969906B2
公开(公告)日：2005-11-29
申请号：US10787499
申请日：2004-02-26
申请人： Shin Choi
发明人： Shin Choi
IPC分类号： H01L23/12 , H01L21/50 , H01L23/02 , H01L23/48 , H01L23/492 , H01L23/538 , H01L25/00 , H01L25/065
CPC分类号： H01L25/065 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2225/06517 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are a multi-chip package and a method for manufacturing the multi-chip package. The multi-chip package comprises: a circuit substrate consisting of first, second and third areas which surround three sides of the multi-chip package; and at least two semiconductor chips which are positioned within an internal space of the package defined by the internal surfaces of the above three areas, wherein the semiconductor chips are physically bonded and electrically connected to each other. The method for manufacturing a multi-chip package comprises the steps of: providing a circuit substrate matrix formed with a plurality of unit circuit substrates, each substrate consisting of first, second and third areas; bonding semiconductor chips each unit circuit substrate, so that those chips are physically bonded and electrically connected to the unit circuit substrate; separating unit circuit substrates from the circuit substrate matrix; and folding the unit circuit substrate.
摘要翻译：公开了一种多芯片封装以及用于制造多芯片封装的方法。所述多芯片封装包括：由围绕所述多芯片封装的三边的第一，第二和第三区域构成的电路基板; 以及位于由上述三个区域的内表面限定的封装的内部空间内的至少两个半导体芯片，其中半导体芯片物理地结合并彼此电连接。制造多芯片封装的方法包括以下步骤：提供形成有多个单位电路基板的电路基板矩阵，每个基板由第一，第二和第三区域组成; 将每个单位电路基板的半导体芯片接合，使得那些芯片物理结合并电连接到单位电路基板; 将电路基板与电路基板分离; 并折叠单元电路基板。

10. 发明授权

US06724090B2 Multi-chip package and method for manufacturing the same 失效
标题翻译：多芯片封装及其制造方法
公开(公告)号：US06724090B2
公开(公告)日：2004-04-20
申请号：US10338202
申请日：2003-01-08
申请人： Shin Choi
发明人： Shin Choi
IPC分类号： H01L2348
CPC分类号： H01L25/065 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2225/06517 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are a multi-chip package and a method for manufacturing the multi-chip package. The multi-chip package comprises: a circuit substrate consisting of first, second and third areas which surround three sides of the multi-chip package; and at least two semiconductor chips which are positioned within an internal space of the package defined by the internal surfaces of the above three areas, wherein the semiconductor chips are physically bonded and electrically connected to each other. The method for manufacturing a multi-chip package comprises the steps of: providing a circuit substrate matrix formed with a plurality of unit circuit substrates, each substrate consisting of first, second and third areas; bonding semiconductor chips each unit circuit substrate, so that those chips are physically bonded and electrically connected to the unit circuit substrate; separating unit circuit substrates from the circuit substrate matrix; and folding the unit circuit substrate.
摘要翻译：公开了一种多芯片封装以及用于制造多芯片封装的方法。多芯片封装包括：由围绕多芯片封装的三边的第一，第二和第三区域组成的电路基板; 以及位于由上述三个区域的内表面限定的封装的内部空间内的至少两个半导体芯片，其中半导体芯片物理地结合并彼此电连接。制造多芯片封装的方法包括以下步骤：提供形成有多个单位电路基板的电路基板矩阵，每个基板由第一，第二和第三区域组成; 将每个单位电路基板的半导体芯片接合，使得那些芯片物理结合并电连接到单位电路基板; 将电路基板与电路基板分离; 并折叠单元电路基板。

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