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    • 3. 发明授权
    • Static semiconductor memory device allowing simultaneous writing of data into a plurality of memory cells
    • 静态半导体存储器件允许将数据同时写入到多个存储器单元中
    • US07505339B2
    • 2009-03-17
    • US11451312
    • 2006-06-13
    • Shigeki Ohbayashi
    • Shigeki Ohbayashi
    • G11C29/00G11C7/00
    • G11C11/413
    • A supply instruction signal attains the H-level before data is written into a plurality of memory cells. A P-channel MOS transistor is arranged between a power supply node and an input node. The P-channel MOS transistor is turned off to open the input node according to the supply instruction signal. In this case, a write driver discharges electric charges accumulated on the input node and electric charges accumulated on a bit line pair. However, a through-current does not flow from the power supply node to a ground node so that flow of the through-current to a CMOS inverter circuit forming each memory cell can be prevented. Accordingly, such a static semiconductor memory device can be provided that can prevent the flow of the through-current to the CMOS inverter circuit forming each memory cell when simultaneously writing data into the plurality of memory cells.
    • 在将数据写入多个存储单元之前,供给指令信号达到H电平。 P沟道MOS晶体管布置在电源节点和输入节点之间。 P沟道MOS晶体管关断,根据供电指示信号打开输入节点。 在这种情况下,写入驱动器对累积在输入节点上的电荷和积累在位线对上的电荷进行放电。 然而,贯通电流不会从电源节点流向接地节点,从而可以防止通过电流流向形成每个存储单元的CMOS反相器电路。 因此,可以提供这样的静态半导体存储器件,当同时将数据写入到多个存储单元中时,可以防止形成每个存储单元的CMOS反相器电路的通流流动。
    • 4. 发明授权
    • Power on reset circuit
    • 上电复位电路
    • US06710634B2
    • 2004-03-23
    • US10406312
    • 2003-04-04
    • Shigeki OhbayashiTadayuki Shimizu
    • Shigeki OhbayashiTadayuki Shimizu
    • H03L700
    • H03K3/356008H03K17/223
    • In a power on reset (POR) circuit, when power is turned on, an output signal of an inverter attains an H level and an N channel MOS transistor is rendered conductive. The potential of an input node of the inverter becomes a potential of a power supply voltage divided by a conductive resistance value R1 of a P channel MOS transistor and a conductive resistance value R2 of an N channel MOS transistor. Assuming that the threshold voltage of the inverter is 0.8 V and R1:R2=2:3, then the power supply voltage Vres at the time when signal POR# inverts its level becomes 1.33 V. Thus, this POR circuit can reliably be utilized even in a product designed to operate with 1.5 V incorporating a MOS transistor having a threshold voltage of 0.8 V.
    • 在上电复位(POR)电路中,当电源接通时,反相器的输出信号达到H电平,并且N沟道MOS晶体管导通。 逆变器的输入节点的电位变为电源电压除以P沟道MOS晶体管的导电电阻值R1和N沟道MOS晶体管的导电电阻值R2的电位。 假设逆变器的阈值电压为0.8V,R1:R2 = 2:3,则信号POR#反相时的电源电压Vres为1.33V。因此,该POR电路可以可靠地利用 在设计为使用具有阈值电压为0.8V的MOS晶体管的1.5V工作的产品中。
    • 7. 发明授权
    • Static type semiconductor memory device adopting a redundancy system
    • 采用冗余系统的静态半导体存储器件
    • US06373760B1
    • 2002-04-16
    • US09846197
    • 2001-05-02
    • Shigeki Ohbayashi
    • Shigeki Ohbayashi
    • G11C700
    • G11C29/785
    • This SRAM includes a P-channel MOS transistor which is provided corresponding to each row and connected between one end of the memory cell power source line of the corresponding row and the line of the power source potential and which has a comparatively high conduction resistance value, and a program circuit that lets the P-channel MOS transistor become electrically non-conducted when a fuse is cut. Therefore, electric currents are prevented from flowing to a short-circuited part of the defective memory cell MC, and the leakage electric current can be restrained to a small value even if a latch-up phenomenon is generated.
    • 该SRAM包括对应于每行并连接在相应行的存储单元电源线的一端和电源电位线之间并具有较高导通电阻值的P沟道MOS晶体管, 以及当熔断体被切断时使P沟道MOS晶体管变得非导通的程序电路。 因此,防止电流流向故障存储单元MC的短路部分,即使产生闭锁现象,也可以将泄漏电流抑制在较小的值。
    • 9. 发明授权
    • Semiconductor memory device with two layers of bit lines
    • 具有两层位线的半导体存储器件
    • US06295222B2
    • 2001-09-25
    • US09769385
    • 2001-01-26
    • Yoshiko HigashideShigeki Ohbayashi
    • Yoshiko HigashideShigeki Ohbayashi
    • G11C506
    • G11C5/063G11C7/18
    • A semiconductor memory device according to the present invention comprises, in general, a memory cell array, a plurality of first-layer and second-layer bit lines. The memory cell array includes a matrix of memory cells arranged along a line and row directions, each memory cell being formed within a memory cell region. Each of first-layer bit lines is extending along the row direction, and provided on a plurality of the memory cell regions. Each of second-layer bit lines is connected with the first-layer bit line via a connecting hole. The memory cell regions include first and second memory cell regions, the first memory cell region is provided with the connecting hole, the second memory cell region is not provided with the connecting hole. Also, at least one of the memory cells formed within the first memory cell regions is a dummy cell incapable of electrically serving as the normal memory cell.
    • 根据本发明的半导体存储器件通常包括存储单元阵列,多个第一层和第二层位线。 存储单元阵列包括沿行和行方向布置的存储单元的矩阵,每个存储单元形成在存储单元区域内。 每个第一层位线沿着行方向延伸,并且设置在多个存储单元区域上。 每个第二层位线经由连接孔与第一层位线连接。 存储单元区域包括第一和第二存储单元区域,第一存储单元区域设置有连接孔,第二存储单元区域不具有连接孔。 此外,形成在第一存储单元区域内的至少一个存储单元是不能用作正常存储单元的虚拟单元。