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1. 发明申请

US20140356231A1 Automated KleenSan System 审中-公开
标题翻译：自动KleenSan系统
公开(公告)号：US20140356231A1
公开(公告)日：2014-12-04
申请号：US14293801
申请日：2014-06-02
申请人： Emilia Rico-Munoz , Shawn A. Johnson
发明人： Emilia Rico-Munoz , Shawn A. Johnson
IPC分类号： A61L2/18 , A61L2/02
CPC分类号： A61L2/18 , A61L2/02 , A61L2/22 , A61L2202/23 , A61L2209/213
摘要： Systems and processes to dispense, clean and sanitize the key exposure points in the filling process to reduce risk of mold, yeast, or bacteria product spoilage, with minimal downtime. In some embodiments, a process uses a chemical solution that includes a liquid including potable water or another liquid—such as paramagnetic water, ultrapure water, R.O. water or any other kind of modified water—and a biocide solution such as sodium hypochlorite, stabilized chlorine dioxide, etc. at concentrations between 0.5 and 200 ppm or any of the components of electrochemical activated (EAC) water. In some embodiments, the water has a low enough chemical concentration to allow application without a follow-up rinse. The high ORP water at high pressure and flow removes the statically charged particles, preventing micro growth in between sprays, and effectively cleaning and sanitizing in a single step.
摘要翻译：系统和流程在灌装过程中分配，清洁和消毒关键暴露点，以减少模具，酵母或细菌产品腐败的风险，同时减少停机时间。在一些实施方案中，方法使用包括液体的化学溶液，所述液体包括饮用水或另一种液体，例如顺磁性水，超纯水，R.O. 水或任何其他类型的改性水和杀生物剂溶液如次氯酸钠，稳定二氧化氯等，浓度为0.5-200ppm之间或电化学活化（EAC）水的任何组分。在一些实施方案中，水具有足够低的化学浓度以允许施用而不进行后续冲洗。高压和高流量的高ORP水除去静电荷颗粒，防止喷雾之间的微生长，并在一个步骤中有效地清洗和消毒。

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