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1. 发明申请

US20070202321A1 Thermally conductive microporous coating 审中-公开
标题翻译：导热微孔涂层
公开(公告)号：US20070202321A1
公开(公告)日：2007-08-30
申请号：US11272332
申请日：2005-11-09
申请人： Seung Mun You , Joo Han Kim
发明人： Seung Mun You , Joo Han Kim
IPC分类号： B32B5/16
CPC分类号： C23C30/00 , B05D5/02 , C23C24/08 , C23C26/00 , F28F13/187 , Y10T428/256
摘要： A microporous surface is created using particles of various sizes in conjunction with a thermally conductive binder. Advantages to a mixture batch type application of the coating include that it is an inexpensive and easy process which does not require extremely high operating temperatures. The disclosed coating technique is efficient for various types of working liquids simply by changing the size of metal particle sizes since different surface tension of liquids requires different size range of porous cavities to optimize boiling heat transfer performance. In one embodiment, the coating is applied to an electronic component surface.
摘要翻译：使用与导热粘合剂结合的各种尺寸的颗粒产生微孔表面。对涂料的混合批式施加的优点包括它是不需要极高操作温度的便宜且容易的方法。所公开的涂覆技术对于各种类型的工作液体来说是有效的，简单地通过改变金属粒度的大小，因为液体的不同表面张力需要不同尺寸范围的多孔腔以优化沸腾传热性能。在一个实施例中，将涂层施加到电子部件表面。

2. 发明授权

US06343647B2 Thermal joint and method of use 失效
标题翻译：热接头和使用方法
公开(公告)号：US06343647B2
公开(公告)日：2002-02-05
申请号：US09481194
申请日：2000-01-11
申请人： Choong-Un Kim , Seung-Mun You
发明人： Choong-Un Kim , Seung-Mun You
IPC分类号： F28F700
CPC分类号： B23K35/26 , F28F2013/006 , H01L23/3736 , H01L23/3738 , H01L2924/0002 , H01L2924/3011 , Y10T428/1419 , Y10T428/1452 , H01L2924/00
摘要： A thermal joint for facilitating heat transfer between two components is described. The thermal joint is formed from an alloy of at least two constituents. The alloy has a liquid temperature and a solid temperature. When the operating temperature falls between the liquid temperature and the solid temperature, the alloy has at least one liquid phase which is in substantial equilibrium with at least one solid phase. The thermal joint is used between a heat-generating component, such as a semiconducting device, and a heat-dissipating component, such as a heat sink. Such thermal joint substantially reduces the thermal resistance between the two components.
摘要翻译：描述了一种用于促进两个部件之间的热传递的热接头。热接头由至少两种组分的合金形成。该合金具有液体温度和固体温度。当操作温度在液体温度和固体温度之间时，合金具有至少一个与至少一个固相基本平衡的液相。热接头用于诸如半导体器件的发热部件和散热部件之类的散热部件。这种热接头显着地降低了两个部件之间的热阻。

3. 发明授权

US5814392A Boiling enhancement coating 失效
标题翻译：沸腾增强涂层
公开(公告)号：US5814392A
公开(公告)日：1998-09-29
申请号：US716227
申请日：1996-12-02
申请人： Seung Mun You , John P. O'Connor
发明人： Seung Mun You , John P. O'Connor
IPC分类号： B05D5/02 , C09D7/00 , F28F13/18 , B32B15/08 , C08K3/00
CPC分类号： F28F13/187 , B05D5/02 , C09D7/00 , Y10T428/24917 , Y10T428/31511
摘要： A coating composition comprising a glue, a particulate material and a solvent, which imparts a surface microstructure to a coated object (29) is disclosed. The particulate material projects above the glue line (28) of the coated object creating the microstructure which provides boiling heat transfer enhancement. A horizontally oriented, rectangular surface immersed in FC-72, indicates up to an 85% decrease in incipient superheat, a 70% to 80% reduction in nucleate boiling superheats, and a .about.109% increase in the critical heat flux (CHF), beyond that of the non-painted surface. The enhanced surface heat transfer coefficients are four to nine times higher than those from the reference surface. The coatings are applicable to electronic component surfaces. A coated silicon test chip tested at subcooled (45.degree. C. conditions using FC-72 had heat dissipation rates of .about.100 W/cm.sup.2 at junction temperatures of .about.85.degree. C., and the highest CHF observed was 159 W/cm.sup.2, 224% higher than that from the untreated chip surface at saturated conditions.
摘要翻译： PCT No.PCT / US95 / 03607 Sec。 371日期1996年12月2日第 102（e）日期1996年12月2日PCT 1995年3月21日PCT PCT。 WO95 / 25603 PCT出版物日期1995年9月28日公开了一种涂覆组合物，其包含赋予涂覆物体（29）的表面微结构的胶，颗粒材料和溶剂。颗粒材料在涂覆物体的胶合线（28）上方突出，产生提供沸腾传热增强的微结构。浸入FC-72中的水平取向的矩形表面表明初始过热度降低了85％，核沸腾过热度降低了70％至80％，临界热通量（CHF）的差异增加了109％超过非油漆表面。增强的表面传热系数比参考表面高出四到九倍。涂层适用于电子元件表面。在过冷（使用FC-72的45℃条件下）测试的涂覆硅测试芯片在85℃的结温下的散热率为DIFFERENCE 100W / cm 2，观察到的最高CHF为159W / cm 2，224 在饱和条件下高于未处理芯片表面的百分比。

4. 发明申请

US20130020053A1 LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING 审中-公开
标题翻译：使用沸腾的低型热膨胀液体室
公开(公告)号：US20130020053A1
公开(公告)日：2013-01-24
申请号：US13489697
申请日：2012-06-06
申请人： Seung Mun You , Joo Han Kim , Sang M. Kwark , Jesse Jaejin Kim
发明人： Seung Mun You , Joo Han Kim , Sang M. Kwark , Jesse Jaejin Kim
IPC分类号： F28D15/02 , F28F13/18
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.
摘要翻译：公开了散热器来冷却器件的系统和制造方法。散热器具有限定其中具有液体的腔室的第一和第二相对的近侧表面; 以及一个或多个结构，其安装在腔室中以在液体沸腾期间引起液体流动图案以分配热量。

5. 发明申请

US20080236795A1 LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING 审中-公开
标题翻译：使用沸腾的低型热膨胀液体室
公开(公告)号：US20080236795A1
公开(公告)日：2008-10-02
申请号：US11690937
申请日：2007-03-26
申请人： Seung Mun You , Joo Han Kim , Sang M. Kwark , Jesse Jaejin Kim
发明人： Seung Mun You , Joo Han Kim , Sang M. Kwark , Jesse Jaejin Kim
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.
摘要翻译：公开了散热器来冷却器件的系统和制造方法。散热器具有限定其中具有液体的腔室的第一和第二相对的近侧表面; 以及一个或多个结构，其安装在腔室中以在液体沸腾期间引起液体流动图案以分配热量。

6. 发明申请

US20070230128A1 Cooling apparatus with surface enhancement boiling heat transfer 审中-公开
标题翻译：具有表面增强沸腾传热的冷却装置
公开(公告)号：US20070230128A1
公开(公告)日：2007-10-04
申请号：US11398197
申请日：2006-04-04
申请人： Jesse Kim , Seung Mun You
发明人： Jesse Kim , Seung Mun You
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/02 , F28D15/046 , F28F13/187 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus boiling and condensing liquid coolant has a vessel including a microporous surface enhancement coating applied on a thermally-conductive plate which is fully immersed under the liquid coolant in the vessel. The surface enhancement coating augments significantly a nucleate boiling heat transfer and critical heat flux when receiving heat from a heating object coupled to the thermally-conductive plate at a surface outside of the vessel. One embodiment of this invention including a vessel with a height/length dimension less than 300 mm, a microporous coating with nickel particles of 30-50 μm in size bonded by a thermally-conductive binder, and water as the liquid coolant, without complicated radiator component, is used for cooling a heating electronics element.
摘要翻译：沸腾和冷凝液体冷却剂的冷却装置具有包括施加在导热板上的微孔表面增强涂层的容器，该导热板完全浸没在容器内的液体冷却剂下。表面增强涂层在从容器外表面上连接到导热板的加热物体接收热量时显着增加了核沸腾热传递和临界热通量。本发明的一个实施例包括高度/长度尺寸小于300mm的容器，具有30-50μm的镍颗粒的微孔涂层，其尺寸通过导热粘合剂粘合，而水作为液体冷却剂，而没有复杂的散热器组件，用于冷却加热电子元件。

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