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    • 1. 发明授权
    • Device and method for measuring dynamic thermal conductivity of micro-structure fluid
    • 用于测量微结构流体动态热导率的装置和方法
    • US09304093B2
    • 2016-04-05
    • US13814079
    • 2011-08-12
    • Wook-Hyun LeeSeong-Ryong ParkChong-Youp KimSeok-Won Kim
    • Wook-Hyun LeeSeong-Ryong ParkChong-Youp KimSeok-Won Kim
    • G01N25/18
    • G01N25/18
    • A device and method for measuring dynamic thermal conductivity of micro-structure fluid. The device includes an upper fixing plate (110a) and a lower fixing plate (110b) which are vertically spaced apart from each other, a lower body (150b) which defines a side surface of a separation space formed between the upper fixing plate and the lower fixing plate, a rotating plate (120) which is disposed in the separation space in such a way that gaps are respectively formed among the rotating plate and the upper and lower fixing plates, a shaft (140) which passes through the upper fixing plate and is coupled to the rotating plate, a heater which installed on an upper portion of the upper fixing plate, and thermocouples (118a) and (118b) which are respectively installed in the upper and lower fixing plates.
    • 用于测量微结构流体的动态热导率的装置和方法。 该装置包括彼此垂直间隔开的上固定板(110a)和下固定板(110b),下主体(150b)限定形成在上固定板和上固定板之间的分隔空间的侧表面 下固定板,旋转板(120),其设置在分离空间中,使得在旋转板和上下固定板之间分别形成有间隙;轴(140),其穿过上固定板 并且连接到旋转板,安装在上固定板的上部的加热器和分别安装在上固定板和下固定板中的热电偶(118a)和(118b)。