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1. 发明授权

US4888269A Resin composition for solder resist ink 失效
标题翻译：阻焊油墨用树脂组合物
公开(公告)号：US4888269A
公开(公告)日：1989-12-19
申请号：US231606
申请日：1988-08-11
申请人： Yoneji Sato , Masato Hoshino , Seiichi Kitazawa , Tadashi Yasuda
发明人： Yoneji Sato , Masato Hoshino , Seiichi Kitazawa , Tadashi Yasuda
IPC分类号： B23K35/22 , G03F7/032 , H05K3/28
CPC分类号： G03F7/032 , B23K35/224 , H05K3/287 , H05K2203/0783
摘要： A resin composition for use in a solder resist ink, said composition comprising as essential ingredients(A) an epoxy vinyl ester resin solution obtained by dissolving (A-a) an epoxy vinyl ester resin obtained by reacting a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin with 0.40 to 0.85 mol, per epoxy group of the epoxy resin, of an unsaturated monobasic acid in (A-b) an organic and/or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds,(B) a photopolymerization initiator, and(C) a curing agent of an amino group and/or imino group-containing epoxy resin.
摘要翻译：一种用于阻焊油墨的树脂组合物，所述组合物包含作为（A）环氧乙烯基酯树脂溶液的必要成分（A），其通过将（Aa）通过使苯酚酚醛清漆型环氧树脂反应获得的环氧乙烯基酯树脂和/或（Ab）有机和/或（Ac）至少一种可光聚合的多官能乙烯基单体的不饱和一元酸的环氧树脂为0.40〜0.85摩尔的甲酚酚醛清漆型环氧树脂，其选自：三官能以上聚氧亚烷基二醇聚（甲基）丙烯酸酯，聚氧乙烯异氰脲酸酯的聚（甲基）丙烯酸酯和缩醛化合物的聚（甲基）丙烯酸酯，（B）光聚合引发剂，和（C）氨基和/或含亚氨基的环氧树脂。

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