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1. 发明授权

US07995100B2 Apparatus for controlling specific function and camera module having the same 有权
标题翻译：用于控制特定功能的装置和具有该功能的相机模块
公开(公告)号：US07995100B2
公开(公告)日：2011-08-09
申请号：US11174747
申请日：2005-07-05
申请人： Se-hoon Cho
发明人： Se-hoon Cho
IPC分类号： H04N5/232
CPC分类号： H04M1/72577 , H04M1/7253 , H04M2250/52
摘要： An apparatus controlling a specific function is provided. The specific function controlling apparatus includes a signal generator and a recognizer. The signal generator transmits and receives a first signal of a specific frequency. The recognizer is installed in a specific function module having a specific function device for executing a specific function. The specific function module is installed in an electronic equipment. The recognizer includes an antenna part and a control part. The antenna part is responsive to the specific frequency of the signal generator. The control part is electrically connected to the specific function device and the antenna part to control the specific function according to the first signal.
摘要翻译：提供一种控制特定功能的设备。特定功能控制装置包括信号发生器和识别器。信号发生器发送和接收特定频率的第一信号。识别器安装在具有用于执行特定功能的特定功能装置的特定功能模块中。具体功能模块安装在电子设备中。识别器包括天线部分和控制部分。天线部分响应于信号发生器的特定频率。控制部分电连接到特定功能装置和天线部分，以根据第一信号控制特定功能。

2. 发明申请

US20080174392A1 Magnetic levitation sliding structure 有权
标题翻译：磁悬浮滑动结构
公开(公告)号：US20080174392A1
公开(公告)日：2008-07-24
申请号：US12009522
申请日：2008-01-18
申请人： Se-hoon Cho
发明人： Se-hoon Cho
IPC分类号： H01F7/00
CPC分类号： H04M1/0237 , H01F7/0236
摘要： A low friction and stable sliding structure for an electronic device. The sliding structure includes a first sliding member comprising at least one guide portion, a second sliding member including a receiving portion receiving the guide portion so as to slide along the first sliding member, a first magnet portion disposed in the guide portion, such that magnetic poles of the first magnet portion are arranged across a sliding direction, and a second magnet portion disposed in the receiving portion so that a repulsive force can act between the first magnet portion and the second magnet portion.
摘要翻译：用于电子设备的低摩擦和稳定的滑动结构。滑动结构包括：第一滑动构件，其包括至少一个引导部，第二滑动构件，包括容纳引导部分以沿着第一滑动构件滑动的容纳部分;布置在引导部分中的第一磁体部分，第一磁体部分的极点横跨滑动方向布置，并且第二磁体部分设置在接收部分中，使得排斥力可以在第一磁体部分和第二磁体部分之间作用。

3. 发明授权

US07374342B2 Hydrodynamic fluid film bearing and bearing housing with cooling capacity 有权
标题翻译：流体动力流体膜轴承和轴承箱具有冷却能力
公开(公告)号：US07374342B2
公开(公告)日：2008-05-20
申请号：US11168618
申请日：2005-06-27
申请人： Byung-yong Yum , Se-hoon Cho
发明人： Byung-yong Yum , Se-hoon Cho
IPC分类号： F16C32/06
CPC分类号： F16C37/002 , F16C17/024 , F16C27/02
摘要： A hydrodynamic fluid film bearing for supporting a rotation shaft of a turbo or rotary apparatus includes a sleeve having a circular inner opening for receiving a rotation shaft therein, at least one metallic foil member of arc shape having one end fixed to the inner surface of the sleeve and arranged along the inner opening of the sleeve, and at least one elastic member disposed at the sleeve between the sleeve and the foil member. A bearing housing for receiving a bearing of a rotary apparatus is further provided, in which the bearing housing includes a circular opening for receiving the bearing therein, and the circular inner opening of the bearing housing includes grooves for cooling air passage formed at regular interval in the axial direction on the inner surface of the bearing housing. The bearing received in the bearing housing is preferably a hydrodynamic fluid film bearing.
摘要翻译：用于支撑涡轮或旋转设备的旋转轴的流体动力流体膜轴承包括具有用于在其中接收旋转轴的圆形内部开口的套筒，至少一个弧形金属箔构件，其一端固定到并且沿着所述套筒的内部开口布置，并且至少一个弹性构件设置在所述套筒和所述箔构件之间的套筒处。还设置有用于接收旋转装置的轴承的轴承壳体，其中轴承壳体包括用于接收轴承的圆形开口，并且轴承壳体的圆形内部开口包括用于冷却以规则间隔形成的空气通道的凹槽在轴承座的内表面上的轴向。容纳在轴承壳体中的轴承优选地是流体动力流体膜轴承。

4. 发明授权

US07345645B2 Method of manufacturing substrate for circuit board and smart label having the substrate 失效
标题翻译：制造用于电路板的基板和具有该基板的智能标签的方法
公开(公告)号：US07345645B2
公开(公告)日：2008-03-18
申请号：US10951230
申请日：2004-09-27
申请人： Se-hoon Cho
发明人： Se-hoon Cho
IPC分类号： H01Q1/12 , G08B13/14
CPC分类号： G06K19/07779 , G06K19/07749 , G06K19/07783 , H05K1/0218 , H05K1/095 , H05K3/107 , H05K3/1258 , H05K2201/09036 , H05K2203/0108 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of manufacturing a substrate for a circuit board includes forming a groove having a predetermined shape and pattern in at least one surface of a substrate formed of an insulating material, filling the groove with a conductive material, and forming a circuit pattern by hardening the conductive material filling the groove. The groove is preferably formed by impression with a die containing a pattern corresponding to the shape and pattern of the groove. A substrate and a smart label formed of the substrate are also disclosed.
摘要翻译：制造电路基板的方法包括在由绝缘材料形成的基板的至少一个表面中形成具有预定形状和图案的凹槽，用导电材料填充凹槽，并通过硬化形成电路图案导电材料填充槽。沟槽优选通过具有与凹槽的形状和图案对应的图案的模具的印模形成。还公开了由基板形成的基板和智能标签。

5. 发明授权

US07341889B2 Lead frame for semiconductor package and method of fabricating semiconductor package 失效
标题翻译：半导体封装的引线框架和半导体封装的制造方法
公开(公告)号：US07341889B2
公开(公告)日：2008-03-11
申请号：US10923454
申请日：2004-08-20
申请人： Jeung-Il Kim , Se-hoon Cho
发明人： Jeung-Il Kim , Se-hoon Cho
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , H01L21/566 , H01L21/6835 , H01L23/3107 , H01L23/49548 , H01L23/49565 , H01L23/49582 , H01L24/48 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.
摘要翻译：提供一种用于制造具有引线框架的半导体封装的方法和其中提供的半导体封装。该方法包括向引线框架提供多个用于模制多个半导体封装件的模制区域，以及将引线框架的至少一个表面附接到带子上以防止熔融模塑材料与该表面上的引线框架接触。带子包括对应于每个模制区域的边界的多个空白区域。该方法在将带材层叠在引线框架上时分配由加热辊引起的带的张力和膨胀应力，从而防止条带的弯曲。

6. 发明申请

US20110315657A1 METHOD AND APPARATUS FOR MANUFACTURING GRAPHENE TRANSFER FILM 审中-公开
标题翻译：制造石墨转印膜的方法和装置
公开(公告)号：US20110315657A1
公开(公告)日：2011-12-29
申请号：US13172162
申请日：2011-06-29
申请人： Se-hoon CHO , Young-il SONG
发明人： Se-hoon CHO , Young-il SONG
IPC分类号： B32B37/02 , B32B38/10 , B32B37/10 , B32B37/14 , B82Y40/00
CPC分类号： B32B37/025 , B32B2037/243 , B32B2313/04 , B32B2367/00 , B32B2457/08 , B82Y30/00 , B82Y40/00 , C01B32/186 , C01B32/194 , H01L21/02425 , H01L21/02491 , H01L21/02527 , H01L21/187
摘要： A method and an apparatus for manufacturing a graphene transfer film are provided. The method of manufacturing the graphene transfer film includes: forming graphene on a graphene growth film comprising a carbonization catalyst; disposing a carrier film and the graphene growth film so that the carrier film and the graphene growth film, on which the graphene is formed, face each other; applying air pressure to at least one of the graphene growth film and the carrier film so that the graphene and the carrier film are attached to each other; and removing at least a part of the graphene growth film.
摘要翻译：提供了一种制造石墨烯转移膜的方法和装置。制造石墨烯转移膜的方法包括：在包含碳化催化剂的石墨烯生长膜上形成石墨烯; 设置载体膜和石墨烯生长膜，使得形成有石墨烯的载体膜和石墨烯生长膜彼此面对; 向石墨烯生长膜和载体膜中的至少一个施加空气压力，使得石墨烯和载体膜彼此附着; 以及去除所述石墨烯生长膜的至少一部分。

7. 发明授权

US07070114B2 Smart label and manufacturing method thereof 失效
标题翻译：智能标签及其制造方法
公开(公告)号：US07070114B2
公开(公告)日：2006-07-04
申请号：US10909687
申请日：2004-08-02
申请人： Se-hoon Cho
发明人： Se-hoon Cho
IPC分类号： G06K19/06
CPC分类号： G06K19/07749
摘要： A smart label includes an antenna formed with a narrow film or panel-like material rolled in a roll, the film having one face of conductive layer and an opposite face of nonconductive layer, and a semiconductor chip attached to a side surface of the rolled antenna, the semiconductor chip having a first connection terminal connected to the conductive layer at a location adjacent to an outermost winding of the antenna and a second connection terminal connected to the conductive layer at a location adjacent to an innermost winding of the antenna.
摘要翻译：智能标签包括天线，其形成有卷成卷的薄膜或板状材料，该膜具有导电层的一个面和非导电层的相对面，以及附接到卷绕天线的侧面的半导体芯片所述半导体芯片具有在与所述天线的最外侧绕组相邻的位置处连接到所述导电层的第一连接端子和在与所述天线的最内侧绕组相邻的位置连接到所述导电层的第二连接端子。

8. 发明申请

US20050072595A1 Method of manufacturing substrate for circuit board and smart label having the substrate 失效
标题翻译：制造用于电路板的基板和具有该基板的智能标签的方法
公开(公告)号：US20050072595A1
公开(公告)日：2005-04-07
申请号：US10951230
申请日：2004-09-27
申请人： Se-hoon Cho
发明人： Se-hoon Cho
IPC分类号： H05K3/10 , G06K19/077 , H01L23/12 , H01Q1/36 , H01Q7/00 , H05K1/02 , H05K1/09 , H05K3/12 , H05K3/02 , H05K1/00
CPC分类号： G06K19/07779 , G06K19/07749 , G06K19/07783 , H05K1/0218 , H05K1/095 , H05K3/107 , H05K3/1258 , H05K2201/09036 , H05K2203/0108 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of manufacturing a substrate for a circuit board includes forming a groove having a predetermined shape and pattern in at least one surface of a substrate formed of an insulating material, filling the groove with a conductive material, and forming a circuit pattern by hardening the conductive material filling the groove. The groove is preferably formed by impression with a die containing a pattern corresponding to the shape and pattern of the groove. A substrate and a smart label formed of the substrate are also disclosed.
摘要翻译：制造电路基板的方法包括在由绝缘材料形成的基板的至少一个表面中形成具有预定形状和图案的凹槽，用导电材料填充凹槽，并通过硬化形成电路图案导电材料填充槽。沟槽优选通过具有与凹槽的形状和图案对应的图案的模具的印模形成。还公开了由基板形成的基板和智能标签。

9. 发明申请

US20050023360A1 Smart label and manufacturing method thereof 失效
标题翻译：智能标签及其制造方法
公开(公告)号：US20050023360A1
公开(公告)日：2005-02-03
申请号：US10909687
申请日：2004-08-02
申请人： Se-hoon Cho
发明人： Se-hoon Cho
IPC分类号： G06K7/10 , G06K19/00 , G06K19/06 , G06K19/07 , G06K19/077 , H01Q1/38 , H01Q7/06
CPC分类号： G06K19/07749
摘要： A smart label includes an antenna formed with a narrow film or panel-like material rolled in a roll, the film having one face of conductive layer and an opposite face of nonconductive layer, and a semiconductor chip attached to a side surface of the rolled antenna, the semiconductor chip having a first connection terminal connected to the conductive layer at a location adjacent to an outermost winding of the antenna and a second connection terminal connected to the conductive layer at a location adjacent to an innermost winding of the antenna.
摘要翻译：智能标签包括天线，其形成有卷成卷的薄膜或板状材料，该膜具有导电层的一个面和非导电层的相对面，以及附接到卷绕天线的侧面的半导体芯片所述半导体芯片具有在与所述天线的最外侧绕组相邻的位置处连接到所述导电层的第一连接端子和在与所述天线的最内侧绕组相邻的位置连接到所述导电层的第二连接端子。

10. 发明授权

US08419880B2 Method of transferring graphene 有权
标题翻译：转移石墨烯的方法
公开(公告)号：US08419880B2
公开(公告)日：2013-04-16
申请号：US13162855
申请日：2011-06-17
申请人： Se-hoon Cho , Dong-kwan Won
发明人： Se-hoon Cho , Dong-kwan Won
IPC分类号： B44C1/00 , B29C65/48 , B32B37/12 , B32B37/18 , B32B43/00 , C01B31/04
CPC分类号： B32B37/025 , B32B2310/049 , B32B2457/12 , B32B2457/20 , B82Y30/00 , B82Y40/00
摘要： A method of transferring graphene, the method including: preparing a graphene forming structure including a base member, an oxide layer that is hydrophilic and is formed on the base member, a metal catalyst layer that is hydrophobic and is formed on the oxide layer, and graphene that is formed on the metal catalyst layer; attaching the graphene forming structure on a surface of a first carrier; separating the oxide layer from the metal catalyst layer by applying steam to the graphene forming structure; and removing the metal catalyst layer.
摘要翻译：一种转移石墨烯的方法，该方法包括：制备石墨烯形成结构，该石墨烯形成结构包括基底构件，亲水性并形成在基底构件上的氧化物层，疏水性并形成在氧化物层上的金属催化剂层，以及在金属催化剂层上形成的石墨烯; 将所述石墨烯形成结构附着在第一载体的表面上; 通过向所述石墨烯形成结构施加蒸汽来将所述氧化物层与所述金属催化剂层分离; 并除去金属催化剂层。

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