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1. 发明申请

US20130304049A1 System and Method for Directing Energy to Tissue 有权
标题翻译：将能量引导到组织的系统和方法
公开(公告)号：US20130304049A1
公开(公告)日：2013-11-14
申请号：US13469960
申请日：2012-05-11
申请人： Robert J. Behnke, II , Scott E.M. Frushour
发明人： Robert J. Behnke, II , Scott E.M. Frushour
IPC分类号： A61B18/18 , A61B18/12
CPC分类号： A61B18/1206 , A61B18/1442 , A61B18/1815 , A61B2018/00577 , A61B2018/00642 , A61B2018/00785 , A61B2018/00791 , A61B2018/00845 , A61B2018/00875 , A61B2018/124 , A61B2018/1823 , A61B2018/1838 , A61B2018/1869
摘要： An electrosurgical system includes an electrosurgical power generating source, an energy applicator operably associated with the electrosurgical power generating source, a processor unit, and a data acquisition module configured to receive a reflected signal. The processor unit is disposed in operative communication with the data acquisition module and adapted to determine a tissue desiccation rate around at least a portion of the energy applicator based on one or more signals received from the data acquisition module.
摘要翻译：电外科系统包括电外科发电源，与电外科发电源可操作地相关联的能量施加器，处理器单元和被配置为接收反射信号的数据采集模块。处理器单元被布置成与数据采集模块可操作地通信，并且适于基于从数据采集模块接收的一个或多个信号来确定能量施加器的至少一部分周围的组织干燥速率。

2. 发明申请

US20130180104A1 Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same 有权
标题翻译：包括剥线电路的印刷电路板及其制造方法相同
公开(公告)号：US20130180104A1
公开(公告)日：2013-07-18
申请号：US13353012
申请日：2012-01-18
申请人： WAYNE L. MOUL , ROBERT J. BEHNKE, II , SCOTT E.M. FRUSHOUR , JEFFREY L. JENSEN
发明人： WAYNE L. MOUL , ROBERT J. BEHNKE, II , SCOTT E.M. FRUSHOUR , JEFFREY L. JENSEN
IPC分类号： H05K3/10
CPC分类号： H05K1/0298 , H01P3/081 , H01P11/003 , H05K1/0225 , H05K1/0231 , H05K1/0243 , H05K1/025 , H05K1/183 , H05K1/186 , H05K3/4611 , H05K2201/066 , H05K2201/0969 , H05K2203/063 , Y10T29/49155
摘要： A method of manufacturing a printed circuit board includes the initial steps of providing a first layer stack and providing a second layer stack. The first layer stack includes a first electrically-insulating layer. The first electrically-insulating layer includes a first surface and one or more electrically-conductive traces disposed on the first surface. The second layer stack includes a second electrically-insulating layer and a first electrically-conductive layer. The second electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the second electrically-insulating layer. The second layer stack further includes a cut-out area defining a void that extends therethrough. The cut-out area is configured to receive therein at least a portion of a device to be coupled to the first surface of the first electrically-insulating layer and electrically-coupled to one or more of the one or more electrically-conductive traces.
摘要翻译：制造印刷电路板的方法包括提供第一层堆叠并提供第二层堆叠的初始步骤。第一层堆叠包括第一电绝缘层。第一电绝缘层包括第一表面和设置在第一表面上的一个或多个导电迹线。第二层堆叠包括第二电绝缘层和第一导电层。第二电绝缘层包括第一表面和相对的第二表面。第一导电层设置在第二电绝缘层的第一表面上。第二层堆叠还包括限定从其延伸的空隙的切口区域。切除区域被配置为在其中容纳要耦合到第一电绝缘层的第一表面的器件的至少一部分并且电耦合到一个或多个导电迹线中的一个或多个。

3. 发明申请

US20130180762A1 Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same 失效
标题翻译：包括剥线电路的印刷电路板及其制造方法相同
公开(公告)号：US20130180762A1
公开(公告)日：2013-07-18
申请号：US13352909
申请日：2012-01-18
申请人： Wayne L. Moul , Robert J. Behnke, II , Scott E.M. Frushour , Jeffrey L. Jensen
发明人： Wayne L. Moul , Robert J. Behnke, II , Scott E.M. Frushour , Jeffrey L. Jensen
IPC分类号： H05K1/16 , H05K3/00
CPC分类号： H05K1/183 , H01P3/088 , H01P11/003 , H05K1/0225 , H05K1/0231 , H05K1/0243 , H05K1/025 , H05K1/0298 , H05K1/186 , H05K3/4611 , H05K3/4694 , H05K2201/066 , H05K2201/0715 , H05K2201/0723 , H05K2201/0969 , H05K2203/063 , Y10T29/49124
摘要： A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a second electrically-insulating layer, and a first electrically-conductive layer disposed between the first and second electrically-insulating layers. The second layer includes a third electrically-insulating layer and a second electrically-conductive layer. The first layer stack and/or the second layer stack include a cut-out area defining a void that extends therethrough. The multi-layer printed circuit board further includes a first signal layer disposed in association with the first electrically-insulating layer of the first layer stack or the third electrically-insulating layer of the second layer stack, a second signal layer disposed in association with the second electrically-insulating layer of the first layer stack, and a device at least partially disposed within the cut-out area and electrically-coupled to the first and second signal layers.
摘要翻译：多层印刷电路板包括第一层堆叠和耦合到第一层堆叠的第二层堆叠。第一层堆叠包括第一电绝缘层，第二电绝缘层和设置在第一和第二电绝缘层之间的第一导电层。第二层包括第三电绝缘层和第二导电层。第一层堆叠和/或第二层堆叠包括限定从其延伸的空隙的切口区域。多层印刷电路板还包括与第一层堆叠的第一电绝缘层或第二层堆叠的第三电绝缘层相关联地设置的第一信号层，与第二层堆叠相关联地布置的第二信号层第一层堆叠的第二电绝缘层，以及至少部分地设置在切除区域内并电耦合到第一和第二信号层的器件。

4. 发明申请

US20130144284A1 Vessel Sealing Using Microwave Energy 有权
标题翻译：使用微波能量的船舶密封
公开(公告)号：US20130144284A1
公开(公告)日：2013-06-06
申请号：US13312172
申请日：2011-12-06
申请人： Robert J. Behnke, II , Scott E.M. Frushour , Jeffrey L. Jensen , Wayne L. Moul
发明人： Robert J. Behnke, II , Scott E.M. Frushour , Jeffrey L. Jensen , Wayne L. Moul
IPC分类号： A61B18/18
CPC分类号： A61B18/1815 , A61B17/29 , A61B2018/0016 , A61B2018/00404 , A61B2018/00559 , A61B2018/0063 , A61B2018/00791 , A61B2018/00875 , A61B2018/183
摘要： The present disclosure provides for an end effector assembly for microwave forceps. The end effector assembly includes a pair of opposing jaw members movable from a first position in spaced relation relative to one another to at least one subsequent position wherein the jaw members cooperate to grasp tissue therebetween. Each of the jaw members includes a microwave antenna assembly and a shielding member including a metallic plate coupled to ground and a dielectric material. The end effector assembly also includes a splitter configured to receive an active signal from a source of microwave energy and split the active signal into a first signal transmitted to the microwave antenna assembly in one of the jaw members and a second signal transmitted in the microwave antenna assembly in the other jaw member.
摘要翻译：本公开提供了用于微波镊子的端部执行器组件。末端执行器组件包括一对相对的夹爪构件，其可以从第一位置相对于彼此以间隔开的关系移动到至少一个随后的位置，其中钳口构件协作以抓住它们之间的组织。每个钳口构件包括微波天线组件和包括耦合到地面的金属板和介电材料的屏蔽构件。末端执行器组件还包括分配器，其被配置为从微波能量源接收有源信号，并将有源信号分解成在其中一个钳口构件中传送到微波天线组件的第一信号和在微波天线中传输的第二信号组装在另一个颚构件中。

5. 发明申请

US20130067725A1 Handheld Medical Devices Including Microwave Amplifier Unit At Device Handle 失效
标题翻译：手持式医疗设备包括微波放大器单元在设备手柄
公开(公告)号：US20130067725A1
公开(公告)日：2013-03-21
申请号：US13237488
申请日：2011-09-20
申请人： Robert J. Behnke, II , Jeffrey L. Jensen , Scott E.M. Frushour , Wayne L. Moul
发明人： Robert J. Behnke, II , Jeffrey L. Jensen , Scott E.M. Frushour , Wayne L. Moul
IPC分类号： H05K13/00
CPC分类号： A61B18/1815 , A61B2018/00922 , A61B2018/1823 , A61B2090/0807 , Y10T29/49002 , Y10T29/49117
摘要： A method of manufacturing a medical device includes the initial steps of providing a handle assembly and providing a microwave-signal-amplifying module. The handle assembly includes a handle body defining a chamber therein. The handle body is configured to support an energy applicator at the distal end thereof. The microwave-signal-amplifying module includes a microwave amplifier unit adapted to amplify a high-frequency input signal to generate a high-frequency output signal. The microwave-signal-amplifying module includes one or more connector portions including one or more electrical connectors adapted to be removeably coupleable to one or more electrical conductors associated with the handle body. The method also includes the step of positioning the microwave-signal-amplifying module into the chamber to bring the one or more electrical connectors of the one or more connector portions into electrical engagement with one or more electrical connectors associated with the handle body.
摘要翻译：一种制造医疗装置的方法包括提供手柄组件和提供微波信号放大模块的初始步骤。手柄组件包括在其中限定室的手柄主体。手柄主体构造成在其远端处支撑能量施加器。微波信号放大模块包括适于放大高频输入信号以产生高频输出信号的微波放大器单元。微波信号放大模块包括一个或多个连接器部分，其包括一个或多个电连接器，其适于可移除地耦合到与手柄主体相关联的一个或多个电导体。该方法还包括将微波信号放大模块定位到室中以将一个或多个连接器部分的一个或多个电连接器与与手柄主体相关联的一个或多个电连接器电接合的步骤。

6. 发明申请

US20130180763A1 Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same 有权
标题翻译：包括剥线电路的印刷电路板及其制造方法相同
公开(公告)号：US20130180763A1
公开(公告)日：2013-07-18
申请号：US13352978
申请日：2012-01-18
申请人： Wayne L. Moul , Robert J. Behnke, II , Scott E.M. Frushour , Jeffrey L. Jensen
发明人： Wayne L. Moul , Robert J. Behnke, II , Scott E.M. Frushour , Jeffrey L. Jensen
IPC分类号： H05K1/16
CPC分类号： H05K1/0218 , H01P3/088 , H01P11/003 , H05K1/0225 , H05K1/0231 , H05K1/0243 , H05K1/025 , H05K1/0298 , H05K1/183 , H05K1/186 , H05K3/4611 , H05K2201/066 , H05K2201/0715 , H05K2201/0723 , H05K2201/0969 , H05K2203/063
摘要： A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.
摘要翻译：印刷电路板包括第一层堆叠和耦合到第一层堆叠的第二层堆叠。第一层堆叠包括第一电绝缘层，第一导电层和限定从其延伸的空隙的切除区域。第一电绝缘层包括第一表面和相对的第二表面。第一导电层设置在第一电绝缘层的第一表面上。第二层堆叠包括第二电绝缘层。第二电绝缘层包括第一表面和相对的第二表面。一个或多个导电迹线设置在第二电绝缘层的第一表面上。印刷电路板还包括至少部分地设置在切除区域内的装置。该器件电耦合到布置在第二电绝缘层的第一表面上的一个或多个导电迹线中的一个或多个。

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