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    • 10. 发明授权
    • Stripline structure with multiple ground vias separated by no more than 100 mil
    • 带多个接地通孔的间隔结构不超过100密耳
    • US07224249B2
    • 2007-05-29
    • US11222268
    • 2005-09-08
    • Minh van QuachT. Shannon SawyerWilliam Scott Burton
    • Minh van QuachT. Shannon SawyerWilliam Scott Burton
    • H01P3/08
    • H01P1/2039H05K1/0219H05K2201/09618
    • A stripline structure. The stripline structure includes a stripline transmission line, a first ground plane, a first dielectric layer overlaying the first ground plane, a conductive trace overlaying the first dielectric layer, a second dielectric layer overlaying the conductive trace, a second ground plane overlaying the second dielectric layer, multiple first conductive vias, and multiple second conductive vias. Each first conductive via and each second conductive via electrically connects the first ground plane to the second ground plane. The multiple first conductive vias are located along a first line parallel to the conductive trace, and the multiple second conductive vias are located along a second line parallel to the conductive trace. The first line and the second line are located on opposite sides of the conductive trace.
    • 带状线结构。 带状线结构包括带状线传输线,第一接地平面,覆盖第一接地平面的第一电介质层,覆盖第一介电层的导电迹线,覆盖导电迹线的第二介电层,覆盖第二电介质的第二接地平面 层,多个第一导电通孔和多个第二导电通孔。 每个第一导电通孔和每个第二导电通孔将第一接地平面电连接到第二接地平面。 多个第一导电通孔沿着平行于导电迹线的第一线定位,并且多个第二导电通孔沿着平行于导电迹线的第二线定位。 第一行和第二行位于导电迹线的相对两侧。