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    • 5. 发明授权
    • Field effect transistor
    • 场效应晶体管
    • US4698899A
    • 1987-10-13
    • US835706
    • 1986-03-03
    • Sanehiko Kakihana
    • Sanehiko Kakihana
    • H01L21/265H01L21/338H01L29/10H01L21/42
    • H01L29/66871H01L21/26586H01L29/1029Y10S148/082
    • This disclosure depicts a novel semiconductor device and the method of making it. A novel field effect transistor (FET) has a channel region which is heavily doped under the gate and between the gate and the source of the FET. The channel region between the gate and the drain is lightly doped. The FET is formed on a heavily doped semiconductor substrate. The method of making the novel FET comprises providing a mask layer over a lightly doped channel region and forming openings in the mask layer such that a portion of the mask is located at the gate location and has a predetermined width and height. Ion implanting is performed at a predetermined angle such that a first portion of the channel adjacent the source is heavily doped and a second portion of the channel adjacent the drain is not exposed due to the height of the mask at the gate.
    • 本公开描述了一种新颖的半导体器件及其制造方法。 一种新颖的场效应晶体管(FET)具有在栅极之下以及FET的栅极和源极之间重掺杂的沟道区。 栅极和漏极之间的沟道区域被轻掺杂。 FET在重掺杂的半导体衬底上形成。 制造新型FET的方法包括在轻掺杂沟道区上提供掩模层,并在掩模层中形成开口,使得掩模的一部分位于栅极位置并具有预定的宽度和高度。 以预定角度执行离子注入,使得邻近源极的沟道的第一部分被重掺杂,并且与栅极相邻的沟道的第二部分由于掩模在栅极处的高度而不被暴露。