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1. 发明申请

US20050059759A1 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging 审中-公开
标题翻译：胶合用于包装的疏水性和疏油性底物的方法
公开(公告)号：US20050059759A1
公开(公告)日：2005-03-17
申请号：US10815914
申请日：2004-04-02
申请人： Nicolas Sajot , Benoit Pollacchi , Saida Sellak
发明人： Nicolas Sajot , Benoit Pollacchi , Saida Sellak
IPC分类号： B65D65/40 , C09J5/00 , C09J123/20 , C09J125/02 , C09J153/02 , C09J165/00 , C09J191/06 , C09J193/04 , C08L1/00
CPC分类号： C09J153/025 , C08L2666/02 , C08L2666/04
摘要： The invention relates to a method of gluing substrates which are hydrophobic and oleophobic as a result of having been treated earlier using a fluorinated compound, said substrates being intended for packaging. The inventive method consists in applying an adhesive to at least one of the substrates, said adhesive comprising: a) 5 to 50 weight percent of at least one styrenic block copolymer (preferably, 15 to 30%); b) 20 to 60 weight percent of at least one tackifying resin which is compatible with the non-styrene phase (preferably, 35 to 55%); c) 0 to 20 weight percent of at least one tackifying resin which is compatible with the styrene phase and, (preferably, 5 to 15%); d) 5 to 25 weight percent of at least one thermofusible wax (preferably, 10 to 17%); e) 3 to 20 weight percent of liquid plasticisers which are normally used in thermofusible adhesives; and/or f) additives. In this way, said mixture presents the following characteristics: (i) a viscosity of between 400 and 3000 mPa.s at 170° C. (preferably, between 700 and 1400 mPa.s); and (ii) a softening point included between 75 and 120° C.
摘要翻译：本发明涉及一种粘合基材的方法，该方法由于已经使用氟化合物进行了较早处理，因此是疏水性和疏油性的，所述基材用于包装。本发明的方法在于将粘合剂施加到至少一个基底上，所述粘合剂包括：a）5至50重量％的至少一种苯乙烯嵌段共聚物（优选15至30％）; b）20-60重量％的至少一种与非苯乙烯相相容的增粘树脂（优选35-55％）; c）0至20重量％的至少一种与苯乙烯相相容的增粘树脂和（优选5至15％）; d）5至25重量％的至少一种热熔蜡（优选10至17％）; e）通常用于热熔粘合剂中的3至20重量％的液体增塑剂; 和/或f）添加剂。以这种方式，所述混合物具有以下特征：（i）在170℃（优选在700和1400mPa.s之间）的粘度为400至3000mPa.s; 和（ii）软化点包括在75和120℃之间。

2. 发明申请

US20080221247A1 METHOD OF GLUING HYDROPHOBIC AND OLEOPHOBIC SUBSTRATES WHICH ARE INTENDED FOR PACKAGING 审中-公开
标题翻译：用于包装的疏水性和疏水性基材的制造方法
公开(公告)号：US20080221247A1
公开(公告)日：2008-09-11
申请号：US12124036
申请日：2008-05-20
申请人： Nicolas SAJOT , Benoit Pollacchi , Saida Sellak
发明人： Nicolas SAJOT , Benoit Pollacchi , Saida Sellak
IPC分类号： C09J11/08 , C09J125/08
CPC分类号： C09J153/025 , C08L2666/02 , C08L2666/04
摘要： The invention relates to a method of gluing substrates which are hydrophobic and oleophobic as a result of having been treated earlier using a fluorinated compound, said substrates being intended for packaging. The inventive method consists in applying an adhesive to at least one of the substrates, said adhesive comprising: a) 5 to 50 weight percent of at least one styrenic block copolymer (preferably, 15 to 30%); b) 20 to 60 weight percent of at least one tackifying resin which is compatible with the non-styrene phase (preferably, 35 to 55%); c) 0 to 20 weight percent of at least one tackifying resin which is compatible with the styrene phase and, (preferably, 5 to 15%); d) 5 to 25 weight percent of at least one thermofusible wax (preferably, 10 to 17%); e) 3 to 20 weight percent of liquid plasticisers which are normally used in thermofusible adhesives; and/or f) additives. In this way, said mixture presents the following characteristics: (i) a viscosity of between 400 and 3000 mPa·s at 170° C. (preferably, between 700 and 1400 mPa·s); and (ii) a softening point included between 75 and 120° C.
摘要翻译：本发明涉及一种粘合基材的方法，该方法由于已经使用氟化合物进行了较早处理，因此是疏水性和疏油性的，所述基材用于包装。本发明的方法在于将粘合剂施加到至少一个基底上，所述粘合剂包括：a）5至50重量％的至少一种苯乙烯嵌段共聚物（优选15至30％）; b）20-60重量％的至少一种与非苯乙烯相相容的增粘树脂（优选35-55％）; c）0至20重量％的至少一种与苯乙烯相相容的增粘树脂和（优选5至15％）; d）5至25重量％的至少一种热熔蜡（优选10至17％）; e）通常用于热熔粘合剂中的3至20重量％的液体增塑剂; 和/或f）添加剂。以这种方式，所述混合物具有以下特征：（i）在170℃（优选在700和1400mPa.s之间）的粘度为400至3000mPa.s; 和（ii）软化点包括在75和120℃之间。

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