专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

US20240213119A1 INTEGRATED CIRCUIT DEVICE INCLUDING A POWER RAIL 审中-公开
公开(公告)号：US20240213119A1
公开(公告)日：2024-06-27
申请号：US18230710
申请日：2023-08-07
申请人： SAMSUNG ELETRONICS CO., LTD.
发明人： Bongkeun KIM , myungsoo Noh , Dawoon Choi
IPC分类号： H01L23/48 , H01L27/088 , H01L29/06 , H01L29/423 , H01L29/775 , H01L29/786
CPC分类号： H01L23/481 , H01L27/088 , H01L29/0673 , H01L29/42392 , H01L29/775 , H01L29/78696
摘要： An integrated circuit device includes: a substrate having a backside surface; a pair of fin-type active regions protruding from the substrate and defining a trench region in the substrate; a pair of source/drain regions disposed, one-by-one, on the pair of fin-type active regions, respectively; a device isolation film covering a sidewall of each of the pair of fin-type active regions and disposed in the trench region; a via power rail disposed between the pair of fin-type active regions and between the pair of source/drain regions, wherein the via power rail passes through the device isolation film in a vertical direction; a backside power rail passing through the substrate in the vertical direction and disposed at a position overlapping the via power rail, wherein the backside power rail is connected to the via power rail; and an air spacer disposed between the substrate and the backside power rail.

2. 发明申请

US20150223239A1 METHOD AND APPARATUS FOR PERFORMING CARRIER AGGREGATION USING ABS PATTERNS IN MACRO eNB OF WIRELESS COMMUNICATION SYSTEM CONNECTED TO HETEROGENEOUS NETWORK 有权
标题翻译：使用连接到异构网络的无线通信系统的MACRO eNB中的ABS模式来执行载波聚合的方法和装置
公开(公告)号：US20150223239A1
公开(公告)日：2015-08-06
申请号：US14612878
申请日：2015-02-03
申请人： Samsung Eletronics Co., Ltd.
发明人： Hee-Kwang LEE , II-Won Kwon , Jung-Ah Choi
IPC分类号： H04W72/04
CPC分类号： H04W16/32 , H04B17/318 , H04L5/001 , H04L5/0035 , H04L5/0073 , H04W72/0426 , H04W72/082
摘要： Methods and apparatuses are provided for performing carrier aggregation (CA) using a plurality of almost blank subframe (ABS) patterns in a macro enhanced Node B (eNB) of a wireless communication system connected to a heterogeneous network. An ABS pattern having a different pattern is determined for each component carrier (CC), when two or more carriers are deployed in each of the macro eNB and at least one small cell eNB. A serving cell for each user equipment (UE) is determined for each CC, from among a macro cell and a small cell. CA is performed for data transmission to each UE using the determined ABS pattern, in accordance with each determined serving cell.
摘要翻译：提供了用于在连接到异构网络的无线通信系统的宏增强型节点B（eNB）中使用多个几乎空白的子帧（ABS）模式来执行载波聚合（CA）的方法和装置。当两个或多个载波部署在每个宏eNB和至少一个小小区eNB中时，针对每个分量载波（CC）确定具有不同模式的ABS模式。对于每个CC，从宏小区和小小区中确定每个用户设备（UE）的服务小区。根据每个确定的服务小区，执行使用所确定的ABS模式向每个UE进行数据传输的CA。

3. 发明申请

US20130306997A1 SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY AND MANUFACTURING METHOD THEREOF, LIGHT EMITTING MODULE, AND ILLUMINATION APPARATUS 有权
标题翻译：具有多细胞阵列的半导体发光装置及其制造方法，发光模块和照明装置
公开(公告)号：US20130306997A1
公开(公告)日：2013-11-21
申请号：US13895051
申请日：2013-05-15
申请人： SAMSUNG ELETRONICS CO., LTD.
发明人： Chan Mook LIM , Jong Ho LEE , Jin Hwan KIM , Jin Hyun LEE , Su Hyun JO , Hae Yeon HWANG
IPC分类号： H01L27/15
CPC分类号： H01L27/156 , H01L25/0753 , H01L33/62 , H01L2224/24 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor light emitting device includes a substrate and a plurality of light emitting cells disposed on the substrate. Each light emitting cell includes first and second conductive semiconductor layers having an active layer formed therebetween, and first and second electrodes formed on the first and second layers. A first insulation layer is formed on portions of the light emitting cell, while a second insulation layer entirely covers at least one light emitting cell. A method of manufacturing the semiconductor light emitting device, and a light emitting module and an illumination apparatus including the semiconductor light emitting device are also provided.
摘要翻译：半导体发光器件包括衬底和设置在衬底上的多个发光单元。每个发光单元包括其间形成有活性层的第一和第二导电半导体层，以及形成在第一和第二层上的第一和第二电极。第一绝缘层形成在发光单元的部分上，而第二绝缘层完全覆盖至少一个发光单元。还提供了制造半导体发光器件的方法，以及包括该半导体发光器件的发光模块和照明装置。

4. 发明申请

US20020137361A1 Phase shifting mask for manufacturing semiconductor device and method of fabricating the same 有权
标题翻译：用于制造半导体器件的相移掩模及其制造方法
公开(公告)号：US20020137361A1
公开(公告)日：2002-09-26
申请号：US10008064
申请日：2001-11-05
申请人： Samsung Eletronics Co. Ltd.
发明人： In-sung Kim , Jung-hyeon Lee , Sung-gon Jung
IPC分类号： H01L021/82 , H01L021/302
CPC分类号： G03F1/32 , G03F1/36
摘要： A phase shifting mask (PSM) for manufacturing a semiconductor device and a method of fabricating the same includes a transparent substrate, a main pattern formed on the transparent substrate and comprising a first phase shifting layer having a first optical transmittance greater than 0, and at least one assistant pattern formed on the transparent substrate proximal to the main pattern for phase-shifting by the same degree as the main pattern and having a second optical transmittance, which is less than the first optical transmittance.
摘要翻译：用于制造半导体器件的相移掩模（PSM）及其制造方法包括：透明基板，形成在透明基板上的主图案，其包括第一透光率大于0的第一相移层，以及第至少一个辅助图案形成在靠近主图案的透明基板上，用于与主图案相同程度的相移，并具有小于第一光透射率的第二光透射率。

5. 发明申请

US20230075833A1 SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20230075833A1
公开(公告)日：2023-03-09
申请号：US17824194
申请日：2022-05-25
申请人： SAMSUNG ELETRONICS CO., LTD.
发明人： JU-YOUN CHOI , Kyoung Lim Suk , Wonjae Lee
IPC分类号： H01L25/18 , H01L23/538 , H01L23/48 , H01L23/552 , H01L23/00
摘要： A semiconductor package including: a package substrate; an interposer on the package substrate; a chip stack on the interposer, the chip stack including a plurality of first semiconductor chips that are stacked in a first direction; a second semiconductor chip on the interposer and spaced apart from the chip stack in a second direction intersecting the first direction; and a first signal pad, a second signal pad, and a power/ground pad on a top surface of the interposer, wherein the chip stack is mounted on the first signal pad, wherein the second semiconductor chip is mounted on the second signal pad, wherein the chip stack and the second semiconductor chip are connected to the power/ground pad, and wherein the power/ground pad overlaps a portion of the chip stack and a portion of the second semiconductor chip.

6. 发明申请

US20210011829A1 ELECTRONIC DEVICE AND ON-DEVICE METHOD FOR ENHANCING USER EXPERIENCE IN ELECTRONIC DEVICE 有权
公开(公告)号：US20210011829A1
公开(公告)日：2021-01-14
申请号：US16978110
申请日：2019-03-08
申请人： SAMSUNG ELETRONICS CO., LTD.
发明人： Renju Chirakarotu NAIR , Hiren Bharatbhai GAJJAR , Syama SUDHEESH , vaisakh Punnekkattu CHIRAYIL SUDHEESH BABU , Rajib BASU , Raju Suresh DIXIT
IPC分类号： G06F11/34 , G06F11/30 , G06K9/62 , G06F3/0481
摘要： Embodiments herein provide an on-device method for enhancing user experience in an electronic device. The method includes monitoring a plurality of parameters associated with an operation of the electronic device. The method includes identifying an anomaly associated with the electronic device based on the plurality of parameters associated with the operation of the electronic device and identifying a class of anomaly to which the anomaly associated with the electronic device belongs using a first on-device model. Further, the method includes presenting at least one question associated with the identified class of anomaly to user of the electronic device using on a second on-device model and receiving at least one user input for the at least one question. Furthermore, the method includes performing at least one action for enhancing the user experience based on the at least one user input for the at least one question.

7. 发明申请

US20190269363A1 PORTABLE ELECTRONIC DEVICE, ACCESSORY, AND OPERATING METHOD THEREFOR 审中-公开
公开(公告)号：US20190269363A1
公开(公告)日：2019-09-05
申请号：US16348967
申请日：2017-11-13
申请人： SAMSUNG ELETRONICS CO., LTD.
发明人： Maxim Alexeevich VILENSKII
IPC分类号： A61B5/00 , G01N21/64
摘要： Provided are a portable electronic device, an accessory, and an operation method thereof. The portable electronic device includes a light source irradiating light to skin, at least one light detector detecting light received from the skin, at least one memory storing an instruction, and a processor, by executing the instruction, controlling the light source to irradiate the light and analyzing a skin state based on light detected by the light detector.

8. 发明申请

US20130322647A1 NOISE REDUCTION APPARATUS 审中-公开
标题翻译：噪音减少装置
公开(公告)号：US20130322647A1
公开(公告)日：2013-12-05
申请号：US13894617
申请日：2013-05-15
申请人： SAMSUNG ELETRONICS CO., LTD.
发明人： Byung-Soo KIL
IPC分类号： G10K11/00 , H02J7/00
CPC分类号： G10K11/002 , H02J7/0052 , H02J7/022 , H02M1/12 , H02M2001/123
摘要： An apparatus for reducing an Electro-Magnetic Interference (EMI) noise of an electronic device during supplying of power from a charging device. includes Common Mode Choking Coils (CMCCs) to permit the electronic device to conform to various national standards regarding emissions of radiation. The CMCC can be arranged in the charging device and a power supply line of the electronic device or in an earphone connected with the electronic device or interposed there between. The higher frequency of radiation noise is reduced while DC levels are not affected by the choking coils. The radiation noise being emitted from the electronic device at the time of interworking with the charging device is greatly reduced.
摘要翻译：一种用于在从充电装置供电期间减少电子设备的电磁干扰（EMI）噪声的装置。包括共模扼流圈（CMCC），允许电子设备符合有关辐射辐射的各种国家标准。 CMCC可以布置在充电装置中，电子装置的电源线或与电子装置连接的耳机中或其间插入。辐射噪声的频率越高，直流电平不受阻塞线圈的影响。在与充电装置互通时从电子设备发射的辐射噪声大大降低。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式