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    • 3. 发明授权
    • Resistor paste and ceramic substrate
    • 电阻膏和陶瓷基片
    • US5264272A
    • 1993-11-23
    • US984471
    • 1992-12-02
    • Ryuichi TanabeYoshiyuki Nishihara
    • Ryuichi TanabeYoshiyuki Nishihara
    • C03C8/14B05D1/00
    • C03C8/14Y10S428/901Y10T428/24917Y10T428/24926
    • A resistor paste comprising an inorganic component which consists essentially of from 20 to 70 wt % of glass powder and from 30 to 80 wt % of a powder selected from the group consisting of SnO.sub.2 power, Sb-doped SnO.sub.2 powder and a mixture thereof, wherein the glass powder consists essentially of from 12 to 50 wt % of SiO.sub.2, from 0 to 20 wt % of Al.sub.2 O.sub.3, from 0 to 40 wt % of MgO, from 0 to 40 wt % of CaO, from 0 to 60 wt % of SrO, from 16 to 60 wt % of MgO+CaO+SrO, from 0 to 10 wt % of Li.sub.2 O+Na.sub.2 O+K.sub.2 O+Cs.sub.2 O, from 0 to 10 wt % of PbO, from 0 to 20 wt % of ZnO, from 0 to 10 wt % of ZrO.sub.2 +TiO.sub.2, from 8 to 40 wt % of B.sub.2 O.sub.3, from 0 to 60 wt % of Ta.sub.2 O.sub.5, from 0 to 50 wt % of Nb.sub.2 O.sub.5, from 0 to 60 wt % of Ta.sub.2 O.sub.5 +Nb.sub.2 O.sub.5, and from 0.1 to 20 wt % of Fe.sub.2 O.sub.3 +CuO+NiO+CoO+MnO+MoO.sub.3 +WO.sub.3 +Cr.sub.2 O.sub.3 +Bi.sub.2 O.sub.3 +CeO.sub.2 +Sb.sub.2 O.sub.3 +In.sub.2 O.sub.3 +SnO.sub.2.
    • 一种电阻浆料,其包含基本上由20至70重量%的玻璃粉末和30至80重量%的选自SnO 2功率,Sb掺杂的SnO 2粉末及其混合物的粉末组成的无机组分,其中 玻璃粉末主要由12至50重量%的SiO 2,0至20重量%的Al 2 O 3,0至40重量%的MgO,0至40重量%的CaO,0至60重量%的SrO ,MgO〜CaO + SrO为16〜60重量%,Li2O + Na2O + K2O + Cs2O为0〜10重量%,PbO 0〜10重量%,ZnO为0〜20重量%,0〜 10重量%的ZrO 2 + TiO 2,8〜40重量%的B 2 O 3,0〜60重量%的Ta 2 O 5,0〜50重量%的Nb 2 O 5,0〜60重量%的Ta 2 O 5 + Nb 2 O 5,0.1〜 20重量%的Fe 2 O 3 + CuO + NiO + CoO + MnO + MoO 3 + WO 3 + Cr 2 O 3 + Bi 2 O 3 + CeO 2 + Sb 2 O 3 + In 2 O 3 + SnO 2。
    • 8. 发明授权
    • Hermetic sealing composition
    • 密封组合物
    • US5916832A
    • 1999-06-29
    • US986325
    • 1997-12-05
    • Ryuichi TanabeHiroshi UsuiTsuneo ManabeYuichi Kuroki
    • Ryuichi TanabeHiroshi UsuiTsuneo ManabeYuichi Kuroki
    • C03C8/24C03C10/00
    • C03C10/0054C03C8/245
    • A hermetic sealing composition consisting essentially of from 90 to 99.95 wt % of a crystalline low melting glass powder and from 0.05 to 10 wt % of a low expansion ceramic filler powder, and having an average thermal expansion coefficient after firing of from 80.times.10.sup.-7 to 110.times.10.sup.-7 /.degree.C. within a range of from room temperature to 300.degree. C., wherein the crystalline low melting glass consists essentially of:______________________________________PbO 71.5 to 78.0 wt %ZnO 10.5 to 14.5 wt %B.sub.2 O.sub.3 7.0 to 10.0 wt %SiO.sub.2 1.65 to 3.0 wt %BaO 0.1 to 1.95 wt %SrO 0 to 1.5 wt %CaO 0 to 1.5 wt %BaO + SrO + CaO 0.5 to 1.95 wt %,______________________________________and contains substantially no fluorine, and the weight ratio of ZnO/PbO is within a range of from 0.14 to 0.20.
    • 一种气密密封组合物,其基本上由90至99.95重量%的结晶低熔点玻璃粉末和0.05至10重量%的低膨胀陶瓷填料粉末组成,并且煅烧后的平均热膨胀系数为80×10 -7至 在室温至300℃的范围内为110×10 -7 /℃,其中结晶低熔点玻璃基本上由以下组成: - PbO 71.5〜78.0重量%-Zn.10.5〜14.5重量%-B2O3 7.0〜10.0重量% %-SiO 2 1.65〜3.0重量%BaO 0.1〜1.95重量%SrO 0〜1.5重量%CaO 0〜1.5重量%BaO + SrO + CaO 0.5〜1.95重量%,基本上不含氟, ZnO / PbO的重量比在0.14〜0.20的范围内。