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1. 发明授权

US06972202B2 Method of manufacturing and testing a semiconductor device 失效
标题翻译：制造和测试半导体器件的方法
公开(公告)号：US06972202B2
公开(公告)日：2005-12-06
申请号：US10653285
申请日：2003-09-03
申请人： Ryouji Nishihashi , Kunio Kobayashi
发明人： Ryouji Nishihashi , Kunio Kobayashi
IPC分类号： H01L21/66 , G01R1/04 , G01R31/28 , H01L21/00 , H01L21/78
CPC分类号： G01R31/2886 , G01R1/0408 , G01R31/2831 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of testing a semiconductor device includes the steps of: positioning on a surface of a test jig a semiconductor wafer provided with the semiconductor device; dividing the semiconductor wafer into a plurality of semiconductor chips on the surface by dicing the semiconductor wafer; and, with the plurality of semiconductor chips positioned on the surface, testing an electrical characteristic of semiconductor device.Consequently, a method of testing a semiconductor device which can test an electrical characteristic with higher accuracy prior to an assembling step, can be provided.
摘要翻译：一种测试半导体器件的方法包括以下步骤：在测试夹具的表面上定位设置有半导体器件的半导体晶片; 通过切割半导体晶片将半导体晶片分割成表面上的多个半导体芯片; 并且将多个半导体芯片定位在表面上，测试半导体器件的电特性。因此，可以提供一种在组装步骤之前测试能够以更高精度测试电特性的半导体器件的测试方法。

2. 发明授权

US4904934A Testing apparatus for semiconductor devices 失效
标题翻译：半导体器件测试装置
公开(公告)号：US4904934A
公开(公告)日：1990-02-27
申请号：US259779
申请日：1988-10-19
申请人： Ryouji Nishihashi , Kiyoji Imanaka , Katsuji Kawaguchi , Hidekazu Iwasaki
发明人： Ryouji Nishihashi , Kiyoji Imanaka , Katsuji Kawaguchi , Hidekazu Iwasaki
IPC分类号： G01R31/28
CPC分类号： G01R31/2867 , G01R31/2893
摘要： A testing apparatus includes a turntable, a driving device for rotating the turntable by a predetermined angle, and a plurality of pallets symmetrically fixed on the turntable around a center of rotation of the turntable. Each pallet holds a plurality of semiconductor devices and has electrode patterns for connection to leads of the semiconductor devices. A tester for testing the semiconductor devices is electrically connected with the electrode patterns of one of the pallets located at a first position in the rotation of the turntable by a connecting device. An exchanging device exchanges the semiconductor devices for new ones on one of the pallets located at a second position in the rotation of the turntable. A cover covers the turntable except around the second position. A heating device heats the inside of the cover to maintain the semiconductor devices held on the pallets in the cover at a high temperature.
摘要翻译：测试装置包括转盘，用于使转台旋转预定角度的驱动装置和围绕转盘旋转中心的对称地固定在转台上的多个托盘。每个托盘保持多个半导体器件，并且具有用于连接到半导体器件的引线的电极图案。用于测试半导体器件的测试器通过连接装置与位于转台旋转中的第一位置的托盘之一的电极图案电连接。交换装置在位于转盘旋转的第二位置的托盘中的一个托盘上交换新的半导体装置。盖子覆盖转盘，除了第二个位置之外。加热装置加热盖的内部以将保持在盖中的托盘上的半导体装置保持在高温。

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