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    • 1. 发明申请
    • METHOD AND APPARATUS FOR INCREASING COMPUTER MEMORY PERFORMANCE
    • 用于增加计算机存储器性能的方法和装置
    • US20050266711A1
    • 2005-12-01
    • US10711653
    • 2004-09-29
    • Ryan PetersenEric Nelson
    • Ryan PetersenEric Nelson
    • G06F1/26H01R13/02
    • G06F1/26G11C5/04G11C5/147
    • A method and apparatus for providing power to a memory array of a computer's memory subsystem, and more particularly power at a level greater than that available through the computer motherboard so as to boost memory performance and operational stability. The apparatus includes a supply device for supplying an input voltage to the memory subsystem at a level that is higher than the power level provided to the memory subsystem by the motherboard. The method entails electrically connecting the supply device to the memory subsystem, and then electrically connecting a power source to the device to deliver the input voltage to the memory subsystem. The additional input voltage supplied to the memory subsystem causes memory chips on memory modules of the memory subsystem to run at higher frequencies, such that the various internal operations of the memory, such as reading and writing, occur more quickly.
    • 一种用于向计算机的存储器子系统的存储器阵列提供电力的方法和装置,并且更具体地,其功率大于通过计算机主板可用的电平,从而提高存储器性能和操作稳定性。 该装置包括供给装置,用于以高于由主板提供给存储器子系统的功率电平的高度向存储器子系统提供输入电压。 该方法需要将供应装置电连接到存储器子系统,然后将电源电连接到装置以将输入电压传送到存储器子系统。 提供给存储器子系统的附加输入电压使得存储器子系统的存储器模块上的存储器芯片以更高的频率运行,使得诸如读取和写入的存储器的各种内部操作更快地发生。
    • 3. 发明授权
    • Method and apparatus for cooling computer memory
    • 冷却计算机存储器的方法和装置
    • US07876564B2
    • 2011-01-25
    • US12127133
    • 2008-05-27
    • Mohasit MonhRyan Petersen
    • Mohasit MonhRyan Petersen
    • H05K7/20H01L23/34F28F7/00
    • H01L23/427F28D15/0266H01L2924/0002H01L2924/00
    • A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips.
    • 一种用于在计算机存储器模块上冷却芯片的方法和装置。 该装置包括主和二次散热器,至少第一热管与第一散热器相连,并且具有与初级散热器间隔开并与第二散热器热接触的远端部分,以及第一热管内的冷却剂和 初级散热器,以便从主散热器吸收热量并将热量传导到二次散热器。 主散热器具有至少两个配置成与其间的存储器模块接合的面板,面板的面对的接触表面适于与模块芯片热接触。 二次散热器被配置为增加热量从第一热管到环境中的表面散热。 冷却剂具有等于或低于模块芯片的最大预选工作温度的沸点。
    • 4. 发明申请
    • GAMING HEADSET WITH INTEGRATED MICROPHONE AND ADAPTED FOR OLFACTORY STIMULATION
    • 具有集成麦克风的游戏头盔,适用于OLFACTORY刺激
    • US20080049960A1
    • 2008-02-28
    • US11845896
    • 2007-08-28
    • Ryan PetersenFranz Schuette
    • Ryan PetersenFranz Schuette
    • H04R25/00
    • H04R1/083H04R1/028
    • A gaming headset adapted for precise delivery of chemical substances capable of olfactory stimulation, such as odorants, fragrances, pheromones, etc. The headset includes at least one earpiece containing a speaker, a feature for securing the earpiece to the person's head while positioning the speaker over one of the person's ears when the headset is worn, an armature disposed relative to the earpiece so as to extend toward the person's mouth, a microphone located on the armature so as to be located in front of the person's mouth, and a feature supported by and extending along the armature for delivering at least one chemical substance to the person's nostril's when the headset is worn.
    • 适用于精确输送能够嗅觉刺激的化学物质的游戏耳机,例如气味剂,香料,信息素等。头戴式耳机包括至少一个包含扬声器的耳塞,用于将耳机固定到人的头部并将扬声器定位的特征 在耳机佩戴时超过人的耳朵之一,相对于耳机设置的电枢朝向人的嘴部延伸,位于电枢上的麦克风位于人的嘴前面,并且支撑的特征 沿着衔铁延伸并在耳机佩戴时将至少一种化学物质递送到人的鼻孔。
    • 6. 发明申请
    • METHOD AND APPARATUS FOR COOLING COMPUTER MEMORY
    • 用于冷却计算机存储器的方法和装置
    • US20080291630A1
    • 2008-11-27
    • US12127133
    • 2008-05-27
    • Mohasit MonhRyan Petersen
    • Mohasit MonhRyan Petersen
    • H05K7/20
    • H01L23/427F28D15/0266H01L2924/0002H01L2924/00
    • A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips.
    • 一种用于在计算机存储器模块上冷却芯片的方法和装置。 该装置包括主和二次散热器,至少第一热管与第一散热器相连,并且具有与初级散热器间隔开并与第二散热器热接触的远端部分,以及第一热管内的冷却剂和 初级散热器,以便从主散热器吸收热量并将热量传导到二次散热器。 主散热器具有至少两个配置成与其间的存储器模块接合的面板,面板的面对的接触表面适于与模块芯片热接触。 二次散热器被配置为增加热量从第一热管到环境中的表面散热。 冷却剂具有等于或低于模块芯片的最大预选工作温度的沸点。
    • 7. 发明申请
    • INTEGRATED SRAM CACHE FOR A MEMORY MODULE AND METHOD THEREFOR
    • 用于存储器模块的集成SRAM缓存及其方法
    • US20070005902A1
    • 2007-01-04
    • US11164838
    • 2005-12-07
    • Ryan PetersenFranz Schuette
    • Ryan PetersenFranz Schuette
    • G06F12/00G06F13/00
    • G06F12/0862G06F12/0893G06F2212/3042
    • A memory module having at least one random access memory device and a memory bus on a substrate. The memory module further comprises an SRAM cache interfaced with the random access memory device through an ASIC associated with the SRAM cache and operable as a prefetch controller for the SRAM cache. The ASIC and SRAM cache cooperate to enable data to be prefetched and cached during idle cycles of the memory device, thereby increasing the overall operating speed of the memory circuit by minimizing latencies should the prefetched data be requested. The ASIC can be programmed to prefetch not only data from the originally accessed row during a read operation, but also to speculatively prefetch data from logically coherent rows in order to anticipate and counteract a page miss and the associated latencies based on the locality of data.
    • 一种在基板上具有至少一个随机存取存储器件和存储器总线的存储器模块。 存储器模块还包括通过与SRAM高速缓存相关联的ASIC与随机存取存储器设备连接的SRAM高速缓存,并且可用作用于SRAM缓存的预取控制器。 ASIC和SRAM缓存协作以使数据在存储器件的空闲周期期间被预取和高速缓存,从而通过在请求预取数据的情况下最小化延迟来增加存储器电路的总体操作速度。 ASIC可以被编程为在读取操作期间不仅从原始访问的行预取数据,而且还可以从逻辑上相干行推测性地预取数据,以便基于数据的位置来预测和抵消页面未命中和相关联的延迟。
    • 9. 发明申请
    • MEMORY MODULE WITH REDUCED INPUT CLOCK SKEW
    • 具有减少输入时钟轴的存储模块
    • US20060056214A1
    • 2006-03-16
    • US11161977
    • 2005-08-24
    • Ryan PetersenEric Nelson
    • Ryan PetersenEric Nelson
    • G11C5/02
    • G11C5/04G11C7/22G11C7/222
    • A memory module capable of exhibiting reduced input clock skew. More particularly, an unbuffered memory module that comprises a substrate, multiple memory components mounted to the substrate, and input/output and address and command bus connectors that transmit digital information to and from the memory components further includes a phase lock loop (PLL) circuit that electrically interconnects a clock-in connector to the memory components for generating and transmitting a module clock signal to the memory components without routing any information to the memory components through a register. In this manner, the PLL operates to provide the memory module with an onboard clock generator that synchronizes the memory components of the module.
    • 能够显示减少的输入时钟偏移的存储器模块。 更具体地,包括衬底,安装到衬底的多个存储器组件以及向存储器组件传送数字信息的输入/输出以及地址和命令总线连接器的无缓冲存储器模块还包括锁相环(PLL)电路 将时钟输入连接器电连接到存储器组件,用于生成模块时钟信号并将其发送到存储器组件,而不通过寄存器将任何信息路由到存储器组件。 以这种方式,PLL操作以向存储器模块提供同步模块的存储器组件的板载时钟发生器。