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    • 1. 发明授权
    • Pressure proportioning regulator valve and vane machine including same
    • 压力比例调节阀和叶片机包括它
    • US5961307A
    • 1999-10-05
    • US906563
    • 1997-08-05
    • Al KeyGregory LemkeCharles W. MeinkeRonald J. Schilling
    • Al KeyGregory LemkeCharles W. MeinkeRonald J. Schilling
    • F15B13/04F01C1/344F01C21/16G05D7/01
    • F15B13/0402Y10T137/2544
    • The simple and economical pressure proportioning regulator valve can maintain a constant pressure ratio of the pressure at its inlet (13) to the pressure in its outlet duct (14), especially during negative pressure changes at the inlet (13). The pressure proportioning regulator valve has a valve housing (11) provided with a throughgoing passage (12) having an inlet (13) and an outlet duct (14); a valve gate (22) in the throughgoing passage (12) having a pressing surface (43) acted on by a pressure at the inlet (13) and another pressing surface (44) acted on by a pressure in the outlet duct (14); a device for reducing both pressures while maintaining their pressure ratio including a first control edge (29) arranged on the valve gate (22) between the inlet (13) and the outlet duct (14) and a device for controlling a flow of a pressurized medium between the outlet duct (14) and the return duct (15) including a second control edge (30) provided on the control member (23) of the valve gate (22). This rapidly reacting pressure proportioning regulator valve (10) does not have a valve spring and thus is not subjected to wear and/or fatigue in the course of its life.
    • 简单和经济的压力比例调节阀可以保持其入口(13)处的压力与其出口管道(14)中的压力的​​恒定压力比,特别是在入口(13)处的负压变化期间。 所述压力比例调节阀具有设置有具有入口(13)和出口导管(14)的通过通道(12)的阀壳体(11)。 所述通孔(12)中的阀门(22)具有通过所述入口(13)处的压力和由所述出口管道(14)中的压力作用的另一个按压表面(44)起作用的按压表面(43) ; 一种用于在保持其压力比的同时降低压力的装置,包括设置在入口(13)和出口管道(14)之间的阀门(22)上的第一控制边缘(29)和用于控制加压 出口管道(14)和返回管道(15)之间的介质包括设置在阀门(22)的控制构件(23)上的第二控制边缘(30)。 这种快速反应的压力比例调节阀(10)不具有阀弹簧,因此在其使用寿命期间不会受到磨损和/或疲劳。
    • 2. 发明授权
    • Solenoid assembly with shock absorbing feature
    • 具有减震功能的电磁阀总成
    • US07864008B2
    • 2011-01-04
    • US12255730
    • 2008-10-22
    • Ronald J. Schilling
    • Ronald J. Schilling
    • H01F7/08
    • H01F7/1615H01F7/088
    • A solenoid assembly includes a solenoid having a coil provided with a passageway and a plunger movable within the passageway upon application of electrical power to the coil. A frame holds the solenoid and includes a backstop movably mounted in the frame extending into the coil passageway. The backstop is selectively engaged by the plunger such that the backstop and the plunger are subjected to an impact therebetween. A resilient dampening element is positioned between the frame and the backstop for cushioning the impact between the backstop and the plunger.
    • 螺线管组件包括螺线管,螺线管具有设置有通道的线圈和在向线圈施加电力时可在通道内移动的柱塞。 一个框架保持螺线管并且包括可移动地安装在延伸到线圈通道中的框架中的逆止器。 反向挡块选择性地被柱塞接合,使得止回和柱塞在它们之间受到冲击。 弹性阻尼元件定位在框架和支撑件之间,用于缓冲止杆和柱塞之间的冲击。
    • 5. 发明授权
    • Integrated optics device mounting for thermal and high g-shock isolation
    • 集成光学元件安装用于热和高抗震隔离
    • US5074630A
    • 1991-12-24
    • US594539
    • 1990-10-09
    • Vincent D. RodinoRonald J. Schilling
    • Vincent D. RodinoRonald J. Schilling
    • G02B6/12G02B6/122G02B6/30G02B7/00
    • G02B7/008G02B6/122G02B6/30
    • An integrated optics (IO) chip comprising an optical signal path disposed in a principal plane of a crystalline chip having a known chip thickness, anisotropic thermal characteristics, and crystallographic orientation, is mounted to a first surface of a similar thermally anisotropic crystalline material substrate. A second surface of the substrate, spaced from the first surface at a substrate thickness approaching the known chip thickness, is bonded to a mounting surface with a visco-elastic polymer adhesive. Employing this adhesive allows a substantial reduction in the thickness of the substrate as compared to the thickness of the IO chip while allowing vibration and high G-shock loads to be imparted on the structure without affecting the electro-optical properties of the IO chip.
    • 包括设置在具有已知芯片厚度,各向异性热特性和晶体取向的晶体芯片的主平面中的光信号路径的集成光学(IO)芯片安装在类似的热各向异性结晶材料基板的第一表面上。 在接近已知芯片厚度的基板厚度处与第一表面间隔开的衬底的第二表面用粘弹性聚合物粘合剂粘合到安装表面。 使用该粘合剂可以显着降低基板的厚度,与IO芯片的厚度相比,同时允许在结构上施加振动和高G-冲击载荷,而不影响IO芯片的电光特性。