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1. 发明授权

US07844892B2 Method and system for display of business intelligence data 有权
标题翻译：显示商业智能数据的方法和系统
公开(公告)号：US07844892B2
公开(公告)日：2010-11-30
申请号：US11465315
申请日：2006-08-17
申请人： Nadia Shewchenko , Henning Hoffmann , Roger Chang , Lesley Grignon
发明人： Nadia Shewchenko , Henning Hoffmann , Roger Chang , Lesley Grignon
IPC分类号： G06F17/00
CPC分类号： G06F17/30572 , G06F3/0481 , G06F3/0485
摘要： The invention provides improved mechanisms for the construction and rendering of graphical results sets for business intelligence reports derived from large volumes of data. This is achieved by various means including, determining the amount of useful data that can be rendered within the available display space while still being legible, determining the most effective way of displaying that data within the display space, and providing for limited control of the format and quantity of data displayed.
摘要翻译：本发明提供用于构建和呈现由大量数据导出的商业智能报告的图形结果集的改进机制。这通过各种手段来实现，包括确定在可用的显示空间内可呈现的有用数据的数量，同时仍然可读，确定在显示空间内显示该数据的最有效的方式，以及提供格式的有限控制和显示的数据量。

2. 发明申请

US20080057627A1 Method of manufacturing a combined multilayer circuit board having embedded chips 有权
标题翻译：制造具有嵌入式芯片的组合多层电路板的方法
公开(公告)号：US20080057627A1
公开(公告)日：2008-03-06
申请号：US11511462
申请日：2006-08-29
申请人： Roger Chang
发明人： Roger Chang
IPC分类号： H01L21/00 , H05K3/36
CPC分类号： H05K1/187 , H01L21/4857 , H01L21/486 , H01L23/5389 , H01L24/48 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , H01L2924/19043 , H05K1/186 , H05K3/28 , H05K3/4623 , H05K3/4652 , H05K2201/0358 , H05K2201/09536 , H05K2201/10674 , H05K2203/063 , H05K2203/068 , H05K2203/085 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method has acts of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.
摘要翻译：一种方法具有提供至少两个多层电路板的动作，组合至少两个多层电路板以形成组合的多层电路板，在组合的多层电路板上形成多个外部导电通孔，电路和触点。每个多层电路板通过制备具有多个芯片部分的单层印刷电路板的步骤制造，将至少一个芯片附接到相应的芯片部分，将具有多个外壳的框架附接到单层印刷电路板，半流体胶片到框架，真空挤压半流体胶片上的导电层，并通过多层电路板形成多个导电内通孔。所述至少两个多层电路板通过反转多层电路板中的一个并在反向多层电路板上真空压制其它多层电路板的步骤组合。

3. 发明申请

US20080046805A1 Method and System for Display Of Business Intelligence Data 有权
标题翻译：商业智能数据显示方法与系统
公开(公告)号：US20080046805A1
公开(公告)日：2008-02-21
申请号：US11465315
申请日：2006-08-17
申请人： Nadia Shewchenko , Henning Hoffmann , Roger Chang , Lesley Grignon
发明人： Nadia Shewchenko , Henning Hoffmann , Roger Chang , Lesley Grignon
IPC分类号： G06F17/00 , G06Q10/00 , G06F17/30 , G06F9/44 , G06T11/20 , G06F3/048
CPC分类号： G06F17/30572 , G06F3/0481 , G06F3/0485
摘要： The invention provides improved mechanisms for the construction and rendering of graphical results sets for business intelligence reports derived from large volumes of data. This is achieved by various means including, determining the amount of useful data that can be rendered within the available display space while still being legible, determining the most effective way of displaying that data within the display space, and providing for limited control of the format and quantity of data displayed.
摘要翻译：本发明提供用于构建和呈现由大量数据导出的商业智能报告的图形结果集的改进机制。这通过各种手段来实现，包括确定在可用的显示空间内可呈现的有用数据的数量，同时仍然可读，确定在显示空间内显示该数据的最有效的方式，以及提供格式的有限控制和显示的数据量。

4. 发明申请

US20070295606A1 MANUFACTURING PROCESS OF EMBEDDED TYPE FLEXIBLE OR RIGID PRINTED CIRCUIT BOARD 有权
标题翻译：嵌入式柔性或刚性印刷电路板的制造工艺
公开(公告)号：US20070295606A1
公开(公告)日：2007-12-27
申请号：US11850830
申请日：2007-09-06
申请人： Roger Chang
发明人： Roger Chang
IPC分类号： C25D5/02
CPC分类号： H05K3/205 , C25D7/00 , H05K1/0393 , H05K3/064 , H05K3/386 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2203/0384 , H05K2203/1105
摘要： A manufacturing process of an embedded type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the copper foil according to the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic layer and the organic layer is solidified.
摘要翻译：嵌入式柔性或刚性印刷电路板的制造工艺包括多个步骤。首先，将一层干膜施加到一层铜箔上。然后通过光刻工艺在铜箔上形成电路图案。根据电路图案，在铜箔上电镀蚀刻停止层。然后用铜电镀蚀刻停止层。去除干膜后，铜箔通过高温处理软化。然后在用有机层涂覆之后蚀刻铜箔层，有机层固化。

5. 发明授权

US07297285B2 Manufacturing process of emboss type flexible or rigid printed circuit board 有权
标题翻译：浮雕型柔性或刚性印刷电路板的制造工艺
公开(公告)号：US07297285B2
公开(公告)日：2007-11-20
申请号：US11197332
申请日：2005-08-05
申请人： Roger Chang
发明人： Roger Chang
IPC分类号： H01B13/00
CPC分类号： H05K3/205 , H05K1/0393 , H05K3/064 , H05K3/386 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2203/0384 , H05K2203/1105
摘要： A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic surface layer and the organic surface layer is solidified.
摘要翻译：压花型柔性或刚性印刷电路板的制造方法包括多个步骤。首先，将一层干膜施加到一层铜箔上。然后通过光刻工艺在铜箔上形成电路图案。蚀刻停止层电镀在电路图案上。然后用铜电镀蚀刻停止层。去除干膜后，铜箔通过高温处理软化。然后在涂覆有机表面层之后蚀刻铜箔层，并且有机表面层固化。

6. 发明授权

US06978817B2 Method for manufacturing fluoropolymer compound plate and device for manufacturing the same 有权
标题翻译：氟聚合物复合板的制造方法及其制造装置
公开(公告)号：US06978817B2
公开(公告)日：2005-12-27
申请号：US10371424
申请日：2003-02-17
申请人： Amber Ho , Roger Chang
发明人： Amber Ho , Roger Chang
IPC分类号： B32B27/30 , B29C43/30 , B29C65/14 , B29C65/82 , B29K27/12 , B29L9/00 , B32B37/04 , B32B31/04
CPC分类号： B29C43/30 , B29C2071/022 , B29K2027/12 , B29K2027/18 , B29L2009/00 , B32B37/04 , B32B38/0036 , B32B2038/0048 , B32B2310/0806 , B32B2315/085 , B32B2327/06 , B32B2327/12 , Y10T156/1712 , Y10T156/1741
摘要： A method for manufacturing a fluoropolymer compound plate comprises the steps of: combining a fluoropolymer sheet and a medium plate as a fluoropolymer compound plate; transferring the fluoropolymer compound plate to a preheat section for being heated uniformly in a lower tension, transferring the fluoropolymer compound plate to a melting section for heating the fluoropolymer sheet of the fluoropolymer compound plate; transferring the fluoropolymer compound plate to a pressing section by rollers; and compressing and annealing the fluoropolymer compound plate. A device for performing the method comprises a plurality of tension adjusting axial seats; a plurality of roller; a pair of first guide wheels; an upper and a lower layer radiating heater; a third guide wheel set; an upper and a lower layer high temperature radiating heater; a guiding roller; a shaping heater; a plurality of temperature controller roller sets and a product winding wheel.
摘要翻译：含氟聚合物化合物板的制造方法包括以下步骤：将氟聚合物片和介质板作为含氟聚合物复合板组合; 将含氟聚合物化合物板转移到预热部分，以便以较低的张力均匀地加热，将含氟聚合物化合物板转移到用于加热含氟聚合物化合物板的含氟聚合物片材的熔化部分; 通过辊将含氟聚合物复合板转移到按压部分; 并对氟聚合物复合板进行压缩退火。用于执行该方法的装置包括多个张力调节轴向座; 多个辊子; 一对第一导轮; 上层和下层辐射加热器; 第三导轮组; 上下一层高温辐射加热器; 导辊; 成型加热器; 多个温度控制器辊组和产品卷绕轮。

7. 发明申请

US20050248259A1 Bent lead light emitting diode device having a heat dispersing capability 审中-公开
标题翻译：具有散热能力的弯曲引线发光二极管器件
公开(公告)号：US20050248259A1
公开(公告)日：2005-11-10
申请号：US10841531
申请日：2004-05-10
申请人： Roger Chang
发明人： Roger Chang
IPC分类号： H01L29/22 , H01L33/48 , H01L33/62 , H01L33/64
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： A bent lead light emitting diode device having a heat dissipating capability mainly has a flat chip seat, a horizontal and vertical separation layers, at least two bent leads, at least one light emitting diode chip and a transparent cover. A tapered recess is defined in an upper flat surface of the chip seat where the light emitting diode chip is mounted. The bent leads arranged around the chip seat are separated from the chip seated by the horizontal and vertical separation layers and connected to the chip wire bondings. When the bent lead light emitting diode device is operating, heat is conducted away by the chip seat. The chip seat is flat so the horizontal and vertical separation layers between the chip seat and the bent leads do not have to be a specific shape.
摘要翻译：具有散热能力的弯曲引线发光二极管器件主要具有平坦的芯片座，水平和垂直分隔层，至少两个弯曲引线，至少一个发光二极管芯片和透明盖。锥形凹部限定在安装有发光二极管芯片的芯片座的上平坦表面中。围绕芯片座设置的弯曲引线与由水平和垂直分离层安置的芯片分离，并连接到芯片引线接合。当弯曲的引线型发光二极管器件工作时，芯片座上的热被传导掉。芯片座是平坦的，因此芯片座与弯曲引线之间的水平和垂直分隔层不必是特定的形状。

8. 发明授权

US07603771B2 Method of manufacturing a combined multilayer circuit board having embedded chips 有权
标题翻译：制造具有嵌入式芯片的组合多层电路板的方法
公开(公告)号：US07603771B2
公开(公告)日：2009-10-20
申请号：US11511462
申请日：2006-08-29
申请人： Roger Chang
发明人： Roger Chang
IPC分类号： H01K3/10
CPC分类号： H05K1/187 , H01L21/4857 , H01L21/486 , H01L23/5389 , H01L24/48 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , H01L2924/19043 , H05K1/186 , H05K3/28 , H05K3/4623 , H05K3/4652 , H05K2201/0358 , H05K2201/09536 , H05K2201/10674 , H05K2203/063 , H05K2203/068 , H05K2203/085 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by the steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.
摘要翻译：提供至少两个多层电路板的方法，组合所述至少两个多层电路板以形成组合的多层电路板，以及在所述组合多层电路板上形成多个外部导电通孔，电路和触点。每个多层电路板通过以下步骤制造：制备具有多个芯片部分的单层印刷电路板，将至少一个芯片附接到相应的芯片部分，将具有多个外壳的框架附接到单层印刷电路板，附接将半流体胶片粘贴到框架上，对半流体胶片上的导电层进行真空加压，并通过多层电路板形成多个导电内通孔。所述至少两个多层电路板通过反转多层电路板中的一个并在反向多层电路板上真空压制其它多层电路板的步骤组合。

9. 发明申请

US20070029204A1 Manufacturing process of emboss type flexible or rigid printed circuit board 有权
公开(公告)号：US20070029204A1
公开(公告)日：2007-02-08
申请号：US11197332
申请日：2005-08-05
申请人： Roger Chang
发明人： Roger Chang
IPC分类号： B05D5/12 , C25D5/02
CPC分类号： H05K3/205 , H05K1/0393 , H05K3/064 , H05K3/386 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2203/0384 , H05K2203/1105
摘要： A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic surface layer and the organic surface layer is solidified.

10. 发明申请

US20060005112A1 System and method of report layout 审中-公开
标题翻译：报告布局的系统和方法
公开(公告)号：US20060005112A1
公开(公告)日：2006-01-05
申请号：US10884012
申请日：2004-07-02
申请人： David Lilly , Eric McCully , Roger Chang
发明人： David Lilly , Eric McCully , Roger Chang
IPC分类号： G06F15/00 , G06F17/00
CPC分类号： G06F17/211 , G06F17/248
摘要： A conditional layout system for rendering and formatting content in a report is provided. The conditional layout system comprises an element receiving unit for receiving a variable element referenced in a report element, a condition processing unit for calculating a condition value based upon an expression in the variable element, and an element rendering unit for conditionally rendering and formatting report elements based upon the condition value.
摘要翻译：提供了一种用于在报告中呈现和格式化内容的条件布局系统。条件布局系统包括用于接收在报告元素中引用的可变元素的元素接收单元，用于基于可变元素中的表达式计算条件值的条件处理单元和用于有条件地呈现和格式化报告元素的元素渲染单元基于条件值。

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