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    • 9. 发明授权
    • Methods for fabricating integrated circuits with narrow, metal filled openings
    • 用于制造具有窄的金属填充开口的集成电路的方法
    • US08652890B2
    • 2014-02-18
    • US13408291
    • 2012-02-29
    • Sven SchmidbauerDina H. TriyosoElke ErbenHao ZhangRobert Binder
    • Sven SchmidbauerDina H. TriyosoElke ErbenHao ZhangRobert Binder
    • H01L21/338
    • H01L29/66545H01L21/28088H01L29/4966H01L29/51H01L29/7833
    • Methods are provided for fabricating an integrated circuit that includes metal filled narrow openings. In accordance with one embodiment a method includes forming a dummy gate overlying a semiconductor substrate and subsequently removing the dummy gate to form a narrow opening. A layer of high dielectric constant insulator and a layer of work function-determining material are deposited overlying the semiconductor substrate. The layer of work function-determining material is exposed to a nitrogen ambient in a first chamber. A layer of titanium is deposited into the narrow opening in the first chamber in the presence of the nitrogen ambient to cause the first portion of the layer of titanium to be nitrided. The deposition of titanium continues, and the remaining portion of the layer of titanium is deposited as substantially pure titanium. Aluminum is deposited overlying the layer of titanium to fill the narrow opening and to form a gate electrode.
    • 提供了用于制造包括金属填充的窄开口的集成电路的方法。 根据一个实施例,一种方法包括形成覆盖半导体衬底的虚拟栅极,随后去除虚拟栅极以形成窄的开口。 在半导体衬底上沉积一层高介电常数绝缘体和一层功函数确定材料。 工作层功能确定材料暴露于第一室中的氮气环境。 在氮气环境的存在下,将钛层沉积在第一室中的窄开口中,以使钛层的第一部分被氮化。 钛的沉积继续,并且钛层的剩余部分沉积为基本上纯的钛。 沉积铝覆盖在钛层上以填充窄开口并形成栅电极。