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    • 3. 发明授权
    • Patterned kill of magnetoresistive layer in bubble domain chip
    • 在气泡区芯片中图案化的磁阻层的杀死
    • US4308592A
    • 1981-12-29
    • US53489
    • 1979-06-29
    • Richard P. McGouey
    • Richard P. McGouey
    • G11C11/14H01F10/00H01F41/34G11C19/08
    • H01F41/34
    • A technique and structure is described in which bubble domain devices can be made, and particularly bubble domain devices comprisng contiguous propagation elements. A thin magnetoresistive layer, such as permalloy, is blanket deposited over a substrate including a bubble domain film, and is then selectively "poisoned" to destroy its magnetization except in those areas where thin sensors are to be provided. The poisoned portions of the magnetoresistive layer serve as a plating base for conductor metallurgy which can be used as an ion implantation mask, and for carrying electrical current. This eliminates some process steps which had been required in the prior art, and does not leave magnetic permalloy in those areas of the bubble domain chip were they would adversely affect propagation of domains by ion implanted contiguous propagation elements. This technique can also be used to make bubble domain devices having gapped propagation elements.
    • 描述了可以制造气泡域装置的技术和结构,特别是包括连续传播元件的气泡域装置。 诸如坡莫合金之类的薄磁阻层被覆盖在包括气泡区域膜的衬底上,然后被选择性地“中毒”以破坏其磁化,除了在那些提供薄传感器的区域中。 磁阻层的中毒部分用作导体冶金的电镀基底,其可以用作离子注入掩模,并且用于承载电流。 这消除了现有技术中已经需要的一些工艺步骤,并且在气泡区域芯片的那些区域中不留下磁性坡莫合金,它们会不利地影响离子注入的连续传播元件的畴的传播。 该技术也可用于制备具有间隙传播元件的气泡域装置。