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1. 发明申请

US20090295870A1 NOZZLE PLATE FOR IMPROVED POST-BONDING SYMMETRY 有权
标题翻译：喷嘴板改进后绑定对称
公开(公告)号：US20090295870A1
公开(公告)日：2009-12-03
申请号：US12131953
申请日：2008-06-03
申请人： Richard Louis Goin , Christopher Elliot Lingle
发明人： Richard Louis Goin , Christopher Elliot Lingle
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2/162 , B41J2/1623 , B41J2/1634 , B41J2202/11
摘要： A nozzle plate for bonding to a chip for configuring a printhead of a printing device is disclosed. The chip comprises a plurality of energizing elements. The nozzle plate comprises a substrate layer, an adhesive layer and a plurality of nozzle holes perforated in the substrate layer and the adhesive layer. The each nozzle hole is capable of being associated with an energizing element of the plurality of energizing elements. The each nozzle hole comprises an asymmetric flow-feature configured by ablating at least a portion of a wall of the each nozzle hole prior to bonding the nozzle plate to the chip. The nozzle plate provides a substantially symmetrical flow-feature for the each nozzle hole on bonding to the chip.
摘要翻译：公开了一种用于结合到用于配置打印装置的打印头的芯片的喷嘴板。芯片包括多个激励元件。喷嘴板包括基材层，粘合剂层和在基材层和粘合剂层中穿孔的多个喷嘴孔。每个喷嘴孔能够与多个激励元件的激励元件相关联。每个喷嘴孔包括不对称流动特征，其在将喷嘴板粘合到芯片之前，通过烧蚀每个喷嘴孔的至少一部分壁而构成。喷嘴板在结合到芯片上时为每个喷嘴孔提供基本对称的流动特征。

2. 发明授权

US07244014B2 Micro-fluid ejection devices and method therefor 有权
标题翻译：微流体喷射装置及其方法
公开(公告)号：US07244014B2
公开(公告)日：2007-07-17
申请号：US10694679
申请日：2003-10-28
申请人： Richard Louis Goin , Colin Geoffrey Maher , James Harold Powers
发明人： Richard Louis Goin , Colin Geoffrey Maher , James Harold Powers
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1404 , B41J2/1634
摘要： An improved ink jet printhead for an ink jet printer and method therefor. The printhead includes a semiconductor substrate containing ink ejection devices. A thick film layer is attached to the substrate. A nozzle plate is attached to the thick film layer. The nozzle plate contains a plurality of ink ejection nozzles corresponding to the ink ejection devices. The printhead contains flow features having a height dimension and a width dimension formed therein for flow of ink to the plurality of ink ejection devices for ejection through the nozzles. At least a portion of the flow feature dimensions for at least one of the nozzles is formed in both the thick film layer and laser ablated in the nozzle plate, wherein the thick film layer contains at least 12% of the flow feature dimensions.
摘要翻译：用于喷墨打印机的改进的喷墨打印机及其方法。打印头包括含有喷墨装置的半导体基板。将厚膜层附着在基板上。喷涂板附着在厚膜层上。喷嘴板包括与喷墨装置对应的多个喷墨喷嘴。打印头包含具有形成在其中的高度尺寸和宽度尺寸的流动特征，用于将油墨流动到多个喷墨装置以通过喷嘴喷射。至少一个喷嘴的流动特征尺寸的至少一部分形成在喷嘴板中的厚膜层和激光烧蚀两者中，其中厚膜层包含至少12％的流动特征尺寸。

3. 发明申请

US20120024471A1 NOZZLE PLATE FOR IMPROVED POST-BONDING SYMMETRY 审中-公开
标题翻译：喷嘴板改进后绑定对称
公开(公告)号：US20120024471A1
公开(公告)日：2012-02-02
申请号：US13267124
申请日：2011-10-06
申请人： Richard Louis Goin , Christopher Elliot Lingle
发明人： Richard Louis Goin , Christopher Elliot Lingle
IPC分类号： B32B37/02 , B32B37/10 , B29C35/08 , B32B37/14 , B32B38/10 , B32B37/06 , B32B37/12
CPC分类号： B41J2/1433 , B41J2/162 , B41J2/1623 , B41J2/1634 , B41J2202/11
摘要： A nozzle plate for bonding to a chip for configuring a printhead of a printing device is disclosed. The chip comprises a plurality of energizing elements. The nozzle plate comprises a substrate layer, an adhesive layer and a plurality of nozzle holes perforated in the substrate layer and the adhesive layer. The each nozzle hole is capable of being associated with an energizing element of the plurality of energizing elements. The each nozzle hole comprises an asymmetric flow-feature configured by ablating at least a portion of a wall of the each nozzle hole prior to bonding the nozzle plate to the chip. The nozzle plate provides a substantially symmetrical flow-feature for the each nozzle hole on bonding to the chip.
摘要翻译：公开了一种用于结合到用于配置打印装置的打印头的芯片的喷嘴板。芯片包括多个激励元件。喷嘴板包括基材层，粘合剂层和在基材层和粘合剂层中穿孔的多个喷嘴孔。每个喷嘴孔能够与多个激励元件的激励元件相关联。每个喷嘴孔包括不对称流动特征，其在将喷嘴板粘合到芯片之前，通过烧蚀每个喷嘴孔的至少一部分壁而构成。喷嘴板在结合到芯片上时为每个喷嘴孔提供基本对称的流动特征。

4. 发明授权

US08328330B2 Nozzle plate for improved post-bonding symmetry 有权
标题翻译：喷嘴板用于改善后粘合对称性
公开(公告)号：US08328330B2
公开(公告)日：2012-12-11
申请号：US12131953
申请日：2008-06-03
申请人： Richard Louis Goin , Christopher Elliot Lingle
发明人： Richard Louis Goin , Christopher Elliot Lingle
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2/162 , B41J2/1623 , B41J2/1634 , B41J2202/11
摘要： A nozzle plate for bonding to a chip for configuring a printhead of a printing device is disclosed. The chip comprises a plurality of energizing elements. The nozzle plate comprises a substrate layer, an adhesive layer and a plurality of nozzle holes perforated in the substrate layer and the adhesive layer. The each nozzle hole is capable of being associated with an energizing element of the plurality of energizing elements. The each nozzle hole comprises an asymmetric flow-feature configured by ablating at least a portion of a wall of the each nozzle hole prior to bonding the nozzle plate to the chip. The nozzle plate provides a substantially symmetrical flow-feature for the each nozzle hole on bonding to the chip.
摘要翻译：公开了一种用于结合到用于配置打印装置的打印头的芯片的喷嘴板。芯片包括多个激励元件。喷嘴板包括基材层，粘合剂层和在基材层和粘合剂层中穿孔的多个喷嘴孔。每个喷嘴孔能够与多个激励元件的激励元件相关联。每个喷嘴孔包括不对称流动特征，其在将喷嘴板粘合到芯片之前，通过烧蚀每个喷嘴孔的至少一部分壁而构成。喷嘴板在结合到芯片上时为每个喷嘴孔提供基本对称的流动特征。

5. 发明授权

US06536872B2 Connection module 有权
标题翻译：连接模块
公开(公告)号：US06536872B2
公开(公告)日：2003-03-25
申请号：US09930767
申请日：2001-08-16
申请人： Richard Louis Goin , Steven Robert Komplin , Brian David Smith , Brandon Sung-Hwan Song
发明人： Richard Louis Goin , Steven Robert Komplin , Brian David Smith , Brandon Sung-Hwan Song
IPC分类号： B41J201
CPC分类号： B41J2/17553 , B41J2/1752 , B41J2/1753 , H05K3/365
摘要： A connection module including a base including a forward set of points located in a forward plane and a rearward set of points located in a rearward plane, the forward and rearward planes defining a junction therebetween. The connection module further includes a cable including a plurality of contacts located thereon, each contact being shaped and located to engage one of the points. The connection module has a backing element including a piece of sheet-like material, a set of contact protrusions on the piece of material, and at least one stiffening element on the piece of material. Each of the contact protrusions is shaped and located to engage the cable and urge one of the contacts into engagement with one of the points. The stiffening element is generally aligned with the junction when the contact protrusions engage the cable and urge the contacts into engagement with one of the points.
摘要翻译：一种连接模块，包括基座，该基座包括位于前平面中的正向一组点和位于后方平面中的后向组，所述前平面和后平面限定了它们之间的接合部。连接模块还包括电缆，该电缆包括位于其上的多个触点，每个触点被成形和定位以接合一个点。连接模块具有背衬元件，该背衬元件包括一片片状材料，该片材料上的一组接触突起，以及该材料片上的至少一个加强元件。每个接触突起被成形和定位成接合电缆并且促使触点之一与其中一个点接合。当接触突起接合电缆并且促使触点与这些点中的一个接合时，加强元件通常与接合部对准。

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