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    • 5. 发明授权
    • Method and apparatus for ablative bonding using a pulsed electron
    • 使用脉冲电子进行烧蚀接合的方法和装置
    • US5897794A
    • 1999-04-27
    • US791305
    • 1997-01-30
    • Richard F. HubbardAmnon Fisher
    • Richard F. HubbardAmnon Fisher
    • B23K15/00
    • B23K15/0006
    • A method and apparatus for bonding a layer of coating or cladding material onto a substrate with minimal bulk heating of the substrate. A pulsed electron beam generator is used to produce high energy electrons at the beginning of the pulse and a larger number of lower energy electrons at the end of the pulse. A thin sacrificial or ablative layer of an easily-vaporized material such as tin is placed on top the coating. The high energy electrons penetrate through the ablative and coating layers and heat the coating-substrate interface. The ablative layer is then heated by the low energy electrons to a much higher temperature, causing it to vaporize. The ablation process generates a force on the coating layer which drives it into the substrate.
    • 一种用于将涂层或包层材料层以基板的最小体积加热结合到基底上的方法和装置。 脉冲电子束发生器用于在脉冲开始时产生高能电子,在脉冲结束时使用较大数量的较低能量的电子。 将易于蒸发的材料(例如锡)的薄牺牲层或烧蚀层放置在涂层的顶部。 高能电子穿透烧蚀层和涂层,并加热涂层 - 基底界面。 然后将可烧蚀层由低能电子加热到更高的温度,使其蒸发。 消融过程在涂层上产生一个力,将其驱动到衬底中。