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1. 发明授权

US06483699B1 Baffle system for air cooled computer assembly 有权
标题翻译：风冷电脑组装挡板系统
公开(公告)号：US06483699B1
公开(公告)日：2002-11-19
申请号：US09619818
申请日：2000-07-20
申请人： Richard B. Salmonson , David Paul Gruber , Stephen A. Bowen
发明人： Richard B. Salmonson , David Paul Gruber , Stephen A. Bowen
IPC分类号： H05K720
CPC分类号： H05K7/20727 , G06F1/20
摘要： An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly providing air flow across the PCB assembly. The printed circuit board assembly has a top side and a bottom side, including heat producing components on the top side and bottom side. A portion of the heat producing components are DIMM memory positioned perpendicular to the direction of air flow. The computer assembly also includes an air baffling system positioned proximate to the PCB assembly. The air baffling system divides and balances the air flow between the heat producing components so that each of the components are adequately cooled. The air baffling system includes a flat baffle and pair of curved baffles. The flat baffle is positioned perpendicular to the direction of the air flow and is positioned between and in front of two 40 watt memory. The curved baffles are positioned adjacent to the two memory ASICs. One curved baffle is positioned between one memory ASIC and the outside of the PCB assembly and the other curved baffle is positioned between the other memory ASIC and the opposite side of the PCB assembly. The curved baffles include a curved portion, an extended portion and a front portion. The heat producing components include memory DIMMS, 4 130 watt microprocessors, and two 40 watt memory ASICs.
摘要翻译：包括印刷电路板组件或U型外壳的空气冷却的计算机组件。计算机组件还包括位于PCB组件一端的三个120mm风扇，其提供穿过PCB组件的气流。印刷电路板组件具有顶侧和底侧，包括在顶侧和底侧上的发热部件。一部分发热部件是垂直于空气流动方向定位的DIMM存储器。计算机组件还包括位于PCB组件附近的空气挡板系统。空气挡板系统分隔和平衡发热部件之间的气流，使得每个部件都被充分冷却。空气挡板系统包括一个平的挡板和一对弯曲的挡板。平板挡板垂直于空气流的方向定位，并位于两个40瓦记忆之间和之前。弯曲的挡板位于与两个存储器ASIC相邻的位置。一个弯曲的挡板位于一个存储器ASIC和PCB组件的外部之间，另一个弯曲的挡板位于另一个存储器ASIC和PCB组件的相对侧之间。弯曲的挡板包括弯曲部分，延伸部分和前部。发热组件包括存储器DIMMS，4个130瓦的微处理器和两个40瓦的存储器ASIC。

2. 发明授权

US5963428A Cooling cap method and apparatus for tab packaged integrated circuit 有权
标题翻译：标签封装集成电路的冷却盖方法和装置
公开(公告)号：US5963428A
公开(公告)日：1999-10-05
申请号：US136908
申请日：1998-08-20
申请人： Richard B. Salmonson , Stephen Cermak, III
发明人： Richard B. Salmonson , Stephen Cermak, III
IPC分类号： H01L23/04 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/04 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002
摘要： The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap. Risers, which may be either integral to the cooling cap or separate elements, are used to lift the cooling cap above the surface of the circuit board so as to provide space for the component.
摘要翻译：本发明公开了一种用于桥接安装在电路板上的集成电路封装或部件与散热器之间的间隙的方法和装置，使得部件上施加的应力很小，但是部件和散热用于散热。本发明为精密部件包装提供机械完整性，并且在这样做时允许使用各种散热器来提供冷却。印刷电路板具有安装到电路板的集成电路封装或其它部件。由导热材料构成的冷却盖安装在电路板上，使得部件被电路板和冷却盖包围。可以在部件和冷却帽之间沉积导热材料层，以提供从部件到冷却帽的导热路径。可以将冷却帽或分离元件整体的升降器用于将冷却帽提升到电路板的表面之上，以便为部件提供空间。

3. 发明授权

US5761043A Daughter card assembly 失效
标题翻译：子卡组合
公开(公告)号：US5761043A
公开(公告)日：1998-06-02
申请号：US604839
申请日：1996-02-22
申请人： Richard B. Salmonson
发明人： Richard B. Salmonson
IPC分类号： H05K7/20
CPC分类号： H05K7/20636
摘要： A daughter card assembly which provides relatively high conductive heat transfer from the electronic components on the daughter board to either an air or liquid cooled cold plate of a computer circuit module. The daughter card assembly has a daughter board with a plurality of electronic elements carried on an element side of the board. The opposite side of the board is a cooling side. The daughter board has one or more sockets which are electrically connected to the electronic elements on the board. The socket is adapted to plug into a connector carried on a mother board of a circuit module. A thermally conductive plate is disposed adjacent to and in thermal conductive contact with the cooling side of the daughter board. The conductive plate has an inner side facing the circuit module and an outer side on the opposite side. The plate is adapted to be in thermal conductive contact with the module cold plate to dissipate heat generated by the memory elements. Preferably, the conductive plate is sandwiched between the cooling sides of a pair of daughter boards with one board abutting against the inner side and the other board abutting against the outer side of the plate.
摘要翻译：子卡组件，其提供从子板上的电子部件到计算机电路模块的空气或液体冷却的冷板的相对高的导电热传递。子卡组件具有在板的元件侧承载的多个电子元件的子板。板的相对侧是冷却侧。子板具有一个或多个插座，其电连接到电路板上的电子元件。插座适于插入电路模块母板上的连接器。导热板设置成与子板的冷却侧相邻并与其导热接触。导电板具有面向电路模块的内侧和相对侧的外侧。板适于与模块冷板导热接触以消散由存储元件产生的热量。优选地，导电板被夹在一对子板的冷却侧之间，其中一个板抵靠内侧，而另一个板抵靠板的外侧。

4. 发明授权

US5694028A Method and apparatus for adjusting the power supply voltage provided to a microprocessor 失效
标题翻译：用于调整提供给微处理器的电源电压的方法和装置
公开(公告)号：US5694028A
公开(公告)日：1997-12-02
申请号：US650337
申请日：1996-05-20
申请人： Richard B. Salmonson , Robert J. Greener , Mark Ronald Sikkink , Robert J. Lutz , Max C. Logan , Richard G. Finstad
发明人： Richard B. Salmonson , Robert J. Greener , Mark Ronald Sikkink , Robert J. Lutz , Max C. Logan , Richard G. Finstad
IPC分类号： G05F1/46 , G05F1/44
CPC分类号： G05F1/465
摘要： A method and apparatus for adjusting power supplied to a device when the device has a first and a second power input. A first voltage level and a ground potential are provided and a second voltage level is created as a function of the first voltage level. The second voltage level is then buffered with a power transistor and, if the second voltage level is needed for a particular device, the buffered second voltage level is selectively applied to the device. The circuit is disabled when the second voltage supply is not needed.
摘要翻译：一种用于当所述设备具有第一和第二功率输入时调整供应给设备的功率的方法和设备。提供第一电压电平和接地电位，并且产生作为第一电压电平的函数的第二电压电平。然后用功率晶体管缓冲第二电压电平，并且如果特定器件需要第二电压电平，则将缓冲的第二电压电平选择性地施加到器件。当不需要第二个电源时，电路被禁止。

5. 发明授权

US06831834B1 Assembly process and heat sink design for high powerd processor 有权
标题翻译：高功率处理器的装配过程和散热器设计
公开(公告)号：US06831834B1
公开(公告)日：2004-12-14
申请号：US09619869
申请日：2000-07-20
申请人： Richard B. Salmonson
发明人： Richard B. Salmonson
IPC分类号： H05K720
CPC分类号： H05K7/20509
摘要： The present invention includes one embodiment of a printed circuit board assembly including a printed circuit board, a microprocessor chip, a socket and an actuator for connecting the chip to the printed circuit board, a heat sink for attachment to the top surface of the chip, and a field installable thermal interface phase change pad positioned between the heat sink and the microprocessor chip. The heat sink has an actuator access opening so that the actuator is operable with the heat sink positioned on top of the microprocessor. The connection between the chip and the heat sink is free of alignment features so that they may be separated by twisting the heat sink relative to the chip. The connection between the heat sink and the circuit board is also free of alignment features. One embodiment includes a method of disassembling and re-assembling a printed circuit board assembly including actuating an actuator of a socket attached to a printed circuit board with the socket securing a first chip to the printed circuit board and the first chip having a first thermal interface pad and a heat sink secured to the chip, removing the first chip and heat sink from the socket, separating the first chip from the heat sink, disposing the first chip and the first thermal interface pad, positioning a second chip on the socket, actuating the actuator to secure the second chip to the printed circuit board, positioning a second thermal interface pad on the top surface of the second chip, positioning the heat sink on the top surface of the second thermal interface pad, and securing the heat sink to the printed circuit board.
摘要翻译：本发明包括印刷电路板组件的一个实施例，其包括印刷电路板，微处理器芯片，插座和用于将芯片连接到印刷电路板的致动器，用于附接到芯片顶表面的散热器，以及位于散热器和微处理器芯片之间的现场可安装的热界面相变垫。散热器具有致动器进入开口，使得致动器可操作，散热器位于微处理器的顶部。芯片和散热器之间的连接没有对准特征，使得它们可以通过相对于芯片扭转散热器而被分离。散热器和电路板之间的连接也没有对准特征。一个实施例包括拆卸和重新组装印刷电路板组件的方法，包括致动附接到印刷电路板的插座的致动器，其中插座固定第一芯片到印刷电路板，第一芯片具有第一热界面焊盘和固定到芯片的散热片，从插座移除第一芯片和散热器，将第一芯片与散热器分开，芯片和第一热界面垫，将第二芯片定位在插座上，致动致动器以将第二芯片固定到印刷电路板，将第二热界面垫定位在第二芯片的顶表面上，将散热器定位第二热界面垫的顶表面，并将散热器固定到印刷电路板上。

6. 发明授权

US06305463B1 Air or liquid cooled computer module cold plate 失效
标题翻译：空气或液体冷却电脑模块冷板
公开(公告)号：US06305463B1
公开(公告)日：2001-10-23
申请号：US08604841
申请日：1996-02-22
申请人： Richard B. Salmonson
发明人： Richard B. Salmonson
IPC分类号： H05K720
CPC分类号： H05K7/20254 , G06F1/20 , H05K7/20509
摘要： A cold plate that provides air or liquid cooling for a computer circuit module and has at least one mounting plate with a board mounting surface on one side for carrying a printed circuit board assembly and a cooling surface located on the other side. A cover is disposed parallel to and spaced apart from the mounting plate with a cooling chamber defined between the two. The cooling chamber is divided into a liquid cooled section and an air cooled section. The liquid cooled section has a coolant inlet and outlet and flow channels for directing coolant through the liquid cooled section from inlet to outlet. The air cooled section has an air inlet and outlet and flow channels for directing air through the air cooled section from inlet to outlet. The cold plate is adapted so that it may be installed into a circuit module and provide either liquid cooling or air cooling for the module.
摘要翻译：一种用于计算机电路模块提供空气或液体冷却并具有至少一个安装板的冷板，所述安装板在一侧具有用于承载印刷电路板组件和位于另一侧的冷却表面的板安装表面。盖子平行于安装板和与安装板隔开设置，并且在两者之间限定有冷却室。冷却室分为液体冷却段和空气冷却段。液体冷却部分具有冷却剂入口和出口和流动通道，用于将冷却剂引导通过液体冷却部分从入口到出口。空气冷却部分具有空气入口和出口以及用于引导空气通过空气冷却部分从入口到出口的流动通道。冷板适用于将其安装到电路模块中，为模块提供液体冷却或空气冷却。

7. 发明授权

US5801924A Method and apparatus for cooling daughter card modules 失效
标题翻译：用于冷却子卡模块的方法和装置
公开(公告)号：US5801924A
公开(公告)日：1998-09-01
申请号：US604888
申请日：1996-02-22
申请人： Richard B. Salmonson
发明人： Richard B. Salmonson
IPC分类号： H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H05K7/20254 , H05K1/144 , H05K7/20509 , H05K1/0201 , Y10T29/53174
摘要： A method and apparatus for conductively cooling daughter card assemblies mounted to either an air or liquid cooled computer circuit module wherein the module has a cold plate and at least one mother board adjacent the cold plate. The module carries a number of daughter assemblies thereon adjacent the mother board. Each daughter card assembly has at least one daughter board which carries a number of electronic components on an element side of the board. A cooling side is disposed opposite the element side on the board. A thermally conductive plate has an inner side facing the mother board and an outer side opposite the inner side. The inner side has one or more projecting members extending perpendicularly towards the mother board. The daughter board is parallel to and in conductive contact with one side of the conductive plate. The module cold plate has a number of upstanding spacers projecting toward the mother board. A portion of the top of each spacer is exposed for receiving thereon one of the projecting members of the conductive plate in intimate conductive contact. Preferably, the conductive plate is sandwiched between the cooling sides of a pair of daughter boards. Heat generated by the electronic components on the daughter boards is transferred by conduction through the boards into the conductive plate. The heat conducts through the projecting members into the spacers and into the module cold plate. The heat is then carried away by the cooling medium flowing through the cold plate.
摘要翻译：一种用于导电地冷却安装到空气或液体冷却的计算机电路模块的子卡组件的方法和装置，其中模块具有冷板和邻近冷板的至少一个母板。该模块在其上邻近母板携带多个子组件。每个子卡组件具有至少一个子板，其在板的元件侧上承载许多电子部件。冷却侧与板上的元件侧相对设置。导热板具有面向母板的内侧和与内侧相对的外侧。内侧具有垂直于母板延伸的一个或多个突出部件。子板与导电板的一侧平行并与其导电接触。模块冷板具有朝向母板突出的多个直立的间隔件。每个间隔件的顶部的一部分被暴露以在其中接收导电板的突出构件中的一个以紧密的导电接触。优选地，导电板夹在一对子板的冷却侧之间。由子板上的电子部件产生的热量通过导电板传导到导电板中。热量通过突出部件进入隔板并进入模块冷板。热量然后被流经冷板的冷却介质带走。

8. 发明授权

US5726857A Apparatus and method for mounting edge connectors within a circuit module 失效
标题翻译：将边缘连接器安装在电路模块内的装置和方法
公开(公告)号：US5726857A
公开(公告)日：1998-03-10
申请号：US605356
申请日：1996-02-22
申请人： Richard B. Salmonson , Stephen A. Bowen
发明人： Richard B. Salmonson , Stephen A. Bowen
IPC分类号： H01R12/04 , H05K7/20
CPC分类号： H05K7/20509
摘要： An apparatus and method for mounting an edge connector assembly within a circuit module. Connector mounting rails are attached to the sides of a printed circuit board and the circuit board is then joined with a cold plate in order to form a circuit module. The mounting rail is an elongate strip of a substantially rigid material for attachment to the circuit board along one of its edges. The strip has an upper planar surface and inner and outer sides. The inner side is for attaching the strip to the edge of the circuit board. The outer side extends beyond the edge of the circuit board and is adapted to carry thereon a female block of the edge connector assembly. The strip also has a plurality of primary mounting openings formed in a predetermined pattern through the outer side of the strip for attaching the circuit board to a circuit module.
摘要翻译：一种用于将边缘连接器组件安装在电路模块内的装置和方法。连接器安装导轨连接到印刷电路板的侧面，然后电路板与冷板接合以形成电路模块。安装导轨是基本上刚性材料的细长条，用于沿其边缘之一附接到电路板。该带具有上平面表面和内侧和外侧。内侧用于将带子连接到电路板的边缘。外侧延伸超过电路板的边缘，并且适于在其上承载边缘连接器组件的阴块。该条带还具有多个主要安装开口，其通过带的外侧以预定图案形成，用于将电路板连接到电路模块。

9. 发明授权

US06434007B1 Heat sink attachment clip 失效
标题翻译：散热片附件夹
公开(公告)号：US06434007B1
公开(公告)日：2002-08-13
申请号：US09620335
申请日：2000-07-20
申请人： Richard B. Salmonson , David Paul Gruber
发明人： Richard B. Salmonson , David Paul Gruber
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly for securing a heat sink to a chip on a circuit board using a clip to secure the heat sink to the chip. The assembly includes a pair of support beams, a clip attached to the pair of support beams, and a heat sink. Optionally, the assembly also includes a plurality of bias members biased between the heat sink and the circuit board and a pair of positioning pins positioned between the heat sink and the circuit board. The clip is biased between the heat sink and the pair of support beams. The clip has a plate having a first end and a second end with the first end having an aperture for fastening the first end to a first support beam and the second end having a hook for fastening the second end to a second support beam. Optionally, the clip is made of spring steel and provides a downward biasing force of between about 3 psi and about 25 psi and preferably about 10 psi.
摘要翻译：一种散热器组件，用于使用夹子将散热器固定在电路板上的芯片上，以将散热片固定在芯片上。组件包括一对支撑梁，固定在该对支撑梁上的夹子和散热器。可选地，组件还包括偏置在散热器和电路板之间的多个偏置构件和位于散热器和电路板之间的一对定位销。夹子偏置在散热器和一对支撑梁之间。夹子具有板，其具有第一端和第二端，第一端具有用于将第一端紧固到第一支撑梁的孔，并且第二端具有用于将第二端紧固到第二支撑梁的钩。可选地，夹子由弹簧钢制成，并提供约3psi至约25psi，优选约10psi的向下偏压力。

10. 发明授权

US5805418A Cooling cap method and apparatus for tab packaged integrated circuits 失效
标题翻译：标签封装集成电路的冷却盖方法和设备
公开(公告)号：US5805418A
公开(公告)日：1998-09-08
申请号：US604918
申请日：1996-02-22
申请人： Richard B. Salmonson , Stephen Cermak, III
发明人： Richard B. Salmonson , Stephen Cermak, III
IPC分类号： H01L23/04 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/04 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002
摘要： The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap. Risers, which may be either integral to the cooling cap or separate elements, are used to lift the cooling cap above the surface of the circuit board so as to provide space for the component.
摘要翻译：本发明公开了一种用于桥接安装在电路板上的集成电路封装或部件与散热器之间的间隙的方法和装置，使得部件上施加的应力很小，但是部件和散热用于散热。本发明为精密部件包装提供机械完整性，并且在这样做时允许使用各种散热器来提供冷却。印刷电路板具有安装到电路板的集成电路封装或其它部件。由导热材料构成的冷却盖安装在电路板上，使得部件被电路板和冷却盖包围。可以在部件和冷却帽之间沉积导热材料层，以提供从部件到冷却帽的导热路径。可以将冷却帽或分离元件整体的升降器用于将冷却帽提升到电路板的表面之上，以便为部件提供空间。

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