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    • 3. 发明授权
    • Heatsink retention and air duct assembly
    • 散热器保持和风道组件
    • US5910884A
    • 1999-06-08
    • US146658
    • 1998-09-03
    • Jose Arturo GarzaDales Morrison KentCiro Neal RamirezRajeev Ranjan Sinha
    • Jose Arturo GarzaDales Morrison KentCiro Neal RamirezRajeev Ranjan Sinha
    • G06F1/20H05K7/20
    • G06F1/20
    • An air duct structure for use in cooling a circuit card comprised of a printed circuit board to which an integrated circuit is connected. The air duct structure includes an air duct cover and a spring. The air duct cover includes a major panel that is sized or dimensioned to substantially cover the circuit card. First and second side panels extending substantially perpendicularly from opposing ends of the major panel to form a bracket. A depth of the bracket is suitable for receiving the circuit card and a heatsink positioned in close contact with the integrated circuit. When the circuit card and the heatsink are suitably received within the air duct cover, the air duct cover and the printed circuit board define an air duct within which the heatsink resides. The spring is attached to an interior surface of the major panel. The spring is positioned on the major panel to contact the heatsink and retain the heatsink in the close contact with the integrated circuit when the heatsink and the circuit card are suitably received by the air duct cover.
    • 一种用于冷却由连接有集成电路的印刷电路板构成的电路卡的风道结构。 风道结构包括空气管道盖和弹簧。 空气管道盖包括尺寸或尺寸大致覆盖电路卡的主面板。 第一和第二侧板从主面板的相对端基本上垂直地延伸以形成支架。 支架的深度适合于接收与集成电路紧密接触的电路卡和散热器。 当电路卡和散热器适当地接收在空气管道盖内时,空气管道盖和印刷电路板限定散热器所在的空气管道。 弹簧连接到主面板的内表面。 当散热器和电路卡适当地被风管盖接收时,弹簧定位在主面板上以接触散热器并将散热片与集成电路紧密接触。