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1. 发明申请

US20060044763A1 Thermal managed interconnect system for a circuit board 失效
标题翻译：用于电路板的热管理互连系统
公开(公告)号：US20060044763A1
公开(公告)日：2006-03-02
申请号：US10925091
申请日：2004-08-24
申请人： Craig Hornung , Ralph Spayd , Stephen Prete , Chong Wang
发明人： Craig Hornung , Ralph Spayd , Stephen Prete , Chong Wang
IPC分类号： H05K7/20
CPC分类号： H01L23/4275 , H01L23/36 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermal management system for an IC device mounted on a circuit board is provided. The system includes a socket housing and an array of power contacts disposed within the housing. The power contacts deliver power to an underside of the IC device and generate heat at the underside of the IC device. A heat conducting interface conveys heat from the underside of the IC device to a heat sink positioned above the IC device.
摘要翻译：提供了一种用于安装在电路板上的IC器件的热管理系统。该系统包括插座壳体和设置在壳体内的电力触头阵列。电源触点向IC器件的下侧供电，并在IC器件的下侧产生热量。导热界面将IC从IC器件的下侧传递到位于IC器件上方的散热器。

2. 发明申请

US20060171123A1 Heat sink interface insert 失效
标题翻译：散热片接口插件
公开(公告)号：US20060171123A1
公开(公告)日：2006-08-03
申请号：US11049545
申请日：2005-02-01
申请人： Craig Hornung , John Larkin , Ralph Spayd
发明人： Craig Hornung , John Larkin , Ralph Spayd
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly for cooling a heat generating integrated circuit (IC) component is provided. The assembly includes a heat sink base positioned adjacent the IC component and a thermal interface member positioned between the heat sink base and the IC component. The interface member has a first surface in abutting engagement with the heat sink base and an opposite second surface in abutting engagement with an outer surface of a lid on the IC component. The first and second surfaces each include a plurality of protrusions to increase a number of contact points between the interface member and the heat sink base and between the interface member and the outer surface of the lid to facilitate a transfer of heat from the IC component to the heat sink base.
摘要翻译：提供了用于冷却发热集成电路（IC）部件的散热器组件。组件包括邻近IC部件定位的散热器基座和位于散热器基座和IC部件之间的热接口部件。接口构件具有与散热器基座邻接接合的第一表面和与IC部件上的盖的外表面邻接接合的相对的第二表面。第一和第二表面各自包括多个突起，以增加界面构件和散热器底座之间以及界面构件与盖的外表面之间的接触点数量，以便于将热量从IC部件转移到散热器底座。

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