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1. 发明授权

US06781228B2 Donut power mesh scheme for flip chip package 有权
公开(公告)号：US06781228B2
公开(公告)日：2004-08-24
申请号：US10339844
申请日：2003-01-10
申请人： Hiroshi Ishikawa , Thomas Antisseril , Radoslav Ratchkov , Bo Shen , Prasad Subbarao , Maad Al-Dabagh , Anwar Ali , Benjamin Mbouombouo
发明人： Hiroshi Ishikawa , Thomas Antisseril , Radoslav Ratchkov , Bo Shen , Prasad Subbarao , Maad Al-Dabagh , Anwar Ali , Benjamin Mbouombouo
IPC分类号： H01L2352
CPC分类号： H01L23/5286 , H01L24/81 , H01L2224/81801
摘要： A multiple layer mesh design which includes a layer which provides a vertical mesh and an adjacent layer which provides a horizontal mesh which includes an open area or hole. The layer which provides the horizontal mesh (with hole) may either be above or below the vertical mesh layer, depending on the design. The vertical mesh may be full or may surround an open area or hole where the design includes both a horizontal donut mesh and a vertical donut mesh.

2. 发明授权

US06747349B1 Termination ring for integrated circuit 有权
标题翻译：集成电路终端环
公开(公告)号：US06747349B1
公开(公告)日：2004-06-08
申请号：US10335649
申请日：2002-12-31
申请人： Maad Al-Dabagh , Thomas Antisseril , Bo Shen , Prasad Subbarao , Radoslav Ratchkov
发明人： Maad Al-Dabagh , Thomas Antisseril , Bo Shen , Prasad Subbarao , Radoslav Ratchkov
IPC分类号： H01L2352
CPC分类号： H01L23/5286 , H01L24/06 , H01L2924/14 , H01L2924/00
摘要： A rectangular termination ring for a power distribution mesh is placed on the upper two layers of an integrated circuit and may be placed over some I/O circuitry. The strapping connecting the bonding pads to the termination ring are placed on upper levels of the integrated circuit, minimizing the via requirements and freeing space for additional circuitry. Further, the termination ring may be adapted to work in conjunction with L-shaped, as well as other power distribution meshes.
摘要翻译：用于配电网的矩形终端环放置在集成电路的上两层上，并且可以放置在某些I / O电路上。将接合焊盘连接到终端环的捆扎带放置在集成电路的上层，最小化通孔要求并释放附加电路的空间。此外，端接环可以适于与L形以及其它配电网一起工作。

3. 发明授权

US06744081B2 Interleaved termination ring 有权
标题翻译：交错终止环
公开(公告)号：US06744081B2
公开(公告)日：2004-06-01
申请号：US10283965
申请日：2002-10-30
申请人： Radoslav Ratchkov , Maad Al-Dabagh
发明人： Radoslav Ratchkov , Maad Al-Dabagh
IPC分类号： H01L2710
CPC分类号： H01L23/5286 , H01L24/06 , H01L2224/05554 , H01L2924/14 , H01L2924/00
摘要： An integrated circuit with a power and ground distribution system having a first conductive layer, a second conductive layer, and an insulating layer disposed between the first layer and the second layer. A first ring is formed in the first layer, where the first ring forms a first loop around a peripheral portion of the integrated circuit. First straps are formed in the first layer, where the first straps have connections to the first ring. First horizontal members are formed in the first layer, where the first horizontal members have connections to the first ring. Second horizontal members are formed in the first layer, where the second horizontal members do not have connections to the first ring. A second ring is formed in the second layer, where the second ring forms a second loop around the peripheral portion of the integrated circuit. The second ring is interleaved with the first ring. Second straps are formed in the second layer, where the second straps have connections to the second ring. Second vertical members are formed in the second layer, where the second vertical members have connections to the second ring. First vertical members are formed in the second layer, where the first vertical members do not have connections to the second ring. First vias form connections between the first vertical members and the first ring. Second vias form connections between the second horizontal members and the second ring. The first elements form a first subsystem such as for power, and the second elements form a second subsystem such as for ground.
摘要翻译：一种具有电力和地面分配系统的集成电路，其具有设置在第一层和第二层之间的第一导电层，第二导电层和绝缘层。第一环形成在第一层中，其中第一环围绕集成电路的周边部分形成第一环。在第一层中形成第一带，其中第一带具有与第一环的连接。第一水平构件形成在第一层中，其中第一水平构件具有到第一环的连接。第二水平构件形成在第一层中，其中第二水平构件不具有到第一环的连接。第二环形成在第二层中，其中第二环围绕集成电路的周边部分形成第二环。第二环与第一环交错。第二带形成在第二层中，其中第二带具有与第二环的连接。第二垂直构件形成在第二层中，其中第二垂直构件具有到第二环的连接。第一垂直构件形成在第二层中，其中第一垂直构件不具有到第二环的连接。第一通孔在第一垂直构件和第一环之间形成连接。第二通孔在第二水平构件和第二环之间形成连接。第一元件形成第一子系统，例如用于电力，第二元件形成第二子系统，例如用于地面。

4. 发明授权

US06674176B2 Wire bond package with core ring formed over I/O cells 失效
标题翻译：具有形成在I / O单元上的芯环的引线键合封装
公开(公告)号：US06674176B2
公开(公告)日：2004-01-06
申请号：US10082027
申请日：2002-02-20
申请人： Radoslav Ratchkov
发明人： Radoslav Ratchkov
IPC分类号： H01L2348
CPC分类号： H01L24/02 , H01L23/50 , H01L2924/01033 , H01L2924/14
摘要： A wire bond package for an integrated circuit die includes a first I/O core ring and a second I/O core ring formed in a first metal layer; a pad strap formed in a second metal layer overlapping the second I/O core ring; a via formed between the first metal layer and the second metal layer where the second I/O core ring and the pad strap overlap; a first core ring formed in a third metal layer overlapping the first I/O core ring; a via formed between the first metal layer and the third metal layer where the first I/O core ring and the first core ring overlap outside the power strap; a first power mesh formed in a fourth metal layer overlapping the first core ring; and a via formed between the third metal layer and the fourth metal layer where the first core ring and the first power mesh overlap.
摘要翻译：用于集成电路管芯的引线接合封装包括形成在第一金属层中的第一I / O芯环和第二I / O芯环; 形成在与所述第二I / O芯环重叠的第二金属层中的垫带; 在所述第一金属层和所述第二金属层之间形成的通孔，其中所述第二I / O芯环和所述垫带重叠; 形成在与所述第一I / O芯环重叠的第三金属层中的第一芯环; 在所述第一金属层和所述第三金属层之间形成的通孔，其中所述第一I / O芯环和所述第一芯环在所述电源带外部重叠; 形成在与所述第一芯环重叠的第四金属层中的第一电力网; 以及形成在第一金属芯和第一电源网的第三金属层与第四金属层之间的通孔。

5. 发明授权

US06835972B2 Bowtie and T-shaped structures of L-shaped mesh implementation 有权
公开(公告)号：US06835972B2
公开(公告)日：2004-12-28
申请号：US10434715
申请日：2003-05-09
申请人： Radoslav Ratchkov , Thomas Antisseril , Hiroshi Ishikawa , Prasad Subbarao , Bo Shen , Ruben Molina
发明人： Radoslav Ratchkov , Thomas Antisseril , Hiroshi Ishikawa , Prasad Subbarao , Bo Shen , Ruben Molina
IPC分类号： H01L2710
CPC分类号： H01L23/5286 , H01L23/50 , H01L2924/0002 , H01L2924/00
摘要： A multiple layer power mesh design includes an L-shaped structure and a bow tie-shaped structure. The L-shaped structure provides a plurality of L-shaped power rails in each of four quadrants of the layer. The bow tie-shaped structure includes plurality of vertical power rails in each of a left and right triangularly-shaped portion of the layer. The vertical power rails of the bow tie-shaped structure provide and interface between the upper and lower quadrants of the L-shaped layer. The bow tie-shaped structure provides additional available space which can, for example, be used for routing signal traces. A T-shaped structure is also provided for use with the bow tie-shaped layer. The T-shaped layer provides for improved distances between the VDD and the VSS power rails.

6. 发明授权

US06545288B1 Gridless router using maze and line probe techniques 有权
标题翻译：无线路由器使用迷宫和线路探测技术
公开(公告)号：US06545288B1
公开(公告)日：2003-04-08
申请号：US09802043
申请日：2001-03-08
申请人： Radoslav Ratchkov , Anand Sethuraman
发明人： Radoslav Ratchkov , Anand Sethuraman
IPC分类号： G06F1750
CPC分类号： G06F17/5077
摘要： A software tool and method for routing paths in a routing space. A grid is effectively built “on the fly”, therefore reducing the number of grid points which must be plotted. The boundaries of the routing space are defined. Blocks are then defined in the routing space. After the blocks have been defined, grid points are plotted corresponding to the corners of the blocks. The source points and target points are plotted, and grid points are plotted corresponding to the source and target points. Then, the paths from the source points to the target points are plotted along grid points which have been defined in the routing space. This process of defining the grid points not only reduces the size of data needed to describe the available routing space, but preferably obviates the need to run design rule checks.
摘要翻译：用于在路由空间中路由路径的软件工具和方法。一个网格被“有效地”建成，因此减少了必须绘制的网格点的数量。定义路由空间的边界。然后在路由空间中定义块。在定义了块之后，对应于块的拐角绘制网格点。绘制源点和目标点，并绘制对应于源点和目标点的网格点。然后，从源点到目标点的路径沿着已经在路由空间中定义的网格点绘制。定义网格点的这个过程不仅减少了描述可用路由空间所需的数据的大小，而且优选地避免了执行设计规则检查的需要。

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