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    • 1. 发明授权
    • Vertically-stacked process reactor and cluster tool system for atomic
layer deposition
    • 用于原子层沉积的垂直堆叠过程反应器和簇工具系统
    • US5879459A
    • 1999-03-09
    • US920708
    • 1997-08-29
    • Prasad N. GadgilThomas E. Seidel
    • Prasad N. GadgilThomas E. Seidel
    • C23C16/44C23C16/455C23C16/54C30B25/12C30B25/14H01L21/205C23C16/00
    • C23C16/45546C23C16/44C23C16/54C30B25/12C30B25/14
    • A low profile, compact atomic layer deposition reactor (LP-CAR) has a low-profile body with a substrate processing region adapted to serve a single substrate or a planar array of substrates, and a valved load and unload port for substrate loading and unloading to and from the LP-CAR. The body has an inlet adapted for injecting a gas or vapor at the first end, and an exhaust exit adapted for evacuating gas and vapor at the second end. The LP-CAR has an external height no greater than any horizontal dimension, and more preferably no more than two-thirds any horizontal dimension, facilitating a unique system architecture. An internal processing region is distinguished by having a vertical extent no greater than one fourth the horizontal extent, facilitating fast gas switching. In some embodiments one substrate at a time is processed, and in other embodiments there may be multiple substrates arranged in the processing region in a planar array. The compact reactor is distinguished by individual injectors, each of which comprise a charge tube formed between a charge valve and an injection valve. The charge valve connects the charge tube to a pressure regulated supply, and the injection valve opens the charge tube into the compact reactor. Rapidly cycling the valves injects fixed mass-charges of gas or vapor into the compact reactor. Multiple such compact reactors are stacked vertically, interfaced into a vacuum handling region having a Z-axis robot and a load/unload opening.
    • 薄型原子层沉积反应器(LP-CAR)具有低轮廓体,其基底处理区域适用于单个基底或平面阵列阵列,以及用于基底装载和卸载的带阀载荷和卸载口 往返于LP-CAR。 主体具有适于在第一端处喷射气体或蒸气的入口和适于在第二端排出气体和蒸汽的排气出口。 LP-CAR具有不大于任何水平尺寸的外部高度,更优选不超过任何水平尺寸的三分之二,有助于独特的系统架构。 内部处理区域的区别在于垂直范围不大于水平范围的四分之一,有利于快速气体切换。 在一些实施例中,一次处理一个基板,并且在其他实施例中,可以在平面阵列中布置在处理区域中的多个基板。 紧凑型反应器由单独的喷射器区分,每个喷射器包括在充气阀和喷射阀之间形成的进料管。 充电阀将充电管连接到压力调节电源,并且注射阀将充电管打开到紧凑型反应堆中。 快速循环阀将气体或蒸气的固定质量注入到紧凑型反应堆中。 多个这样的紧凑型反应堆被垂直堆叠,接合到具有Z轴机器人和装载/卸载开口的真空处理区域中。
    • 2. 发明授权
    • Measurement of substrate temperature in a process chamber using non-contact filtered infrared pyrometry
    • 使用非接触式过滤的红外线测温法测量处理室中的衬底温度
    • US06563092B1
    • 2003-05-13
    • US09997870
    • 2001-11-28
    • Krishnan ShrinivasanArkadiy ShimanovichPrasad N. Gadgil
    • Krishnan ShrinivasanArkadiy ShimanovichPrasad N. Gadgil
    • H05B102
    • H01L21/67248
    • Methods and an apparatus for providing a non-contact probe for accurately measuring the temperature of a substrate in a process chamber are disclosed. One exemplary apparatus is a processing chamber, which includes a heating source, where the heating source heats the substrate. Also included is a window maintained at a substantially constant temperature. The window allows only a first wavelength spectrum of energy emitted from the heating source to pass. In addition, the window isolates the heating source from an internal region of the processing chamber. A probe configured to detect a second wavelength spectrum of energy emitted directly from the substrate is included. The energy emitted directly from the substrate corresponds to a temperature of the substrate, and the temperature of the substrate is provided to the controller, which adjusts an intensity of the heating source based on a set point temperature for the substrate.
    • 公开了用于提供用于精确测量处理室中的衬底的温度的非接触式探针的方法和装置。 一个示例性装置是处理室,其包括加热源,其中加热源加热基板。 还包括保持在基本上恒定的温度下的窗口。 窗口仅允许从加热源发出的能量的第一波长谱通过。 此外,窗口将加热源与处理室的内部区域隔离。 包括被配置为检测从衬底直接发射的能量的第二波长光谱的探针。 从衬底直接发射的能量对应于衬底的温度,并且基板的温度被提供给控制器,该控制器基于衬底的设定点温度来调节加热源的强度。
    • 3. 发明授权
    • Method for filling of a recessed structure of a semiconductor device
    • 用于填充半导体器件的凹陷结构的方法
    • US07365005B1
    • 2008-04-29
    • US11159999
    • 2005-06-22
    • Prasad N. Gadgil
    • Prasad N. Gadgil
    • H01L21/4763
    • H01L21/76877C23C16/045H01L21/28562H01L21/32115H01L21/32135H01L21/7684
    • This invention relates to process sequence by high-speed atomic layer chemical vapor processing that includes deposition for diffusion barriers in the etched features on substrate followed by gap fill and subsequent in-situ removal of the blanket films on the top by plasma enhanced vapor phase processes. The apparatus and process sequences employed in these processing scheme allows the practitioner to complete all vapor phase process sequences of diffusion barrier deposition, gap fill and planarization of copper and diffusion barrier planarization. In case of copper metallization scheme, vapor phase gap fill can be employed to replace electrochemical deposition of copper and removal of copper and the diffusion barrier by vapor phase reactions can replace chemical-mechanical-polishing. Furthermore, such a processing scheme can be employed to deposit gate level dielectric layer, shallow trench isolation and also to form first metal contact plugs with a suitable barrier at the front end of line processing.
    • 本发明涉及通过高速原子层化学气相处理的工艺顺序,其包括在衬底上的蚀刻特征中的扩散阻挡层的沉积,然后进行间隙填充并随后通过等离子体增强的气相工艺在顶部去除覆盖膜 。 在这些处理方案中使用的装置和处理顺序允许从业者完成扩散阻挡层沉积,间隙填充和铜的平坦化以及扩散势垒平坦化的所有气相工艺序列。 在铜金属化方案的情况下,可以采用气相填充来代替铜的电化学沉积和铜的去除,并且通过气相反应的扩散阻挡可以代替化学机械抛光。 此外,可以采用这种处理方案来沉积栅极电介质层,浅沟槽隔离,并且还可以在线处理的前端形成具有合适屏障的第一金属接触塞。