专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090090617A1 Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films 审中-公开
标题翻译：在溅射膜中产生受控应力和应力梯度的方法和装置
公开(公告)号：US20090090617A1
公开(公告)日：2009-04-09
申请号：US11995490
申请日：2006-07-14
申请人： Pierre H. Giauque , Fu Chiung Chong , Frank Swiatowiec , Donald Smith
发明人： Pierre H. Giauque , Fu Chiung Chong , Frank Swiatowiec , Donald Smith
IPC分类号： C23C14/34 , C23C14/54
CPC分类号： C23C14/352 , C23C14/35 , H01J37/3408 , H01J37/3447 , H01J37/347
摘要： An enhanced sputtered film processing system and associated method comprises one or more sputter deposition sources each having a sputtering target surface and one or more side shields extending therefrom, to increase the relative collimation of the sputter deposited material, such as about the periphery of the sputtering target surface, toward workpiece substrates. One or more substrates are provided, wherein the substrates have a front surface and an opposing back surface, and may have one or more previously applied layers, such as an adhesion or release layer. The substrates and the deposition targets are controllably moved with respect to each other. The relatively collimated portion of the material sputtered from the sputtering target surface travels beyond the side shields and is deposited on the front surface of the substrates. The increase in relative collimation results in deposited films with desirable properties including but not limited to high levels of both readily controllable compressive stress and mechanical integrity without the use of ion bombardment.
摘要翻译：增强的溅射膜处理系统和相关方法包括一个或多个溅射沉积源，每个溅射沉积源具有溅射靶表面和从其延伸的一个或多个侧屏蔽，以增加溅射沉积材料的相对准直，例如大约溅射周边目标表面，朝向工件基板。提供一个或多个基底，其中基底具有前表面和相对的后表面，并且可以具有一个或多个预先施加的层，例如粘附或释放层。基板和沉积靶相对于彼此可控地移动。从溅射靶表面溅射的材料的相对准直的部分超过侧面屏蔽并沉积在基板的前表面上。相对准直的增加导致具有期望性能的沉积膜，包括但不限于高水平的易于控制的压缩应力和机械完整性，而不使用离子轰击。

IPRDB

热门服务

关于我们

友情链接

联系方式