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1. 发明申请

US20110007505A1 LIGHT SOURCE MODULE AND LED STREET LAMP USING THE SAME 审中-公开
标题翻译：光源模块和使用相同的LED路灯
公开(公告)号：US20110007505A1
公开(公告)日：2011-01-13
申请号：US12501559
申请日：2009-07-13
申请人： Pei-Choa WANG
发明人： Pei-Choa WANG
IPC分类号： F21V1/00
CPC分类号： G02B3/08 , F21S8/086 , F21V5/045 , F21V29/74 , F21W2131/103 , F21Y2115/10 , G02B3/005 , Y02B20/72
摘要： A light source module includes a base, at least one light emitting diode device, a reflector and a transparent plate. The light emitting diode device is arranged on the base. The reflector is arranged on the base and around the light emitting diode device. The transparent plate is arranged on the reflector and forms a plurality of Fresnel lens portions facing the light emitting diode device. The Fresnel lens portions are aligned along a predetermined direction. The invention further provides a street lamp having the abovementioned light source module.
摘要翻译：光源模块包括基座，至少一个发光二极管器件，反射器和透明板。发光二极管装置设置在基座上。反射器布置在基座上并围绕发光二极管器件。透明板被布置在反射器上并且形成面向发光二极管装置的多个菲涅耳透镜部分。菲涅尔透镜部分沿预定方向排列。本发明还提供一种具有上述光源模块的路灯。

2. 发明申请

US20100328960A1 WATERPROOF ASSEMBLY OF LED LAMP CUP 失效
标题翻译： LED灯泡防水组件
公开(公告)号：US20100328960A1
公开(公告)日：2010-12-30
申请号：US12492203
申请日：2009-06-26
申请人： Pei-Choa WANG
发明人： Pei-Choa WANG
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21V17/14 , F21V29/51 , F21V29/70 , F21V29/74 , F21V29/89 , F21V31/005 , F21Y2115/10 , Y10S362/80
摘要： A LED lamp cup includes a heat-conducting substrate, a LED unit, a casing and a light-transmitting lamp cover. The casing can be detachably assembled with the heat-conducting substrate or the light-transmitting lamp cover easily. Further, the casing or the light-transmitting lamp cover is configured that it can be retained from outside toward inside, so that the casing may not rotated reversely after being assembled with the heat-conducting substrate or the light-transmitting lamp cover. Thus, the biasing force exerted on the first and second waterproof gaskets may not be reduced to enlarge the gap. Thus, the penetration of moisture can be prevented to achieve a good waterproof effect.
摘要翻译： LED灯杯包括导热基板，LED单元，壳体和透光灯盖。壳体可以容易地与导热基板或透光灯盖可拆卸地组装。此外，壳体或透光灯罩被构造成能够从外部向内部保持，使得在与导热基板或透光灯盖组装之后壳体可能不会反向旋转。因此，施加在第一和第二防水垫圈上的偏压力可能不会减小，从而扩大间隙。因此，可以防止水分渗透，达到良好的防水效果。

3. 发明授权

US07700386B2 Packaging method of LED of high heat-conducting efficiency and structure thereof 失效
标题翻译：高导热效率的LED的包装方法及其结构
公开(公告)号：US07700386B2
公开(公告)日：2010-04-20
申请号：US12017316
申请日：2008-01-21
申请人： Pei-Choa Wang
发明人： Pei-Choa Wang
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/641 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed.
摘要翻译：导热效率高的LED的封装方法及其结构首先是提供具有多个压痕的铜基板。在基板的表面和凹陷的底部上形成绝缘层。同时，在基板的绝缘层上形成一组金属电路，并且在金属电路的表面上没有电连接而没有外壳的绝缘漆层被涂覆。在绝缘层和金属电路上涂覆锡层，其中没有绝缘漆。此外，一组发光芯片被模压在压痕的锡层上。接下来，发光芯片和金属电路通过一组金线电连接。此外，在基板的表面上设置环状物体，使得发光芯片组，金线和金属电路被封装在其中。同时，荧光胶附着在发光芯片组，金线和金属电路上。最终，将环氧树脂填充到环形物体的内部以进行干燥以形成环氧树脂层。因此，LED的封装制造完成。

4. 发明授权

US07549772B2 LED lamp conducting structure with plate-type heat pipe 失效
标题翻译： LED灯具导热结构，带板式热管
公开(公告)号：US07549772B2
公开(公告)日：2009-06-23
申请号：US11393817
申请日：2006-03-31
申请人： Pei-Choa Wang
发明人： Pei-Choa Wang
IPC分类号： F21V29/00
CPC分类号： F21V29/51 , F21K9/00 , F21V19/0055 , F21V29/773 , F21V29/89 , F21Y2115/10
摘要： An LED lamp conducting structure includes plate-type heat pipe of mask shape. A support plate mounted with LEDs is fixed on a plate-type heat pipe and then is placed within a lampshade. The plate-type heat pipe is made of metal with good thermal conductivity and has a plurality of through holes defined on bottom thereof. The support plate includes a plurality of electrode holes corresponding to the through holes. The anode contact and cathode contact of the LED are around the electrode hole. The contacts are exposed out of the support plate such that two screw-shaped electrode pins can be connected to the contacts after passing the electrode holes and the through holes. The electrode pins are locked to the plate-type heat pipe by screw such that the electrode pins have electrical connection with the contacts.
摘要翻译： LED灯导电结构包括掩模形状的板式热管。安装有LED的支撑板固定在板式热管上，然后放置在灯罩内。板式热管由具有良好导热性的金属制成，并在其底部形成有多个通孔。支撑板包括对应于通孔的多个电极孔。 LED的阳极接触和阴极接触围绕电极孔。触点从支撑板露出，使得在通过电极孔和通孔之后，可以将两个螺旋形电极引脚连接到触点。电极引脚通过螺钉与板式热管锁定，使得电极引脚与触点电连接。

5. 发明授权

US07434959B1 LED lamp device 失效
标题翻译： LED灯具
公开(公告)号：US07434959B1
公开(公告)日：2008-10-14
申请号：US11838336
申请日：2007-08-14
申请人： Pei-Choa Wang
发明人： Pei-Choa Wang
IPC分类号： F21V21/00
CPC分类号： F21S8/086 , F21S2/005 , F21V7/0083 , F21V15/01 , F21V17/107 , F21V29/763 , F21V31/005 , F21W2131/103 , F21Y2115/10
摘要： An LED lamp device has a lamp seat, in which a lamp trough is formed by being recessed inwardly, and the inner edge surface of the lamp seat is formed as an arc surface. The front and rear parts in longitudinal direction of the lamp trough are also bent inwardly. Three rows of lamp set are arranged along the longitudinal sides in the lamp trough. These lamp sets have a plurality of LEDs as light-emitting elements. The lamp sets at left and right rows are inclined inwardly according to the curvature of the inner edge surface. In the meantime, the lamp sets at front and rear sides of one row are also inclined inwardly. Under this arrangement, the plural lamp sets not only can enhance the illumination of the lamp, but also can concentrate its light-emitting operation, for solving a shortcoming of light dispersal in most light sources.
摘要翻译： LED灯具具有灯座，其中通过向内凹陷形成灯槽，并且灯座的内边缘表面形成为弧形表面。灯槽纵向的前后部分也向内弯曲。三排灯组沿着灯槽的纵向侧排列。这些灯组具有作为发光元件的多个LED。根据内边缘表面的曲率，左右排的灯具向内倾斜。同时，一排的前后侧的灯也向内倾斜。在这种布置下，多个灯具不仅可以增强灯的照明，而且还可以集中其发光操作，以解决在大多数光源中的光散射的缺点。

6. 发明申请

US20070236935A1 LED lamp conducting structure with plate-type heat pipe 失效
标题翻译： LED灯具导热结构，带板式热管
公开(公告)号：US20070236935A1
公开(公告)日：2007-10-11
申请号：US11393817
申请日：2006-03-31
申请人： Pei-Choa Wang
发明人： Pei-Choa Wang
IPC分类号： F21V29/00 , H01J7/24
CPC分类号： F21V29/51 , F21K9/00 , F21V19/0055 , F21V29/773 , F21V29/89 , F21Y2115/10
摘要： An LED lamp conducting structure includes plate-type heat pipe of mask shape. A support plate mounted with LEDs is fixed on a plate-type heat pipe and then is placed within a lampshade. The plate-type heat pipe is made of metal with good thermal conductivity and has a plurality of through holes defined on bottom thereof. The support plate includes a plurality of electrode holes corresponding to the through holes. The anode contact and cathode contact of the LED are around the electrode hole. The contacts are exposed out of the support plate such that two screw-shaped electrode pins can be connected to the contacts after passing the electrode holes and the through holes. The electrode pins are locked to the plate-type heat pipe by screw such that the electrode pins have electrical connection with the contacts.
摘要翻译： LED灯导电结构包括掩模形状的板式热管。安装有LED的支撑板固定在板式热管上，然后放置在灯罩内。板式热管由具有良好导热性的金属制成，并在其底部形成有多个通孔。支撑板包括对应于通孔的多个电极孔。 LED的阳极接触和阴极接触围绕电极孔。触点从支撑板露出，使得在通过电极孔和通孔之后，可以将两个螺旋形电极引脚连接到触点。电极引脚通过螺钉与板式热管锁定，使得电极引脚与触点电连接。

7. 发明申请

US20070230172A1 Lamp with multiple light emitting faces 审中-公开
标题翻译：具有多个发光面的灯
公开(公告)号：US20070230172A1
公开(公告)日：2007-10-04
申请号：US11393816
申请日：2006-03-31
申请人： Pei-Choa Wang
发明人： Pei-Choa Wang
IPC分类号： F21V21/00 , F21V29/00
CPC分类号： F21V29/51 , F21V29/777 , F21Y2107/30 , F21Y2115/10
摘要： A lamp with multiple light emitting faces includes a heat-dissipation unit, an isothermal body, a plurality of light-emitting units, a lampshade and a reflection shell. The heat-dissipation unit includes two round hollow casings. The isothermal body is arranged on a bottom face of the heat-dissipation unit and integral with the heat-dissipation unit. The isothermal body includes a plurality of outer planes and each plane is defined with a groove. The light-emitting units are arranged in the groove to provide lamp in multiple planes. The lampshade includes a plurality of heat dissipating plates and an accommodation space is defined at center of the lampshade to accommodate the heat-dissipation unit. The reflection shell is assembled with the heat-dissipation unit and the lampshade and the reflection shell is around the isothermal body.
摘要翻译：具有多个发光面的灯包括散热单元，等温体，多个发光单元，灯罩和反射壳。散热单元包括两个圆形中空壳体。等温体设置在散热单元的底面并与散热单元成一体。等温体包括多个外平面，并且每个平面用凹槽限定。发光单元布置在凹槽中以在多个平面中提供灯。灯罩包括多个散热板，并且在灯罩的中心处限定容纳空间以容纳散热单元。反射壳与散热单元和灯罩组装，反射壳围绕等温体。

8. 发明授权

US06913070B2 Planar heat pipe structure 失效
公开(公告)号：US06913070B2
公开(公告)日：2005-07-05
申请号：US10653104
申请日：2003-09-03
申请人： Chin Wen Wang , Pei Choa Wang , Ching Chung Wang
发明人： Chin Wen Wang , Pei Choa Wang , Ching Chung Wang
IPC分类号： H01L23/427 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , F28D15/0233 , F28D15/046 , F28F3/044 , F28F2215/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An improved structure of a planar heat pipe, having a top lid and a bottom lid. The bottom lid can be engaged with the top lid. A wick structure and a working fluid are installed in the heat pipe. The top lid has a top panel, which has a central flat area and a plurality of independent heat dissipating fins spirally arranged around the flat area. Each of the heat dissipating fins has a cone shape, and the height of the heat dissipating fins gradually increases from the center to the periphery of the top lid. A spiral heat circulating path is thus formed on the top lid. Thereby, when the cooling fan generates cooling air flow downwardly, an air impingement is formed upon the flat region of the top lid. The heat accumulated in the central flat region is then dissipated by the heat dissipating fins with an enhanced efficiency.

9. 发明授权

US08033687B2 Waterproof assembly of LED lamp cup 失效
标题翻译： LED灯杯防水组合
公开(公告)号：US08033687B2
公开(公告)日：2011-10-11
申请号：US12492203
申请日：2009-06-26
申请人： Pei-Choa Wang
发明人： Pei-Choa Wang
IPC分类号： F21V29/00 , B60Q1/06
CPC分类号： F21V29/004 , F21V17/14 , F21V29/51 , F21V29/70 , F21V29/74 , F21V29/89 , F21V31/005 , F21Y2115/10 , Y10S362/80
摘要： A LED lamp cup includes a heat-conducting substrate, a LED unit, a casing and a light-transmitting lamp cover. The casing can be detachably assembled with the heat-conducting substrate or the light-transmitting lamp cover easily. Further, the casing or the light-transmitting lamp cover is configured that it can be retained from outside toward inside, so that the casing may not rotated reversely after being assembled with the heat-conducting substrate or the light-transmitting lamp cover. Thus, the biasing force exerted on the first and second waterproof gaskets may not be reduced to enlarge the gap. Thus, the penetration of moisture can be prevented to achieve a good waterproof effect.
摘要翻译： LED灯杯包括导热基板，LED单元，壳体和透光灯盖。壳体可以容易地与导热基板或透光灯盖组装。此外，壳体或透光灯罩被构造成能够从外部向内部保持，使得在与导热基板或透光灯盖组装之后壳体可能不会反向旋转。因此，施加在第一和第二防水垫圈上的偏压力可能不会减小，从而扩大间隙。因此，可以防止水分渗透，达到良好的防水效果。

10. 发明授权

US07772610B2 Structure of LED of high heat-conducting efficiency 有权
标题翻译： LED的结构高导热效率
公开(公告)号：US07772610B2
公开(公告)日：2010-08-10
申请号：US12501487
申请日：2009-07-12
申请人： Pei-Choa Wang
发明人： Pei-Choa Wang
IPC分类号： H01L29/22 , H01L33/00 , H01L29/227 , H01L29/24 , H01L31/0203
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/641 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A structure of LED of high heat-conducting efficiency is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed.
摘要翻译：具有高导热效率的LED的结构是提供具有多个凹口的铜基板。在基板的表面和凹陷的底部上形成绝缘层。同时，在基板的绝缘层上形成一组金属电路，并且在金属电路的表面上没有电连接而没有外壳的绝缘漆层被涂覆。在绝缘层和金属电路上涂覆锡层，其中没有绝缘漆。此外，一组发光芯片被模压在压痕的锡层上。接下来，发光芯片和金属电路通过一组金线电连接。此外，在基板的表面上设置环状物体，使得发光芯片组，金线和金属电路被封装在其中。同时，荧光胶附着在发光芯片组，金线和金属电路上。最终，将环氧树脂填充到环形物体的内部以进行干燥以形成环氧树脂层。因此，LED的封装制造完成。

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