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1. 发明申请

US20140024176A1 IN-SITU FOAM MATERIAL AS INTEGRATED HEAT SPREADER (IHS) SEALANT 有权
标题翻译： IN-SITU泡沫材料作为集成散热器（IHS）密封剂
公开(公告)号：US20140024176A1
公开(公告)日：2014-01-23
申请号：US13912286
申请日：2013-06-07
申请人： Paul R. Start , Rahul N. Manepalli
发明人： Paul R. Start , Rahul N. Manepalli
IPC分类号： H01L21/50
CPC分类号： H01L21/50 , H01L21/563 , H01L23/367 , H01L23/42 , H01L23/4275 , H01L2224/73204
摘要： Integrated heat spreader (IHS) lid over a semiconductor die connected to a substrate forms a cavity. A bead of foaming material may be placed within the INS cavity. During an IHS cure and reflow process the foaming material will expand and fill the IHS cavity and the foam's shape conforms to the various surface features present, encapsulating a thermal interface material (TIM) material, and increasing contact area of the foam sealant.
摘要翻译：在与基板连接的半导体管芯上的集成散热器（IHS）盖形成空腔。发泡材料珠可以放置在INS腔内。在IHS固化和回流工艺期间，发泡材料将膨胀并填充IHS腔，并且泡沫的形状符合存在的各种表面特征，包封热界面材料（TIM）材料，并增加泡沫密封剂的接触面积。

2. 发明授权

US08703536B2 In-situ foam material as integrated heat spreader (IHS) sealant 有权
标题翻译：作为集成散热器（IHS）密封剂的原位泡沫材料
公开(公告)号：US08703536B2
公开(公告)日：2014-04-22
申请号：US13912286
申请日：2013-06-07
申请人： Paul R. Start , Rahul N. Manepalli
发明人： Paul R. Start , Rahul N. Manepalli
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/50 , H01L21/563 , H01L23/367 , H01L23/42 , H01L23/4275 , H01L2224/73204
摘要： An integrated heat spreader (IHS) lid over a semiconductor die connected to a substrate forms a cavity. A bead of foaming material may be placed within the IHS cavity. During an IHS cure and reflow process the foaming material will expand and fill the IHS cavity and the foam's shape conforms to the various surface features present, encapsulating a thermal interface material (TIM) material, and increasing contact area of the foam sealant.
摘要翻译：与衬底连接的半导体管芯上的集成散热器（IHS）盖形成空腔。发泡材料珠可以放置在IHS腔内。在IHS固化和回流工艺期间，发泡材料将膨胀并填充IHS腔，并且泡沫的形状符合存在的各种表面特征，包封热界面材料（TIM）材料，并增加泡沫密封剂的接触面积。

3. 发明申请

US20140264821A1 MOLDED HEAT SPREADERS 有权
标题翻译：模具式热交换器
公开(公告)号：US20140264821A1
公开(公告)日：2014-09-18
申请号：US13836407
申请日：2013-03-15
申请人： Zhizhong Tang , Syadwad Jain , Paul R. Start
发明人： Zhizhong Tang , Syadwad Jain , Paul R. Start
IPC分类号： H01L23/367 , F28F3/00 , B29C39/10
CPC分类号： H01L23/367 , B29C39/10 , H01L21/4882 , H01L23/3675 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311
摘要： Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例描述了用于模制散热器的技术和配置。在一些实施例中，散热器包括具有第一面和第一侧的第一插入件，第一面被定位成形成第一腔体的底面，第二插入件具有第二面和第二面，第二面定位成形成第二腔的底表面。第二腔可以具有与第一腔的深度不同的深度。散热器还可以包括设置在第一和第二插入件之间并与第一侧和第二侧耦合的成型材料，模制材料形成第一空腔的侧壁的至少一部分和至少一部分第二腔的侧壁。可以描述和/或要求保护其他实施例。

4. 发明申请

US20140239479A1 MICROELECTRONIC PACKAGE INCLUDING AN ENCAPSULATED HEAT SPREADER 审中-公开
标题翻译：微电子封装，包括封装的散热器
公开(公告)号：US20140239479A1
公开(公告)日：2014-08-28
申请号：US13776814
申请日：2013-02-26
申请人： Paul R Start
发明人： Paul R Start
IPC分类号： H01L23/34 , H01L21/56
CPC分类号： H01L21/56 , H01L21/565 , H01L23/293 , H01L23/295 , H01L23/3121 , H01L23/42 , H01L23/4334 , H01L25/0652 , H01L2224/16 , H01L2224/16227 , H01L2224/17181 , H01L2224/32245 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/15311
摘要： A microelectronic package of the present description may include a microelectronic interposer having a first surface with an active surface of the at least one microelectronic device electrically attached to the microelectronic interposer first surface. A thermal interface material may be disposed on a back surface of the at least one microelectronic device. A heat spreader, having a first surface and an opposing second surface, may be in thermal contact by its first surface with the thermal interface material. A mold material may be disposed to encapsulate the microelectronic device, the thermal interface material, and the heat spreader, wherein the mold material abuts at least a portion of the microelectronic interposer first surface.
摘要翻译：本说明书的微电子封装可以包括具有第一表面的微电子插入器，该第一表面具有与微电子插入器第一表面电连接的至少一个微电子器件的有源表面。热界面材料可以设置在至少一个微电子器件的后表面上。具有第一表面和相对的第二表面的散热器可以通过其第一表面与热界面材料热接触。可以设置模具材料以封装微电子器件，热界面材料和散热器，其中模具材料抵靠微电子插入器第一表面的至少一部分。

5. 发明申请

US20140175644A1 METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMPERATURE SOLDER AND STRUCTURES FORMED THERBY 有权
标题翻译：形成超低密度包装结构的方法，包括低温焊料和形成的结构
公开(公告)号：US20140175644A1
公开(公告)日：2014-06-26
申请号：US13721329
申请日：2012-12-20
申请人： Sriram Srinivasan , Ram S. Viswanath , Paul R. Start , Rajen S. Sidhu , Rajasekaran Swaminathan
发明人： Sriram Srinivasan , Ram S. Viswanath , Paul R. Start , Rajen S. Sidhu , Rajasekaran Swaminathan
IPC分类号： H01L23/00 , H01L23/498
CPC分类号： H01L24/81 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L23/49838 , H01L23/562 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2224/81203 , H01L2224/8121 , H01L2224/81801 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/1436 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/20105 , H01L2924/2064 , H01L2924/20643 , H01L2924/3511 , H01L2924/3512 , H01L2924/00014 , H01L2924/00
摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.
摘要翻译：描述了形成微电子封装结构的方法及由此形成的相关结构。这些方法和结构可以包括将装置附接到贴片基板，其中组装的装置和贴片基板包括翘曲，将组装的装置和贴片基板附接到插入件以形成封装结构，然后在温度下回流封装结构低于大约200摄氏度以形成基本平坦的包装结构。

6. 发明授权

US08508040B2 In-situ foam materials as integrated heat spreader (IHS) sealant 有权
标题翻译：作为集成散热器（IHS）密封剂的原位泡沫材料
公开(公告)号：US08508040B2
公开(公告)日：2013-08-13
申请号：US12957738
申请日：2010-12-01
申请人： Paul R. Start , Rahul N. Manepalli
发明人： Paul R. Start , Rahul N. Manepalli
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L21/50 , H01L21/563 , H01L23/367 , H01L23/42 , H01L23/4275 , H01L2224/73204
摘要： An integrated heat spreader (IHS) lid over a semiconductor die connected to a substrate forms a cavity. A bead of foaming material may be placed within the IHS cavity. During an IHS cure and reflow process the foaming material will expand and fill the IHS cavity and the foam's shape conforms to the various surface features present, encapsulating a thermal interface material (TIM) material, and increasing contact area of the foam sealant.
摘要翻译：与衬底连接的半导体管芯上的集成散热器（IHS）盖形成空腔。发泡材料珠可以放置在IHS腔内。在IHS固化和回流工艺期间，发泡材料将膨胀并填充IHS腔，并且泡沫的形状符合存在的各种表面特征，包封热界面材料（TIM）材料，并增加泡沫密封剂的接触面积。

7. 发明申请

US20120139093A1 IN-SITU FOAM MATERIAL AS INTEGRATED HEAT SPREADER (IHS) SEALANT 有权
标题翻译： IN-SITU泡沫材料作为集成散热器（IHS）密封剂
公开(公告)号：US20120139093A1
公开(公告)日：2012-06-07
申请号：US12957738
申请日：2010-12-01
申请人： Paul R. Start , Rahul N. Manepalli
发明人： Paul R. Start , Rahul N. Manepalli
IPC分类号： H01L23/427 , H01L21/50
CPC分类号： H01L21/50 , H01L21/563 , H01L23/367 , H01L23/42 , H01L23/4275 , H01L2224/73204
摘要： An integrated heat spreader (IHS) lid over a semiconductor die connected to a substrate forms a cavity. A bead of foaming material may be placed within the IHS cavity. During an IHS cure and reflow process the foaming material will expand and fill the IHS cavity and the foam's shape conforms to the various surface features present, encapsulating a thermal interface material (TIM) material, and increasing contact area of the foam sealant.
摘要翻译：与衬底连接的半导体管芯上的集成散热器（IHS）盖形成空腔。发泡材料珠可以放置在IHS腔内。在IHS固化和回流工艺期间，发泡材料将膨胀并填充IHS腔，并且泡沫的形状符合存在的各种表面特征，包封热界面材料（TIM）材料，并增加泡沫密封剂的接触面积。

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