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    • 1. 发明授权
    • Method for making a pressure transducer
    • 制造压力传感器的方法
    • US5544399A
    • 1996-08-13
    • US394526
    • 1995-02-17
    • Robert P. BishopPaul L. Hainey
    • Robert P. BishopPaul L. Hainey
    • G01L9/12G01L9/00H01L29/84H01G7/00
    • G01L9/0075Y10T29/43Y10T29/49103
    • A monolithic capacitive pressure transducer (12, 12') is made by separately forming under pressure a diaphragm (22, 22') and a base (24, 24') having a recess (26) in the top surface using ceramic powder coated with an organic binder. Metal layers are deposited on the two pieces and the pieces are then joined together to form a single unit. A spacer (36) may be inserted in the recess to ensure that a predetermined gap is maintained between the two parts during the joining operation. The parts are then heated to allow the binder organics, as well as the spacer organics if a spacer is employed, to be vaporized and/or decomposed and removed through the open pores of the diaphragm and base and then sintered to change the parts into a monolithic body and to convert the metallized layer into a conductive layer bonded to the ceramic. In one embodiment the metal layers include terminal pads (18b, 19c, 20c) formed on the diaphragm and joinder pads (19b, 20b) formed on the base around terminal receiving bores (34, 32) each in alignment with a terminal pad. In a second embodiment terminal pads (18b', 19d', 20d') are formed on the diaphragm with vias extending radially inwardly from terminal pads (19d', 20d') to respective connecting pads (19c', 20c') which are aligned with joinder pads (19b', 20b') formed on the base. The base has a recessed portion (24b') in its outer wall providing access to terminal pads (18b', 19d', 20d').
    • 单片式电容式压力传感器(12,12')通过在压力下分别形成隔膜(22,22')和在顶表面上具有凹部(26)的基座(24,24'),该陶瓷粉末涂覆有 有机粘合剂。 金属层沉积在两片上,然后将片连接在一起以形成单个单元。 间隔件(36)可以插入凹部中,以确保在接合操作期间在两个部件之间保持预定的间隙。 然后将部件加热以允许粘合剂有机物以及间隔器有机物,如果使用间隔物,则通过隔膜和基底的开孔气化和/或分解和去除,然后烧结以将部件改变为 并且将金属化层转化成结合到陶瓷的导电层。 在一个实施例中,金属层包括形成在隔膜上的端子焊盘(18b,19c,20c)和形成在端子接收孔(34,32)上的基座上的接合焊盘(19b,20b),每个端子接头孔与端子焊盘对准。 在第二实施例中,端子焊盘(18b',19d',20d')在隔膜上形成有从端子焊盘(19d',20d')径向向内延伸到相应连接焊盘(19c',20c')的相应连接焊盘 具有形成在基座上的接合垫(19b',20b')。 底座在其外壁上具有凹入部分(24b'),提供对端子焊盘(18b',19d',20d')的通路。
    • 2. 发明授权
    • Pressure transducer apparatus with monolithic body of ceramic material
    • 带陶瓷材料整体式的压力传感器装置
    • US5499158A
    • 1996-03-12
    • US339038
    • 1994-11-14
    • Robert P. BishopPaul L. HaineyStanley J. LukasiewiczAllan J. SiuzdakRobert E. Luminello, Jr.Vishwa N. Shukla
    • Robert P. BishopPaul L. HaineyStanley J. LukasiewiczAllan J. SiuzdakRobert E. Luminello, Jr.Vishwa N. Shukla
    • G01L9/00H01G7/00
    • G01L9/0075
    • A monolithic capacitive pressure transducer (12) is shown composed of ceramic material having a first closed cavity (12) separated from a surface thereof by a flexible wall member and a second closed cavity (16) defined by rigid wall members. Capacitor plates (32, 36; 40, 44) are formed on two opposed surfaces defining each cavity. Vias (33, 37; 41, 45) are formed extending from the capacitor plates to permit electrical connection therewith. The transducer is made by separately forming under pressure a diaphragm (20) and first and second base portions (22, 30) having recesses (24) in the top and bottom surfaces using ceramic powder coated with an organic binder. A metal layer is deposited on the pieces which are then joined together to form a single unit. A spacer (26) may be inserted in the recesses to ensure that a predetermined gap is maintained in each cavity during the joining operation. The parts are then debinderized by heating to a first temperature level to allow the binder organics, as well as the spacer organics if a spacer is employed, to be vaporized and/or decomposed and removed through the open pores of the diaphragm and base. The unit is then brought up to a sintering temperature to change it into a monolithic body and to convert the metallized layer into a conductive layer bonded to the ceramic.
    • 单体电容式压力传感器(12)由陶瓷材料组成,陶瓷材料具有通过柔性壁构件从其表面分离的第一闭合腔(12)和由刚性壁构件限定的第二闭合腔(16)。 在限定每个空腔的两个相对的表面上形成电容器板(32,36; 40,44)。 通孔(33,37,41,45)形成为从电容器板延伸以允许与其电连接。 传感器通过在压力下分开地形成隔膜(20)和在顶表面和底表面上具有凹部(24)的第一和第二基部(22,30),其中使用涂覆有机粘合剂的陶瓷粉末。 金属层沉积在片上,然后将它们连接在一起以形成单个单元。 可以在凹槽中插入间隔件(26),以确保在接合操作期间在每个空腔中保持预定的间隙。 然后通过加热到第一温度水平来使部件脱粘,以允许粘合剂有机物以及间隔物有机物,如果使用间隔物,则通过隔膜和基底的开孔气化和/或分解和除去。 然后将该单元升温至烧结温度以将其改变成单片体并将金属化层转化为结合到陶瓷的导电层。
    • 3. 发明授权
    • Pressure transducer apparatus and method for making same
    • 压力传感器装置及其制造方法
    • US5436795A
    • 1995-07-25
    • US218785
    • 1994-03-28
    • Robert P. BishopPaul L. Hainey
    • Robert P. BishopPaul L. Hainey
    • G01L9/12G01L9/00H01L29/84H01G7/00H01G5/011
    • G01L9/0075Y10T29/43Y10T29/49103
    • A monolithic capacitive pressure transducer (12, 12') is made by separately forming under pressure a diaphragm (22, 22') and a base (24, 24') having a recess (14) in the top surface using ceramic powder coated with an organic binder. Metal layers are deposited on the two pieces and the pieces are then joined together to form a single unit. A spacer (36) may be inserted in the recess to ensure that a predetermined gap is maintained between the two parts during the joining operation. The parts are then heated to allow the binder organics, as well as the spacer organics if a spacer is employed, to be vaporized and/or decomposed and removed through the open pores of the diaphragm and base and then sintered to change the parts into a monolithic body and to convert the metallized layer into a conductive layer bonded to the ceramic. In one embodiment the metal layers include terminal pads (18b, 19c, 20c) formed on the diaphragm and joinder pads (19b, 20b) formed on the base around terminal receiving bores (34, 32) each in alignment with a terminal pad. In a second embodiment terminal pads (18b', 19d', 20d') are formed on the diaphragm with vias extending radially inwardly from terminal pads (19d', 20d') to respective connecting pads (19c', 20c') which are aligned with joinder pads (19b', 20b') formed on the base. The base has a recessed portion (24b') in its outer wall providing access to terminal pads (18b', 19d', 20d').
    • 单片式电容式压力传感器(12,12')通过在压力下分别形成隔膜(22,22')和在顶表面上具有凹部(14)的基座(24,24'),使用涂覆有 有机粘合剂。 金属层沉积在两片上,然后将片连接在一起以形成单个单元。 间隔件(36)可以插入凹部中,以确保在接合操作期间在两个部件之间保持预定的间隙。 然后将部件加热以允许粘合剂有机物以及间隔器有机物,如果使用间隔物,则通过隔膜和基底的开孔气化和/或分解和去除,然后烧结以将部件改变为 并且将金属化层转化成结合到陶瓷的导电层。 在一个实施例中,金属层包括形成在隔膜上的端子焊盘(18b,19c,20c)和形成在端子接收孔(34,32)上的基座上的接合焊盘(19b,20b),每个端子接头孔与端子焊盘对准。 在第二实施例中,端子焊盘(18b',19d',20d')在隔膜上形成有从端子焊盘(19d',20d')径向向内延伸到相应连接焊盘(19c',20c')的相应连接焊盘 具有形成在基座上的接合垫(19b',20b')。 底座在其外壁上具有凹入部分(24b'),提供对端子焊盘(18b',19d',20d')的通路。