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1. 发明申请

US20120023464A1 AUTOMATIC IDENTIFICATION OF SYSTEMATIC REPEATING DEFECTS IN SEMICONDUCTOR PRODUCTION 有权
标题翻译：自动识别半导体生产中的系统重复缺陷
公开(公告)号：US20120023464A1
公开(公告)日：2012-01-26
申请号：US13007556
申请日：2011-01-14
申请人： Paul Kuang Chi Lin , Dong Kang , Yong Gang Wang , Yulei Zhang
发明人： Paul Kuang Chi Lin , Dong Kang , Yong Gang Wang , Yulei Zhang
IPC分类号： G06F17/50
CPC分类号： G03F1/84 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8877
摘要： A method includes capturing an image of the pattern using one or more scans across a surface of the partially completed wafer. The method includes processing information associated with the captured image of the pattern in a first format (e.g., pixel domain) into a second format, e.g., transform domain. The method includes determining defect information associated with the image of the pattern in the second format and processing the defect information (e.g., wafer identification, product identification, layer information, x-y die scanned) to identify at least one defect associated with a spatial location of a repeating pattern on the partially completed wafer provided by a reticle. The method includes identifying the reticle associated with the defect and a stepper associated with the reticle having the defect and ceasing operation of the stepper. The damaged reticle is replaced, and the process resumes using a replaced reticle.
摘要翻译：一种方法包括使用在部分完成的晶片的表面上的一次或多次扫描来捕获图案的图像。该方法包括以与第一格式（例如，像素域）中的图案的捕获图像相关联的信息处理成第二格式，例如变换域。该方法包括确定与第二格式的图案的图像相关联的缺陷信息，并处理缺陷信息（例如，晶片识别，产品识别，层信息，xy模扫描），以识别与空间位置相关联的至少一个缺陷在由光罩提供的部分完成的晶片上的重复图案。所述方法包括识别与所述缺陷相关联的掩模版和与所述掩模版相关联的具有所述缺陷并且所述步进器停止操作的步进器。损坏的标线被更换，并且使用更换的掩模版恢复工艺。

2. 发明授权

US07991497B2 Method and system for defect detection in manufacturing integrated circuits 有权
标题翻译：制造集成电路中缺陷检测的方法和系统
公开(公告)号：US07991497B2
公开(公告)日：2011-08-02
申请号：US12258786
申请日：2008-10-27
申请人： Paul Kuang-Chi Lin , Sophia Zhang
发明人： Paul Kuang-Chi Lin , Sophia Zhang
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32191 , G05B2219/32221 , G05B2223/02 , H01L22/12 , Y02P90/22
摘要： Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed. Moreover, the method includes a step for identifying a set of processing steps. For example, the set of processing step are possibly associated with the defect characteristic.
摘要翻译：制造集成电路中缺陷检测的方法和系统。在一个实施例中，本发明提供了用于识别一个或多个源的方法，用于在集成电路中可能导致制造检测。该方法包括提供多个半导体衬底的步骤。该方法包括使用多个处理工具在多个处理步骤中处理多个半导体衬底的步骤。该方法还包括提供数据库的步骤，数据库包括与多个半导体衬底的处理相关联的数据。该方法还包括在多个半导体衬底的处理之后测试多个半导体晶片的步骤。此外，该方法包括用于检测与已经处理的多个半导体衬底相关联的至少一个缺陷特性的步骤。此外，该方法包括用于识别一组处理步骤的步骤。例如，该组处理步骤可能与缺陷特性相关联。

3. 发明申请

US20100004775A1 METHOD AND SYSTEM FOR DEFECT DETECTION IN MANUFACTURING INTEGRATED CIRCUITS 有权
标题翻译：制造集成电路缺陷检测方法与系统
公开(公告)号：US20100004775A1
公开(公告)日：2010-01-07
申请号：US12258786
申请日：2008-10-27
申请人： Paul Kuang-Chi Lin , Sophia Zhang
发明人： Paul Kuang-Chi Lin , Sophia Zhang
IPC分类号： G06N5/02 , G06F19/00 , G06F17/30 , G06F17/40
CPC分类号： G05B19/41875 , G05B2219/32191 , G05B2219/32221 , G05B2223/02 , H01L22/12 , Y02P90/22
摘要： Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed. Moreover, the method includes a step for identifying a set of processing steps. For example, the set of processing step are possibly associated with the defect characteristic.
摘要翻译：制造集成电路中缺陷检测的方法和系统。在一个实施例中，本发明提供了用于识别一个或多个源的方法，用于在集成电路中可能导致制造检测。该方法包括提供多个半导体衬底的步骤。该方法包括使用多个处理工具在多个处理步骤中处理多个半导体衬底的步骤。该方法还包括提供数据库的步骤，数据库包括与多个半导体衬底的处理相关联的数据。该方法还包括在多个半导体衬底的处理之后测试多个半导体晶片的步骤。此外，该方法包括用于检测与已经处理的多个半导体衬底相关联的至少一个缺陷特性的步骤。此外，该方法包括用于识别一组处理步骤的步骤。例如，该组处理步骤可能与缺陷特性相关联。

4. 发明授权

US08312395B2 Automatic identification of systematic repeating defects in semiconductor production 有权
标题翻译：自动识别半导体生产中的系统重复缺陷
公开(公告)号：US08312395B2
公开(公告)日：2012-11-13
申请号：US13007556
申请日：2011-01-14
申请人： Paul Kuang Chi Lin , Dong Kang , Yong Gang Wang , Yulei Zhang
发明人： Paul Kuang Chi Lin , Dong Kang , Yong Gang Wang , Yulei Zhang
IPC分类号： G06F17/50
CPC分类号： G03F1/84 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8877
摘要： A method includes capturing an image of the pattern using one or more scans across a surface of the partially completed wafer. The method includes processing information associated with the captured image of the pattern in a first format (e.g., pixel domain) into a second format, e.g., transform domain. The method includes determining defect information associated with the image of the pattern in the second format and processing the defect information (e.g., wafer identification, product identification, layer information, x-y die scanned) to identify at least one defect associated with a spatial location of a repeating pattern on the partially completed wafer provided by a reticle. The method includes identifying the reticle associated with the defect and a stepper associated with the reticle having the defect and ceasing operation of the stepper. The damaged reticle is replaced, and the process resumes using a replaced reticle.
摘要翻译：一种方法包括使用在部分完成的晶片的表面上的一次或多次扫描来捕获图案的图像。该方法包括以与第一格式（例如，像素域）中的图案的捕获图像相关联的信息处理成第二格式，例如变换域。该方法包括确定与第二格式的图案的图像相关联的缺陷信息，并处理缺陷信息（例如，晶片识别，产品识别，层信息，xy模扫描），以识别与空间位置相关联的至少一个缺陷在由光罩提供的部分完成的晶片上的重复图案。所述方法包括识别与所述缺陷相关联的掩模版和与所述掩模版相关联的具有所述缺陷并且所述步进器停止操作的步进器。损坏的标线被更换，并且使用更换的掩模版恢复工艺。

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