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1. 发明授权

US5567985A Electronic apparatus with compliant metal chip-substrate bonding layer(s) 失效
标题翻译：具有兼容金属芯片 - 基板结合层的电子设备
公开(公告)号：US5567985A
公开(公告)日：1996-10-22
申请号：US457551
申请日：1995-06-01
申请人： Charles D. Iacovangelo , Paul J. DiConza
发明人： Charles D. Iacovangelo , Paul J. DiConza
IPC分类号： H01L23/15 , H01L21/52 , H01L23/14 , H01L23/373 , H01L23/02 , H01L39/02
CPC分类号： H01L23/3736 , H01L23/3732 , H01L2924/0002
摘要： Differences in thermal expansion properties between integrated circuit chips, especially of gallium arsenide, and the dielectric substrates (especially diamond and aluminum nitride) on which said chips are mounted are accommodating by interposing between the substrate and the chip a mixed metal layer comprising at least one ductile, thermally conductive metal such as copper and at least one other metal, preferably a refractory metal, having a lower coefficient of thermal expansion, preferably tungsten. A compliant metal layer, typically of aluminum, silver, copper or gold, is preferably interposed between the substrate and the mixed metal layer.
摘要翻译：集成电路芯片（特别是砷化镓）和其上安装有所述芯片的电介质基板（特别是金刚石和氮化铝）之间的热膨胀特性的差异通过在基板和芯片之间插入包含至少一个延性导热金属，例如铜和至少一种其它具有较低热膨胀系数，优选钨的难熔金属的金属。通常为铝，银，铜或金的柔顺金属层优选介于基片和混合金属层之间。

2. 发明授权

US5372681A Preparation of molten salt electrolytes containing divalent titanium 失效
标题翻译：含二价钛的熔盐电解液的制备
公开(公告)号：US5372681A
公开(公告)日：1994-12-13
申请号：US96807
申请日：1993-07-26
申请人： Charles D. Iacovangelo , Paul J. DiConza
发明人： Charles D. Iacovangelo , Paul J. DiConza
IPC分类号： C01G23/00 , C22B5/04 , C22B34/12 , C25C3/36
CPC分类号： C22B5/04 , C01G23/00 , C22B34/1277 , C25C3/36
摘要： Divalent titanium is prepared by the reduction of higher valence titanium halides in a molten salt electrolyte for subsequent titanium deposition with aluminum to form alloys exhibiting excellent mechanical properties for use at high temperatures. At least one aluminum halide such as AlCl.sub.3 is combined with aluminum metal, at least one titanium halide such as TiCl.sub.3 where the titanium has a valence greater than two, and at least one salt capable of forming a melt with said aluminum halide at temperatures up to about 250.degree. C. to form a molten salt electrolyte. The salt may be an alkali, alkaline earth or organic halide. Upon heating in an inert atmosphere at a temperature greater than the melting point of the electrolyte, the higher valence titanium is reduced by aluminum metal to form divalent titanium. Titanium-aluminum alloys of up to 50 atomic percent titanium can then be deposited from the electrolyte.
摘要翻译：二价钛是通过在熔融盐电解质中还原较高价态的卤化钛来制备的，随后用铝沉积铝，以形成在高温下使用的优异机械性质的合金。至少一种铝卤化物如AlCl 3与铝金属，至少一种钛卤化物如TiCl 3（其中钛的价数大于2）和至少一种能够与所述卤化铝熔融形成的盐在至多约250℃以形成熔融盐电解质。盐可以是碱，碱土或有机卤化物。在惰性气氛中，在大于电解质熔点的温度下加热时，由铝金属还原较高价钛，形成二价钛。然后可以从电解质沉积高达50原子％的钛的钛 - 铝合金。

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