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1. 发明授权

US08134187B2 Integrated mask-programmable logic devices with multiple metal levels and manufacturing process thereof 有权
标题翻译：具有多种金属级别的集成掩模可编程逻辑器件及其制造工艺
公开(公告)号：US08134187B2
公开(公告)日：2012-03-13
申请号：US12343621
申请日：2008-12-24
申请人： Patrik Vacula , Milos Vacula , Milan Lzicar
发明人： Patrik Vacula , Milos Vacula , Milan Lzicar
IPC分类号： H01L29/66 , H01L21/00 , H01L23/48 , H01L27/10
CPC分类号： H03K19/17736 , H03K19/1735 , H03K19/17796
摘要： Integrated mask-programmable device, having a plurality of metal levels including a top metal level, a bottom metal level and a first intermediate metal level formed between the top and bottom metal levels, and a plurality of via levels arranged between the bottom and the first intermediate metal levels and between the first intermediate and the top metal levels and connecting each metal level to adjacent metal levels. The plurality of metal levels forms a first, a second and at least a third terminal, the top and bottom metal levels having at least two metal regions, and the first intermediate metal level having at least three metal regions. The first terminal is connected to third terminal or the second terminal is connected to the third terminal by modifying a single metal or via level.
摘要翻译：集成掩模可编程装置，具有多个金属层，包括形成在顶部和底部金属层之间的顶部金属层，底部金属层和第一中间金属层，以及布置在底部和底部金属层之间的多个通孔层中间金属水平和第一中间和顶部金属水平之间并且将每个金属水平连接到相邻的金属水平。多个金属层形成第一，第二和至少第三端子，顶部和底部金属层具有至少两个金属区域，并且第一中间金属层具有至少三个金属区域。第一端子连接到第三端子，或者通过修改单个金属或通孔电平将第二端子连接到第三端子。

2. 发明申请

US20090166683A1 FLEXIBLE LAYOUT FOR INTEGRATED MASK-PROGRAMMABLE LOGIC DEVICES AND MANUFACTURING PROCESS THEREOF 有权
标题翻译：集成式可编程逻辑器件的灵活布局及其制造工艺
公开(公告)号：US20090166683A1
公开(公告)日：2009-07-02
申请号：US12343621
申请日：2008-12-24
申请人： Patrik VACULA , Milos VACULA , Milan LZICAR
发明人： Patrik VACULA , Milos VACULA , Milan LZICAR
IPC分类号： H01L29/66 , H01L21/00
CPC分类号： H03K19/17736 , H03K19/1735 , H03K19/17796
摘要： Integrated mask-programmable device, having a plurality of metal levels including a top metal level, a bottom metal level and a first intermediate metal level formed between the top and bottom metal levels, and a plurality of via levels arranged between the bottom and the first intermediate metal levels and between the first intermediate and the top metal levels and connecting each metal level to adjacent metal levels. The plurality of metal levels forms a first, a second and at least a third terminal, the top and bottom metal levels having at least two metal regions, and the first intermediate metal level having at least three metal regions. The first terminal is connected to third terminal or the second terminal is connected to the third terminal by modifying a single metal or via level.
摘要翻译：集成掩模可编程装置，具有多个金属层，包括形成在顶部和底部金属层之间的顶部金属层，底部金属层和第一中间金属层，以及布置在底部和底部金属层之间的多个通孔层中间金属水平和第一中间和顶部金属水平之间并且将每个金属水平连接到相邻的金属水平。多个金属层形成第一，第二和至少第三端子，顶部和底部金属层具有至少两个金属区域，并且第一中间金属层具有至少三个金属区域。第一端子连接到第三端子，或者通过修改单个金属或通孔电平将第二端子连接到第三端子。

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