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    • 1. 发明申请
    • PROCESS FOR COATING A SUBSTRATE BY MEANS OF AN ARC
    • 通过电弧涂覆基板的方法
    • US20130146445A1
    • 2013-06-13
    • US13808577
    • 2011-07-12
    • Oliver Kayser
    • Oliver Kayser
    • C23C14/32
    • C23C14/325C23C14/0021C25B11/00H01J37/32055H01J37/3244H01J37/32568H01J37/32614H01J2237/332
    • The invention relates to a process and an evaporator for coating a substrate by means of an arc in a vacuum chamber (10) in the case of low-pressure arc evaporation, wherein the vacuum chamber (10) has at least one evaporator, which comprises a target material (20), reactive gas supply lines (53, 54) for supplying reactive gas, and a vacuum pump, wherein the evaporator comprising the target material (20) serves as the cathode and the inner wall (36) of the vacuum chamber (10) serves as the anode between which the arc is generated. According to the invention, high-melting point metal is used as the target material (20) for catalysis, and the pressure in the vacuum chamber (20) during coating is at least 0.5 Pa, in particular at least 3 Pa, preferably 5 Pa. A layer of catalytically active metal having a high oxygen content is formed on the substrate.
    • 本发明涉及一种用于在低压电弧蒸发的情况下通过真空室(10)中的电弧涂覆衬底的工艺和蒸发器,其中真空室(10)具有至少一个蒸发器,其包括 目标材料(20),用于供应反应性气体的反应气体供应管线(53,54)和真空泵,其中包括目标材料(20)的蒸发器用作阴极和真空的内壁(36) 室(10)用作产生电弧的阳极。 根据本发明,使用高熔点金属作为催化剂的目标材料(20),并且涂覆期间真空室(20)中的压力为至少0.5Pa,特别是至少3Pa,优选5Pa 在衬底上形成具有高氧含量的催化活性金属层。