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2. 发明授权

US06285047B1 Linear image sensor device, IC assembling substrate and method for assembling the same 失效
标题翻译：线性图像传感器装置，IC组装基板及其组装方法
公开(公告)号：US06285047B1
公开(公告)日：2001-09-04
申请号：US08618919
申请日：1996-03-20
申请人： Satoshi Machida , Yukito Kawahara , Masahiro Yokomichi , Yoshikazu Kojima , Noritoshi Ando
发明人： Satoshi Machida , Yukito Kawahara , Masahiro Yokomichi , Yoshikazu Kojima , Noritoshi Ando
IPC分类号： H01L31062
CPC分类号： H01L27/14632 , H01L27/14621 , H01L27/14645 , H01L27/14687
摘要： A linear image sensor IC comprising a plurality of switching circuits each connected to a plurality of light receiving elements in series; scanning circuits for sequentially switching said switching circuits; and driving circuits for operating said scanning circuits, wherein a LOCOS isolation layer is formed between an edge in the main scanning direction of the linear image sensor IC which is closest to an array of the light receiving elements and a light receiving portion of the light receiving element. The inventive image sensor IC is mounted by devising so that the circuit can be put into a thin and long pattern in the scanning direction, so that the chip having a width thinner than a thickness thereof which had been beyond expectation by the prior art can be realized. The use of this very thin IC allows a compact IC assembling substrate having less fluctuation among ICs to be manufactured at low cost. Even more, it becomes possible to mount ICs readily on a cylindrical substrate which had been also difficult in the past. Thereby, electronic devices such as a compact and low cost multi-chip type image sensor or multi-chip type thermal head can be realized. Accordingly, it becomes possible to bring down the cost thereof, which had been difficult in the past, and to realize a low cost facsimile.
摘要翻译：一种线性图像传感器IC，包括多个开关电路，每个开关电路串联连接到多个光接收元件; 用于顺序地切换所述开关电路的扫描电路; 以及用于操作所述扫描电路的驱动电路，其中在最接近光接收元件的阵列的线性图像传感器IC的主扫描方向上的边缘和光接收的光接收部分之间形成LOCOS隔离层元件。通过设计安装本发明的图像传感器IC，使得电路可以沿扫描方向成为薄且长的图案，使得具有比现有技术超出预期的厚度的芯片的厚度可以是实现了使用这种非常薄的IC允许以低成本制造IC之间具有较小波动的紧凑型IC组装衬底。更进一步地，可以将IC容易地安装在过去也是困难的圆筒形基板上。因此，可以实现诸如紧凑且低成本的多芯片型图像传感器或多芯片型热敏头之类的电子设备。因此，可以降低过去困难的成本，实现低成本的传真。

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