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1. 发明授权

US5136366A Overmolded semiconductor package with anchoring means 失效
标题翻译：包覆成型的半导体封装，具有固定手段
公开(公告)号：US5136366A
公开(公告)日：1992-08-04
申请号：US609355
申请日：1990-11-05
申请人： Nicolaas H. Worp , Bruce J. Freyman , Kurt C. Conrath
发明人： Nicolaas H. Worp , Bruce J. Freyman , Kurt C. Conrath
IPC分类号： H01L23/31 , H05K3/30
CPC分类号： H05K3/303 , H01L23/3121 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , H05K2203/167 , Y02P70/613
摘要： An overmolded semiconductor package (150) is formed by electrically and mechanically attaching a semiconductor device (100) to a substrate (110) having at least one hole (130). A plastic molding compound (140) is overmolded around the semiconductor device 100) so as to encapsulate the device, the molding compound (140) extending at least partially into the substrate hole (130) to form an anchor (135) to aid in bonding the molding compound to the substrate. An alternate embodiment of the invention forms a pedestal (449) from the portion of the molding compound extending beyond the surface of the substrate. The pedestal functions as an anchor to aid in bonding the molding compound (440) to the substrate, and also as a spacer to maintain a preselected clearance between the substrate (410) and the printed circuit board (460). The portion of the molding compound extending beyond the surface of the substrate may also be used to form an alignment pin (548). The pin functions as an anchor to aid in bonding the molding compound to the substrate, and also as an alignment aid to maintain positional relationships between the substrate and the printed circuit board. In another embodiment of the invention, the overmolded semiconductor is mounted directly on a printed circuit board containing other active circuitry.
摘要翻译：通过将半导体器件（100）电连接和机械地附接到具有至少一个孔（130）的衬底（110）来形成包覆成型的半导体封装（150）。一种塑料模塑料（140）在半导体器件100周围包覆成型以封装该器件，该模塑料料140至少部分地延伸到衬底孔130中以形成锚固件，以帮助粘合模塑料到基材。本发明的替代实施例从延伸超过衬底表面的模制化合物的部分形成基座（449）。基座用作锚固件，以有助于将模塑料（440）粘合到基材上，并且还用作间隔件，以在基板（410）和印刷电路板（460）之间保持预选的间隙。延伸超过基板表面的模塑料的部分也可用于形成对准销（548）。该引脚用作锚固件以有助于将模塑料粘合到基材上，并且还用作对准助剂以保持基板和印刷电路板之间的位置关系。在本发明的另一实施例中，包覆成型的半导体直接安装在包含其它有源电路的印刷电路板上。

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