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1. 发明授权

US4914813A Refurbishing of prior used laminated ceramic packages 失效
标题翻译：翻新现有的层压陶瓷包装
公开(公告)号：US4914813A
公开(公告)日：1990-04-10
申请号：US276238
申请日：1988-11-25
申请人： Francis W. Layher , Napoleon Fulinara
发明人： Francis W. Layher , Napoleon Fulinara
IPC分类号： H01L21/48
CPC分类号： H01L21/4864 , Y10T29/49149 , Y10T29/49721 , Y10T29/49726
摘要： The invention is directed to a process for refurbishing of prior used laminated ceramic packages with the example shown as a pin grid array ceramic package which includes a ceramic substrate with a central opening or cavity, a plurality of conductors are embedded therein in one or more layers which have electrical condtinuity from the outer edge thereof to the central opening (this continuity path may extend through one or more layers) and to an equal plurality of conductive pads on the surface of the substrate. The bottom surface of the cavity may be enclosed by a metallic heat sink cover, an electronic chip (die) is adhered by silver glass or other adhering substance to the bottom surface of the cavity and electrically connected via small diameter conductors to the ends of the plurality of embedded conductors adjacent to the central opening, a plurality of pins are physically and conductively attached to each of the conductive pad on the surface of the substrate and a cover attached over the chip for covering the electronic chip and conductors. In effect the laminated ceramic packages assembled as hereinbefore mentioned are precision reverse manufactured or stripped down by specific steps to a bare ceramic substrate and rebuilt to its original configuration for reuse.
摘要翻译：本发明涉及一种用于翻新现有使用的层压陶瓷封装的方法，其中所示的示例为引脚格栅阵列陶瓷封装，其包括具有中心开口或空腔的陶瓷基板，多个导体嵌入其中一个或多个层其从其外边缘到中心开口具有电连续性（该连续路径可以延伸穿过一个或多个层）以及衬底表面上的等量的多个导电焊盘。空腔的底面可以由金属散热器盖封闭，电子芯片（模具）通过银玻璃或其他粘附物质粘附到空腔的底表面，并通过小直径导体电连接到与中心开口相邻的多个嵌入式导体，多个引脚物理地和导电地连接到基板的表面上的每个导电焊盘，以及附接在芯片上的覆盖电子芯片和导体的盖。实际上，如上所述组装的层压陶瓷封装是通过特定步骤精确地反向制造或剥离到裸陶瓷衬底，并重建成其原始构型以供重复使用。

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