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1. 发明申请

US20090075424A1 Process for making microelectronic element chips 失效
标题翻译：制造微电子元件芯片的工艺
公开(公告)号：US20090075424A1
公开(公告)日：2009-03-19
申请号：US12291974
申请日：2008-11-17
申请人： Vladmir A. Aksyuk , Nagesh R. Basavanhally , Avinoam Kornblitt , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
发明人： Vladmir A. Aksyuk , Nagesh R. Basavanhally , Avinoam Kornblitt , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
IPC分类号： H01L21/50
CPC分类号： H01L21/6835 , B81B7/0006 , B81B7/04 , H01L21/486 , H01L21/6836 , H01L23/147 , H01L23/5384 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L2221/68318 , H01L2221/68327 , H01L2221/68372 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/1147 , H01L2224/11472 , H01L2224/13025 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/16 , H01L2224/81001 , H01L2224/81801 , H01L2924/0002 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05552
摘要： Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces. Process including: providing an apparatus including a chip substrate having a first chip surface facing away from a second chip surface, an array of microelectronic elements being on the first chip surface, an array of conductors each being in communication with one of the microelectronic elements and partially spanning an average distance between the first and second chip surfaces; bonding a temporary support carrier onto the array of microelectronic elements; removing a portion of the chip substrate, thereby reducing the average distance between the first and second chip surfaces; and forming an under bump metallization pad at the second chip surface in electrical communication with a conductor.
摘要翻译：一种装置，包括具有背离第二芯片表面的第一芯片表面的芯片衬底; 第一芯片表面上的微电子元件阵列; 以及每个与所述微电子元件中的一个连通的导体阵列，所述导体穿过所述芯片基板并且完全跨越所述第一和第二芯片表面之间的距离。该方法包括：提供包括芯片衬底的装置，该芯片衬底具有背离第二芯片表面的第一芯片表面，位于第一芯片表面上的微电子元件阵列，每个导体阵列与微电子元件中的一个连接，部分跨越第一和第二芯片表面之间的平均距离; 将临时支撑载体接合到微电子元件阵列上; 去除所述芯片基板的一部分，从而减小所述第一和第二芯片表面之间的平均距离; 以及在所述第二芯片表面处形成与导体电连通的凸块下金属化焊盘。

2. 发明授权

US5281301A Alignment and assembly method 失效
标题翻译：校准和组装方法
公开(公告)号：US5281301A
公开(公告)日：1994-01-25
申请号：US878245
申请日：1992-05-04
申请人： Nagesh R. Basavanhally
发明人： Nagesh R. Basavanhally
IPC分类号： G02B6/40 , B81B1/00 , B81C3/00 , G02B6/32 , G02B6/36 , G02B6/38 , G02B6/44 , B44C1/22
CPC分类号： G02B6/362 , G02B6/32 , G02B6/3834 , G02B6/3839 , G02B6/3885 , G02B6/3887 , G02B6/4439 , G02B6/3644 , G02B6/3652 , G02B6/3672 , G02B6/3692 , G02B6/3854
摘要： A first array of microlenses (16) on a lens substrate (15) is accurately aligned with a lens holder (20) by making a second array of microlenses (17) simultaneously with the first array. The second array of microlenses is arranged around the periphery of the lens substrate and is made solely for alignment purposes, rather than for focusing light. An array of detents (21, FIG. 2) is made in one surface of the lens holder such that, when the lens holder is abutted against the lens substrate, each microlens (17) of the second array can extend into one of the detents of the lens holder member, thereby to align the first array of microlenses with the lens holder member. The lens holder member has an opening (22) to permit light to be transmitted to or from the first array of microlenses (16). A pair of alignment pins (24) aligns the lens holder member with an array of optical fibers (12).
摘要翻译：透镜基板（15）上的第一阵列的微透镜（16）通过与第一阵列同时地形成第二阵列的微透镜（17）而与透镜保持器（20）精确对准。第二微透镜阵列布置在透镜基底的周边周围，并且仅用于对准目的，而不是用于聚焦光。在透镜保持器的一个表面上形成一系列制动器（21，图2），使得当透镜保持器抵靠透镜基板时，第二阵列的每个微透镜（17）可以延伸到一个掣子从而使第一阵列的微透镜与透镜保持器构件对准。透镜保持器构件具有允许光从第一阵列的微透镜（16）传出或从第一阵列的微透镜（16）传输的开口（22）。一对对准销（24）将透镜架构件与光纤阵列（12）对准。

3. 发明授权

US5212754A Optical laser connector 失效
标题翻译：光学激光连接器
公开(公告)号：US5212754A
公开(公告)日：1993-05-18
申请号：US815296
申请日：1991-12-27
申请人： Nagesh R. Basavanhally , D. Bruce Buchholz , Anthony F. J. Levi , Ronald A. Nordin
发明人： Nagesh R. Basavanhally , D. Bruce Buchholz , Anthony F. J. Levi , Ronald A. Nordin
IPC分类号： G02B6/38 , G02B6/42 , H01S5/022 , H01S5/40
CPC分类号： G02B6/4249 , G02B6/3885 , H01S5/02276 , H01S5/02284 , H01S5/4031
摘要： Connector apparatus for coupling an optical fiber cable with laser devices. The apparatus comprises a receptacle terminating aligned fibers of the optical cable in a planar surface perpendicular to a central axis of the receptacle. A plug mounts a plurality of laser devices each having an electrical terminal for connecting a laser device to an external source and an optical terminal aligned in a planar surface perpendicular to a central axis of the plug with each optical terminal positioned to correspond with one of the receptacle fibers. The plug slidably engages the receptacle and is affixed thereto to position the receptacle planar surface adjacent to and aligned with the plug planar surface to optically couple each laser device with a corresponding fiber of the optical cable.
摘要翻译：用于将光纤电缆与激光装置连接的连接器装置。该装置包括一个插座，该插座在垂直于插座中心轴的平面上终止光缆的对准光纤。插头安装多个激光装置，每个激光装置具有用于将激光装置连接到外部源的电端子和与垂直于插头的中心轴线的平面垂直的光学终端，每个光学终端被定位成与插座纤维。插头可滑动地接合插座并且被固定到其上以将插座平面表面定位成与插头平面相邻并对准插头平面，以将每个激光装置与光缆的相应光纤光学耦合。

4. 发明授权

US08343807B2 Process for making microelectronic element chips 失效
公开(公告)号：US08343807B2
公开(公告)日：2013-01-01
申请号：US12291974
申请日：2008-11-17
申请人： Vladimir Anatolyevich Aksyuk , Nagesh R Basavanhally , Avinoam Kornblit , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
发明人： Vladimir Anatolyevich Aksyuk , Nagesh R Basavanhally , Avinoam Kornblit , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
IPC分类号： H01L31/0224 , H01L23/535
CPC分类号： H01L21/6835 , B81B7/0006 , B81B7/04 , H01L21/486 , H01L21/6836 , H01L23/147 , H01L23/5384 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L2221/68318 , H01L2221/68327 , H01L2221/68372 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/1147 , H01L2224/11472 , H01L2224/13025 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/16 , H01L2224/81001 , H01L2224/81801 , H01L2924/0002 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05552
摘要： Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces. Process including: providing an apparatus including a chip substrate having a first chip surface facing away from a second chip surface, an array of microelectronic elements being on the first chip surface, an array of conductors each being in communication with one of the microelectronic elements and partially spanning an average distance between the first and second chip surfaces; bonding a temporary support carrier onto the array of microelectronic elements; removing a portion of the chip substrate, thereby reducing the average distance between the first and second chip surfaces; and forming an under bump metallization pad at the second chip surface in electrical communication with a conductor.

5. 发明授权

US07649670B2 Method and apparatus for controlling curvatures of microlenses and micromirrors 有权
标题翻译：用于控制微透镜和微镜的曲率的方法和装置
公开(公告)号：US07649670B2
公开(公告)日：2010-01-19
申请号：US11245761
申请日：2005-10-07
申请人： Nagesh R. Basavanhally , Dan M. Marom
发明人： Nagesh R. Basavanhally , Dan M. Marom
IPC分类号： G02B26/00
CPC分类号： G02B3/0056 , G02B3/0006 , G02B3/14 , G02B26/0825
摘要： The invention includes a method and apparatus for controlling curvatures of light directing devices. The apparatus includes a first substrate portion having formed therein a plurality of cavities, and a substantially flexible membrane disposed over the cavities for forming a respective plurality of light directing mechanisms, the light directing mechanisms disposed over the cavities. The respective curvatures of the light directing mechanisms are set using a pressure difference across each of the membrane portions disposed over the cavities. The respective curvatures of the light directing mechanisms may be controllably adjusted during operation of the light directing mechanisms.
摘要翻译：本发明包括一种用于控制光导装置的曲率的方法和装置。该装置包括在其中形成有多个空腔的第一基板部分和设置在空腔上的基本上柔性的膜，用于形成相应的多个光引导机构，所述光引导机构设置在空腔上方。光引导机构的相应曲率是通过设置在空腔上的每个膜部分之间的压力差来设定的。光导向机构的各自的曲率可以在光导引机构的操作期间被可控地调节。

6. 发明授权

US07560817B2 Interconnect including a pliable surface and use thereof 有权
标题翻译：互连包括柔韧的表面和使用
公开(公告)号：US07560817B2
公开(公告)日：2009-07-14
申请号：US11312061
申请日：2005-12-20
申请人： Nagesh R. Basavanhally , Raymond A. Cirelli , Omar D. Lopez
发明人： Nagesh R. Basavanhally , Raymond A. Cirelli , Omar D. Lopez
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , B81B7/0006 , B82Y10/00 , H01L24/16 , H01L24/90 , H01L2224/13078 , H01L2224/13099 , H01L2224/1319 , H01L2224/16105 , H01L2224/81193 , H01L2224/81194 , H01L2224/81345 , H01L2224/81385 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01033 , H01L2924/01055 , H01L2924/01079 , H01L2924/014 , H01L2924/1461 , H01L2924/19043 , H01L2924/00
摘要： The present invention provides an interconnect. The interconnect comprises a pliable surface having a plurality of nanostructures disposed thereon, the pliable surface configured to allow the plurality of nanostructures to at least partially conform to a surface when the nanostructures come into contact therewith.
摘要翻译：本发明提供一种互连。互连包括柔性表面，其上设置有多个纳米结构，柔性表面构造成当纳米结构与其接触时允许多个纳米结构至少部分地与表面一致。

7. 发明授权

US07474005B2 Microelectronic element chips 失效
标题翻译：微电子元件芯片
公开(公告)号：US07474005B2
公开(公告)日：2009-01-06
申请号：US11445072
申请日：2006-05-31
申请人： Vladimir Anatolyevich Aksyuk , Nagesh R Basavanhally , Avinoam Kornblit , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
发明人： Vladimir Anatolyevich Aksyuk , Nagesh R Basavanhally , Avinoam Kornblit , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L21/6835 , B81B7/0006 , B81B7/04 , H01L21/486 , H01L21/6836 , H01L23/147 , H01L23/5384 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L2221/68318 , H01L2221/68327 , H01L2221/68372 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/1147 , H01L2224/11472 , H01L2224/13025 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/16 , H01L2224/81001 , H01L2224/81801 , H01L2924/0002 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05552
摘要： Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces. Process including: providing an apparatus including a chip substrate having a first chip surface facing away from a second chip surface, an array of microelectronic elements being on the first chip surface, an array of conductors each being in communication with one of the microelectronic elements and partially spanning an average distance between the first and second chip surfaces; bonding a temporary support carrier onto the array of microelectronic elements; removing a portion of the chip substrate, thereby reducing the average distance between the first and second chip surfaces; and forming an under bump metallization pad at the second chip surface in electrical communication with a conductor.
摘要翻译：一种装置，包括具有背离第二芯片表面的第一芯片表面的芯片衬底; 第一芯片表面上的微电子元件阵列; 以及每个与所述微电子元件中的一个连通的导体阵列，所述导体穿过所述芯片基板并且完全跨越所述第一和第二芯片表面之间的距离。该方法包括：提供包括芯片衬底的装置，该芯片衬底具有背离第二芯片表面的第一芯片表面，位于第一芯片表面上的微电子元件阵列，每个导体阵列与微电子元件中的一个连接，部分跨越第一和第二芯片表面之间的平均距离; 将临时支撑载体接合到微电子元件阵列上; 去除所述芯片基板的一部分，从而减小所述第一和第二芯片表面之间的平均距离; 以及在所述第二芯片表面处形成与导体电连通的凸块下金属化焊盘。

8. 发明授权

US07402913B2 High density nanostructured interconnection 有权
公开(公告)号：US07402913B2
公开(公告)日：2008-07-22
申请号：US11852413
申请日：2007-09-10
申请人： Nagesh R Basavanhally , Raymond A Cirelli , Omar Daniel Lopez
发明人： Nagesh R Basavanhally , Raymond A Cirelli , Omar Daniel Lopez
IPC分类号： H01L23/52
CPC分类号： H01L24/12 , B81B7/0006 , B82Y10/00 , H01L24/16 , H01L24/90 , H01L2224/13078 , H01L2224/13099 , H01L2224/1319 , H01L2224/16105 , H01L2224/81193 , H01L2224/81194 , H01L2224/81345 , H01L2224/81385 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01033 , H01L2924/01055 , H01L2924/01079 , H01L2924/014 , H01L2924/1461 , H01L2924/19043 , H01L2924/00
摘要： A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

9. 发明申请

US20070278699A1 Microelectronic element chips 失效
标题翻译：微电子元件芯片
公开(公告)号：US20070278699A1
公开(公告)日：2007-12-06
申请号：US11445072
申请日：2006-05-31
申请人： Vladimir A. Aksyuk , Nagesh R. Basavanhally , Avinoam Kornblit , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
发明人： Vladimir A. Aksyuk , Nagesh R. Basavanhally , Avinoam Kornblit , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , B81B7/0006 , B81B7/04 , H01L21/486 , H01L21/6836 , H01L23/147 , H01L23/5384 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L2221/68318 , H01L2221/68327 , H01L2221/68372 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/1147 , H01L2224/11472 , H01L2224/13025 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/16 , H01L2224/81001 , H01L2224/81801 , H01L2924/0002 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05552
摘要： Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces. Process including: providing an apparatus including a chip substrate having a first chip surface facing away from a second chip surface, an array of microelectronic elements being on the first chip surface, an array of conductors each being in communication with one of the microelectronic elements and partially spanning an average distance between the first and second chip surfaces; bonding a temporary support carrier onto the array of microelectronic elements; removing a portion of the chip substrate, thereby reducing the average distance between the first and second chip surfaces; and forming an under bump metallization pad at the second chip surface in electrical communication with a conductor.
摘要翻译：一种装置，包括具有背离第二芯片表面的第一芯片表面的芯片衬底; 第一芯片表面上的微电子元件阵列; 以及每个与所述微电子元件中的一个连通的导体阵列，所述导体穿过所述芯片基板并且完全跨越所述第一和第二芯片表面之间的距离。该方法包括：提供包括芯片衬底的装置，该芯片衬底具有背离第二芯片表面的第一芯片表面，位于第一芯片表面上的微电子元件阵列，每个导体阵列与微电子元件中的一个连接，部分跨越第一和第二芯片表面之间的平均距离; 将临时支撑载体接合到微电子元件阵列上; 去除所述芯片基板的一部分，从而减小所述第一和第二芯片表面之间的平均距离; 以及在所述第二芯片表面处形成与导体电连通的凸块下金属化焊盘。

10. 发明授权

US07062132B2 Coupler assembly for an optical backplane system 失效
标题翻译：用于光背板系统的耦合器组件
公开(公告)号：US07062132B2
公开(公告)日：2006-06-13
申请号：US10743922
申请日：2003-12-23
申请人： Nagesh R. Basavanhally , David A. Ramsey , Hong Tang
发明人： Nagesh R. Basavanhally , David A. Ramsey , Hong Tang
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G02B6/4292 , G02B6/3502 , G02B6/3512 , G02B6/3598 , G02B6/3897 , G02B6/43
摘要： A coupler assembly for an optical backplane system having a backplane and two or more circuit packs connected to that backplane. Each circuit pack has an optical transceiver and the backplane has an optical pipe (e.g., an array of waveguides) adapted to guide optical signals between the transceivers of different circuit packs. A coupler assembly is provided for each transceiver to couple light between that transceiver and the optical pipe. Advantageously, the coupler assembly has a movable optical element that can accommodate possible misalignment between the backplane and the circuit pack. In one embodiment, the movable optical element is an array of MEMS mirrors, each mirror adapted to direct light between an optical transmitter or receiver and the corresponding waveguide of the optical pipe. In another embodiment, the movable optical element is an array of flexible optical fibers, each coupled between an optical transmitter or receiver and the corresponding waveguide of the optical pipe and having an angled surface adapted to couple light between said fiber and waveguide.
摘要翻译：一种用于光背板系统的耦合器组件，其具有连接到该背板的背板和两个或更多个电路板。每个电路板具有光收发器，并且背板具有适于引导不同电路板的收发器之间的光信号的光管（例如，波导阵列）。为每个收发器提供耦合器组件以在该收发器和光学管之间耦合光。有利地，耦合器组件具有可容纳背板和电路板之间可能的未对准的可移动光学元件。在一个实施例中，可移动光学元件是MEMS反射镜的阵列，每个反射镜适于在光学发射器或接收器与光学管道的相应波导管之间引导光。在另一个实施例中，可移动光学元件是柔性光纤阵列，每个光纤连接在光发射器或接收器与光学管道的对应波导之间，并且具有适于在所述光纤和波导之间耦合光的倾斜表面。

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