会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Apparatus for supplying film
    • US11858770B2
    • 2024-01-02
    • US17233416
    • 2021-04-16
    • NPS CO., LTD.
    • Seong Ho Bae
    • B65H3/56B65H3/08B65H3/06
    • B65H3/56B65H3/0607B65H3/0638B65H3/0816B65H2301/33224B65H2301/42344B65H2402/35B65H2404/1115B65H2405/1113
    • Disclosed is a film feeding apparatus including a turntable including a driving member and a rotation bar having a central part shaft-coupled to a rotating shaft of the driving member to be driven to rotate around the rotating shaft and driven to rotate to repeatedly perform an operation in which the rotation bar rotates by a predetermined reference angle through the driving member and is then stopped for a predetermined reference time, a film tray that is installed in a predetermined first operation region to position one of opposite ends of the rotation bar on the film tray in a state in which the rotation bar is stopped for the reference time and on which a plurality of films are located in multiple layers, gripping units coupled to the opposite ends of the rotation bar, respectively, to transfer the films along a predetermined circular trajectory around the rotating shaft by the rotation bar and provided to grip the films, and a film ejection unit that is installed in a predetermined second operation region to position a remaining end opposite to the one end of the opposite ends of the rotation bar in the film ejection unit in the state in which the rotation bar is stopped for the reference time and provided to eject the films to an outside, wherein, in the state in which the rotation bar is stopped for the reference time, a griping unit positioned in the first operation region among the gripping units grips a film from the film tray, and a gripping unit positioned in the second operation region among the gripping units releases a film that is pre-gripped from the film tray and transfers the film to the film ejection unit.
    • 2. 发明授权
    • Laser apparatus
    • US12130422B2
    • 2024-10-29
    • US17066945
    • 2020-10-09
    • NPS CO., LTD.
    • Seong Ho Bae
    • G02B26/08B23K26/04B23K26/14B23K26/38G01M11/02G05B19/401G06N20/00
    • G02B26/0816B23K26/043B23K26/1462G01M11/0221G05B19/401G06N20/00B23K26/38G05B2219/4719
    • The present disclosure relates to a laser apparatus including a laser oscillator for oscillating a laser beam; a mirror mount assembly including a mount-side reflective mirror for transmitting the laser beam by reflecting the laser beam; an aligner including a dial that is configured to change alignment of the mount-side reflective mirror according to a rotation angle and a rotation direction and is responsible for adjusting, by the degree of displacement of the reflection angle of the mount-side reflective mirror according to change in the alignment state, a processing optical path through which the laser beam travels, and a driving motor for driving rotation of the dial; an examination module for calculating the optical path difference between a predetermined reference processing optical path and the processing optical path and examining whether optical path distortion occurs on the processing optical path; a calculation module for, when the optical path difference exceeds predetermined reference optical path difference, calculating the target driving speed and target driving time of the driving motor for changing alignment of the mount-side reflective mirror to correct the optical path distortion so that the optical path difference is less than or equal to the predetermined reference optical path difference; and a controller for driving the driving motor according to the target driving speed and the target driving time, wherein the examination module recalculates the optical path difference between the reference processing optical path and the processing optical path that has been changed by the driving motor according to the target driving speed and the target driving time and re-examines whether the optical path distortion occurs, the calculation module recalculates the target driving speed and the target driving time based on the recalculated optical path difference when the recalculated optical path difference exceeds the reference optical path difference, and the controller drives the driving motor again according to the recalculated target driving speed and target driving time.
    • 3. 发明授权
    • Laser apparatus
    • US12042879B2
    • 2024-07-23
    • US17079223
    • 2020-10-23
    • NPS CO., LTD.
    • Seong Ho Bae
    • B23K26/042B23K26/02B23K26/04B23K26/06B23K26/082B23K26/14G02B7/182
    • B23K26/042B23K26/02B23K26/043B23K26/0643B23K26/082B23K26/1462G02B7/1822G02B7/1825G02B7/1827
    • Disclosed herein is a laser apparatus including: a laser oscillator configured to generate a laser beam; a plurality of mirror mount assemblies each arranged in one of predetermined reference transmission steps, each of the mirror mount assemblies including: a mount-side reflective mirror configured to reflect and transmit the laser beam; and an aligner configured to change alignment of the mount-side reflective mirror to adjust a machining optical path through which the laser beam transmitted by the mount-side reflective mirror travels; a laser nozzle assembly including a laser nozzle configured to radiate the laser beam transmitted from the mirror mount assembly located in the last step of the reference transmission steps onto an object to be processed; a database configured to store big data constructed to include optical path adjustment data indicating a pattern of selective adjustment of the machining optical path by the mount-side reflective mirror linked with the aligner according to a driving method of the aligner; and a controller configured to correct, when distortion occurs in the machining optical path, the distortion of the machining optical path by selectively driving the aligner provided in each of at least one mirror mount assembly among the mirror mount assemblies based on the big data using a driving method according to a pattern of the distortion of the machining optical path.
    • 6. 发明申请
    • Apparatus for supplying film
    • US20210323781A1
    • 2021-10-21
    • US17233416
    • 2021-04-16
    • NPS CO.,LTD.
    • Seong Ho BAE
    • B65H3/56B65H3/48B65H3/06B65H3/08
    • Disclosed is a film feeding apparatus including a turntable including a driving member and a rotation bar having a central part shaft-coupled to a rotating shaft of the driving member to be driven to rotate around the rotating shaft and driven to rotate to repeatedly perform an operation in which the rotation bar rotates by a predetermined reference angle through the driving member and is then stopped for a predetermined reference time, a film tray that is installed in a predetermined first operation region to position one of opposite ends of the rotation bar on the film tray in a state in which the rotation bar is stopped for the reference time and on which a plurality of films are located in multiple layers, gripping units coupled to the opposite ends of the rotation bar, respectively, to transfer the films along a predetermined circular trajectory around the rotating shaft by the rotation bar and provided to grip the films, and a film ejection unit that is installed in a predetermined second operation region to position a remaining end opposite to the one end of the opposite ends of the rotation bar in the film ejection unit in the state in which the rotation bar is stopped for the reference time and provided to eject the films to an outside, wherein, in the state in which the rotation bar is stopped for the reference time, a griping unit positioned in the first operation region among the gripping units grips a film from the film tray, and a gripping unit positioned in the second operation region among the gripping units releases a film that is pre-gripped from the film tray and transfers the film to the film ejection unit.
    • 7. 发明申请
    • Laser processing system and method
    • US20210252647A1
    • 2021-08-19
    • US17178097
    • 2021-02-17
    • NPS CO.,LTD.
    • Seong Ho BAE
    • B23K26/70G05B19/418
    • The present disclosure relates to a laser processing system including a processing machine for performing laser processing on a processing target using a laser beam according to a predetermined processing design; a setting module for preparing a processing recipe including a plurality of set values for testing of processing parameters for the controlling the quality value of a predetermined quality item; a controller for repeatedly performing first test processing for the processing target in multiple implementation rounds by driving the processing machine by selectively using any one of the set values for testing as the set value of the processing parameters according to a predetermined order; and an analysis module for analyzing each of results of the first test processing and individually measuring the quality value of each of the results of the first test processing, and selecting, among the set values for testing, a set value for testing used in a specific implementation round of the first test processing, at which the quality value that most satisfies predetermined reference quality is measured, as a set value for mass production of the processing parameters.
    • 8. 发明申请
    • LASER APPARATUS
    • US20210121980A1
    • 2021-04-29
    • US17079223
    • 2020-10-23
    • NPS CO.,LTD.
    • Seong Ho BAE
    • B23K26/14B23K26/06B23K26/04
    • Disclosed herein is a laser apparatus including: a laser oscillator configured to generate a laser beam; a plurality of mirror mount assemblies each arranged in one of predetermined reference transmission steps, each of the mirror mount assemblies including: a mount-side reflective mirror configured to reflect and transmit the laser beam; and an aligner configured to change alignment of the mount-side reflective mirror to adjust a machining optical path through which the laser beam transmitted by the mount-side reflective mirror travels; a laser nozzle assembly including a laser nozzle configured to radiate the laser beam transmitted from the mirror mount assembly located in the last step of the reference transmission steps onto an object to be processed; a database configured to store big data constructed to include optical path adjustment data indicating a pattern of selective adjustment of the machining optical path by the mount-side reflective mirror linked with the aligner according to a driving method of the aligner; and a controller configured to correct, when distortion occurs in the machining optical path, the distortion of the machining optical path by selectively driving the aligner provided in each of at least one mirror mount assembly among the mirror mount assemblies based on the big data using a driving method according to a pattern of the distortion of the machining optical path.