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1. 发明授权

US06655504B2 Braking assembly and system 失效
标题翻译：制动装配和系统
公开(公告)号：US06655504B2
公开(公告)日：2003-12-02
申请号：US09904408
申请日：2001-07-12
申请人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
IPC分类号： F16D5508
CPC分类号： F16D51/10 , F16D65/18 , F16D2121/02 , F16D2121/14 , F16D2121/24 , F16D2125/58
摘要： A braking unit is provided. In one embodiment, the braking unit comprises a base member, a guide member, a flexible rod, an actuator adapted to induce deformation of the rod, and a brake pad. One end of the flexible rod is fixedly attached to the base member while another end is slideably disposed within a passageway defined by the guide member. The brake pad is positioned adjacent the flexible rod such that deformation of the rod causes lateral movement of the brake pad. The braking unit can be incorporated into disc and drum-type braking assemblies and systems.
摘要翻译：提供制动单元。在一个实施例中，制动单元包括基座构件，引导构件，柔性杆，适于引起杆的变形的致动器和制动衬块。柔性杆的一端固定地附接到基部构件，而另一端可滑动地设置在由引导构件限定的通道内。制动衬块位于柔性杆附近，使得杆的变形引起制动衬块的横向移动。制动单元可以结合到盘式和鼓式制动组件和系统中。

2. 发明授权

US06547117B2 Container holder that utilizes moldline structures 失效
公开(公告)号：US06547117B2
公开(公告)日：2003-04-15
申请号：US09904346
申请日：2001-07-12
申请人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
IPC分类号： B60R700
CPC分类号： B60N3/108 , B60H1/00271 , B60N3/102 , B60N3/104 , B60N3/106 , Y10S224/926
摘要： A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.

3. 发明授权

US5715140A Overlay substrate for securing electronic devices in a vehicle 失效
标题翻译：用于将电子设备固定在车辆中的覆盖衬底
公开(公告)号：US5715140A
公开(公告)日：1998-02-03
申请号：US642287
申请日：1996-05-03
申请人： Peter Joseph Sinkunas , Andrew Zachary Glovatsky , Michael George Todd , Myron Lemecha
发明人： Peter Joseph Sinkunas , Andrew Zachary Glovatsky , Michael George Todd , Myron Lemecha
IPC分类号： B60R16/02 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/30 , H05K7/20
CPC分类号： H05K3/0058 , B60R16/0215 , H05K1/0203 , H05K1/189 , H05K2201/0129 , H05K2201/066 , H05K2201/1059 , H05K2201/10598 , H05K3/308
摘要： An apparatus is provided for securing electronic devices in a vehicle. A ventilation duct is provided beneath the instrument panel for conveying air in the vehicle. The ventilation duct includes an outer surface. An overlay substrate is laid upon and secured against the outer surface or acts as the wall of the duct, and is adapted for carrying electronic devices thereon. This design improves packaging efficiency within the vehicle. This invention can also be applied to other automotive applications such as on door panels, instrument panels and package trays.
摘要翻译：提供了一种用于将电子设备固定在车辆中的装置。在仪表板下方设有通风管道，用于输送车辆中的空气。通风管道包括外表面。覆盖基板被放置并固定在外表面上或用作管道的壁，并且适于在其上承载电子设备。该设计提高了车内的包装效率。本发明还可以应用于其他汽车应用，例如门板，仪表板和包装托盘。

4. 发明授权

US5514414A Solvent-less vapor deposition apparatus and process for application of soldering fluxes 失效
标题翻译：无溶剂气相沉积设备及其助焊剂的应用方法
公开(公告)号：US5514414A
公开(公告)日：1996-05-07
申请号：US343072
申请日：1994-11-21
申请人： Guilian Gao , Peter J. Sinkunas , Brenda J. Nation , Myron Lemecha , Lawrence Kneisel
发明人： Guilian Gao , Peter J. Sinkunas , Brenda J. Nation , Myron Lemecha , Lawrence Kneisel
IPC分类号： B23K1/015 , B23K35/36 , B23K35/38 , H05K3/34 , C23C14/00
CPC分类号： B23K35/3618 , B23K1/015 , H05K3/3489 , B23K2201/42 , B23K35/386
摘要： Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.
摘要翻译：将无焊剂的通量蒸汽冷凝到待焊接的工件表面上的装置和方法，例如电子电路板。通过将液体中的通量加热到大于工作表面的温度的温度来产生通量蒸气。助焊剂施加到工作表面，而不使用任何挥发性有机化学品。

5. 发明申请

US20070127257A1 Headlamp assembly with integrated housing and heat sink 有权
标题翻译：头灯组件，集成了外壳和散热片
公开(公告)号：US20070127257A1
公开(公告)日：2007-06-07
申请号：US11293913
申请日：2005-12-05
申请人： Jeffrey Erion , Andrew Glovatsky , Myron Lemecha , Prathap Reddy
发明人： Jeffrey Erion , Andrew Glovatsky , Myron Lemecha , Prathap Reddy
IPC分类号： B60Q1/00 , F21S8/10
CPC分类号： F21V29/763 , F21S41/147 , F21S45/43 , F21S45/47 , F21S45/48 , F21V29/677 , F21V29/75 , F21V29/76 , F21Y2115/10
摘要： A headlamp assembly for a motor vehicle having a light source, a chamber that receives the light source and a cooling channel for removing heat from the chamber. A conductive wall and an insulating wall cooperate to define the chamber and the channel. The conductive wall has a substantially higher thermal conductivity than the insulating wall to promote the heat exchange between the chamber and the cooling channel and to reduce heat exchange between the cooling channel and the relatively hot engine compartment.
摘要翻译：一种用于具有光源的机动车辆的前照灯组件，容纳光源的腔室和用于从腔室去除热量的冷却通道。导电壁和绝缘壁配合以限定室和通道。导电壁具有比绝缘壁显着更高的热导率，以促进室与冷却通道之间的热交换并且减少冷却通道和相对热的发动机室之间的热交换。

6. 发明授权

US07070229B2 Underhood electronic interior integration 失效
标题翻译：冥想电子内部整合
公开(公告)号：US07070229B2
公开(公告)日：2006-07-04
申请号：US10371465
申请日：2003-02-21
申请人： Andrew Glovatsky , Jay Baker , Myron Lemecha , Lawrence Kneisel
发明人： Andrew Glovatsky , Jay Baker , Myron Lemecha , Lawrence Kneisel
IPC分类号： B62D25/08
CPC分类号： B60R16/0207 , B62D25/081
摘要： An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site to an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the passenger site of the bulkhead for thermal cooling as well as protection from the harsh environment of the engine compartment. The bulkhead has an aperture sized to allow the flatwire bus to pass through the bulkhead into the engine compartment. By utilizing a flatwire bus, this aperture is small in size and the integrity of the bulkhead is improved.
摘要翻译：电子系统通常包括扁平电子站点和将扁线电子站点电连接到发动机室中的电子设备的扁平总线。扁线电子站点具有柔性基板，电子元件附接到基板上用于电子设备的操作。扁线电子站点安装在舱壁的乘客位置进行热冷却，同时防止发动机舱的恶劣环境。隔板具有一个孔口，其尺寸允许扁线总线通过舱壁进入发动机舱室。通过使用扁线总线，该孔径尺寸小，并且提高了隔板的完整性。

7. 发明申请

US20050231907A1 Electronically integrated vehicle structure 有权
标题翻译：电子集成车辆结构
公开(公告)号：US20050231907A1
公开(公告)日：2005-10-20
申请号：US10828396
申请日：2004-04-20
申请人： Andrew Glovatsky , Jay Baker , Richard McMillan , Myron Lemecha , Daniel Vander Sluis
发明人： Andrew Glovatsky , Jay Baker , Richard McMillan , Myron Lemecha , Daniel Vander Sluis
IPC分类号： B60R16/02 , H05K7/20
CPC分类号： B60R16/0207
摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.
摘要翻译：集成车辆结构包括塑料支撑结构中的电子位置。该电子站点具有安装在其上的电子部件的柔性基板。塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。每个肋具有形成塑料安装表面的一部分的侧边缘。柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。也可以提供限定金属安装表面的方法支撑结构。一个或多个电子侧可以附接到金属和塑料安装表面。

8. 发明授权

US06501031B1 Electrical circuit board and a method for making the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US06501031B1
公开(公告)日：2002-12-31
申请号：US09655809
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
发明人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
IPC分类号： H05K111
CPC分类号： H05K3/445 , H05K3/386 , H05K3/4038 , H05K3/4092 , H05K2201/0305 , H05K2201/0361 , H05K2201/0394 , H05K2201/0397 , H05K2201/09554 , H05K2201/09581 , H05K2203/1438 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49172
摘要： A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.
摘要翻译：具有芯构件12，设置在其上的一对电介质层14,16的多层电子电路板设计10以及使用粘合材料层连接到电介质层14和芯构件12的第一电路部分20 电路板设计10还具有选择性地形成通过第一电路部分20形成的“盲”孔，通孔或空腔22，电介质层14和粘合层18，从而露出芯构件12。

9. 发明授权

US06284998B1 Method for laser soldering a three dimensional component 失效
标题翻译：激光焊接三维元件的方法
公开(公告)号：US06284998B1
公开(公告)日：2001-09-04
申请号：US09452241
申请日：1999-12-01
申请人： Peter Joseph Sinkunas , Andrew Zachary Glovatsky , Bernard Allen Meyer , Zhong-You Joe Shi , Myron Lemecha , Rexanne M. Coyner
发明人： Peter Joseph Sinkunas , Andrew Zachary Glovatsky , Bernard Allen Meyer , Zhong-You Joe Shi , Myron Lemecha , Rexanne M. Coyner
IPC分类号： B23K2620
CPC分类号： B23K26/20 , B23K1/0056 , B23K2101/40 , H01L2224/75253 , H01L2224/81224 , H01L2924/01087 , H01L2924/01322 , H05K3/3494 , H05K2201/0108 , H05K2203/107
摘要： There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations thereon; a dielectric substrate 14 having a first surface 16 on a first side thereof, a second surface on a second side thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations of the electronic component 10; and a diode laser 50; (b) depositing solder paste atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side of the substrate 14 for a predetermined time, such that the solder paste atop the at least one of the mounting pads 24 is melted.
摘要翻译：这里公开了一种用于激光焊接的方法，包括以下步骤：（a）提供其上具有至少两个终端的电子部件10; 电介质基板14，其第一面上具有第一表面16，在其第二侧上具有第二表面，以及至少两个安装焊盘24，其布置在第一表面16上，与电子部件10的端接部相配合; 和二极管激光器50; （b）在安装焊盘24的上方沉积焊膏; （c）将电子部件10放置在基板14的顶部，使得每个端子大致位于其相应的安装焊盘24的顶部; 以及（d）将来自二极管激光器50的激光能量70从衬底14的第二侧引导到至少一个安装焊盘24预定的时间，使得焊膏位于至少一个安装焊盘24的顶部被融化

10. 发明授权

US5996222A Soldering process with minimal thermal impact on substrate 失效
标题翻译：焊接工艺，对基材的热冲击最小
公开(公告)号：US5996222A
公开(公告)日：1999-12-07
申请号：US84867
申请日：1998-05-26
申请人： Dongkai Shangguan , Myron Lemecha , Achyuta Achari
发明人： Dongkai Shangguan , Myron Lemecha , Achyuta Achari
IPC分类号： H05K1/00 , H05K3/34
CPC分类号： H05K3/3494 , H05K1/0284 , H05K2201/0129 , H05K2201/0999 , H05K2203/111 , Y10T29/49144
摘要： A soldering process is suitable for use with low cost, low heat distortion temperature thermoplastic substrates without distortion or damage to the substrate yet having the mass production capability exhibited by wave and reflow soldering techniques. The process allows integration of consumer products and, in particular, vehicle components such as integrated instrument panel or other such assemblies, without the redundancy of separate printed circuit boards.
摘要翻译：焊接工艺适用于低成本，低热变形温度的热塑性基材，而不会对基材产生变形或损坏，但具有通过波浪和回流焊接技术显示的大规模生产能力。该过程允许消费产品，特别是集成仪表板或其他这样的组件的车辆部件的集成，而不需要单独的印刷电路板的冗余。

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