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    • 1. 发明授权
    • Thermal head control method and device for making a stencil master plate
    • 热敏头控制方法和制作模版母板的装置
    • US5963241A
    • 1999-10-05
    • US886027
    • 1997-06-30
    • Ryuji HigaJunji TakahashiMusashi Hirata
    • Ryuji HigaJunji TakahashiMusashi Hirata
    • B41C1/055B41C1/14B41J2/365B41J2/38B41J2/36
    • B41J2/365B41C1/144B41J2/38B41J2202/32
    • In a thermal head control method for thermally making a stencil master plate from a thermal stencil master plate sheet in the manner of a dot matrix for each line and forming an independent hole for each dot, a physical quantity representing the temperature of the thermal head, such as a time interval Ti for the plate making action by the thermal head for each line and a temperature actually measured from the thermal head, is measured before the plate making action of the next line. The measured temperature is compared with a prescribed value, and if the temperature is lower than the prescribed value, the thermal head is driven (pre-heated) at a power level which is lower than the rated power output and would not affect the thermal stencil master plate sheet. The effective heat emitting property of the thermal head is made uniform without regards to other factors, and a satisfactory perforation is carried out on a thermal stencil master plate sheet at all times.
    • 在热头控制方法中,用于以每个线的点阵的方式从热模板母板片制造模版母板并为每个点形成独立的孔,表示热敏头的温度的物理量, 例如用于每行的热敏头的制版动作的时间间隔Ti和从热敏头实际测量的温度,在下一行的制版动作之前测量。 将测量温度与规定值进行比较,如果温度低于规定值,则热头被驱动(预热),功率水平低于额定功率输出,不会影响热模板 主板。 热头的有效发热特性在不考虑其他因素的情况下是均匀的,并且在热模版母板上始终进行令人满意的穿孔。