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    • 1. 发明授权
    • Production method for photo-sensitive resin and liquid photo-sensitive
resin composition
    • 感光树脂和液体感光树脂组合物的制备方法
    • US5849857A
    • 1998-12-15
    • US640859
    • 1996-05-14
    • Toshio AwajiNobuaki OhtsukiMotohiro Arakawa
    • Toshio AwajiNobuaki OhtsukiMotohiro Arakawa
    • C08G59/14C08G59/42C08L63/00C08L63/10G03F7/033G03F7/038H05K1/00H05K3/00H05K3/34C08G59/16
    • G03F7/0388C08G59/1494C08G59/4292C08L63/00C08L63/10G03F7/033G03F7/038H05K3/0076H05K3/3452H05K3/4676
    • The present invention provides a production method for a photo-sensitive resin, characterized in reacting a difunctional epoxy resin (B) having two epoxy groups in a molecule with carboxyl groups contained in a resin (A) having two or more (meth)acryloyl groups and at least one carboxyl group in a molecule. Since the photo-sensitive resin prepared by extending the resin (A) to a high molecular weight linearly via the difunctional epoxy resin (B) is obtained, a resist layer having an excellent tack-free property can be formed. Further, a resist layer irradiated with rays through a patterning film can be developed rapidly and correctly in an alkaline aqueous solution. Accordingly, it has been possible to provide the high-performance liquid photo-sensitive resin compositions useful for a solder resist used for producing printed circuit boards and for an electroless plating resist or useful for producing black matrices and color filters for liquid crystal displays. Further, the coated layer formed by photo-curing the liquid photo-sensitive resin composition containing the polymer fine particles having a Tg of 20.degree. C. or lower has an advantage that the coated layer provides an excellent adhesion even if it is exposed to a heating process.
    • PCT No.PCT / JP95 / 01828 Sec。 371日期:1996年5月14日 102(e)日期1996年5月14日PCT提交1995年9月13日PCT公布。 公开号WO96 / 0852500 日期:1996年3月21日本发明提供了一种光敏树脂的制造方法,其特征在于使分子中具有两个环氧基的双官能环氧树脂(B)与包含在具有两个以上的树脂(A)中的羧基反应 (甲基)丙烯酰基和至少一个羧基。 由于通过经由双官能环氧树脂(B)使树脂(A)直链延伸至高分子量而制备的感光树脂由于可以形成具有优异的无粘性的抗蚀剂层。 此外,可以在碱性水溶液中快速且正确地显影通过图案化膜照射光线的抗蚀剂层。 因此,可以提供可用于生产印刷电路板和化学镀抗蚀剂的阻焊剂的高性能液体光敏树脂组合物,或可用于生产用于液晶显示器的黑色矩阵和滤色器。 此外,通过光固化含有Tg为20℃或更低的聚合物细颗粒的液体光敏树脂组合物形成的涂层具有这样的优点,即使涂布层暴露于 加热过程。
    • 3. 发明授权
    • Method of manufacturing porous cross-linked polymer sheet
    • 多孔交联聚合物片的制造方法
    • US06730712B2
    • 2004-05-04
    • US10169182
    • 2002-09-27
    • Masazumi SasabeKatsuhiko SakamotoKozo NogiMotohiro Arakawa
    • Masazumi SasabeKatsuhiko SakamotoKozo NogiMotohiro Arakawa
    • C08J928
    • C08J9/28B29C44/5654C08J2201/028C08J2201/0504
    • A method for producing a porous cross-linked polymer sheet capable of slicing quickly is provided. This method comprises a step for obtaining a porous cross-linked polymer by forming and polymerizing an HIPE, a step for dehydrating the porous cross-linked polymer, and a step for subsequently slicing the dehydrated porous cross-linked polymer. According to this invention, by performing the step of dehydration prior to the conventional step of slicing, it is made possible to prevent the porous cross-linked polymer from adhering to the blade and the guides provided for a slicer, and allow the slicing to be attained quickly. By removing the salt from the polymer, it is further made possible to prevent a production device from gathering rust and the porous cross-linked polymer from permitting adhesion of rust thereto.
    • 提供了能够快速切片的多孔交联聚合物片材的制造方法。 该方法包括通过HIPE的形成和聚合获得多孔交联聚合物的步骤,用于使多孔交联聚合物脱水的步骤和用于随后切割脱水多孔交联聚合物的步骤。 根据本发明,通过在常规的切片步骤之前进行脱水步骤,可以防止多孔交联聚合物粘附到刀片和设置在切片机上的导向器,并允许切片为 快速获得 通过从聚合物中除去盐,进一步可以防止生产装置收集生锈和多孔交联聚合物从而允许生锈附着在其上。