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1. 发明授权

US5838069A Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same 失效
标题翻译：具有利用Pb-Sn焊料附接到端子部件的焊盘的陶瓷基板及其制造方法
公开(公告)号：US5838069A
公开(公告)日：1998-11-17
申请号：US827314
申请日：1997-03-26
申请人： Motohiko Itai , Hiroyuki Hashimoto , Kazuo Kimura
发明人： Motohiko Itai , Hiroyuki Hashimoto , Kazuo Kimura
IPC分类号： H05K1/09 , H01L21/48 , H01L23/498 , H05K3/24 , H01L23/48 , H01L23/52
CPC分类号： H01L23/49816 , H01L21/4853 , H05K3/246 , H01L2924/0002 , H01L2924/09701 , H05K3/4061
摘要： A ceramic substrate having on the surface thereof a plurality of pads to be attached to terminal members is provided. Each pad includes a metallic layer formed on the surface of the substrate and a connecting layer made of a nickel base alloy and formed on the metallic layer. A gold-nickel layer made of a gold base alloy containing nickel is formed on the connecting layer. The gold-nickel layer may be formed by first forming a gold layer on the connecting layer and then making nickel in the connecting layer to diffuse into the gold layer by heat treatment. A method of producing such a ceramic substrate is also provided.
摘要翻译：提供了一种陶瓷基板，其表面上具有多个要连接到端子构件的焊盘。每个焊盘包括形成在基板的表面上的金属层和形成在金属层上的由镍基合金制成的连接层。在连接层上形成由含有镍的金基合金制成的金镍层。金镍层可以通过首先在连接层上形成金层，然后通过热处理使连接层中的镍扩散到金层中而形成。还提供了制造这种陶瓷基板的方法。

2. 发明授权

US06518518B1 Resin substrate 有权
公开(公告)号：US06518518B1
公开(公告)日：2003-02-11
申请号：US09476988
申请日：2000-01-04
申请人： Hajime Saiki , Motohiko Itai
发明人： Hajime Saiki , Motohiko Itai
IPC分类号： H05K111
CPC分类号： B23K35/262 , H01L2224/81141 , H01L2224/81191 , H01L2224/81899 , H01L2924/00013 , H01L2924/01322 , H01R12/52 , H01R12/718 , H01R13/405 , H05K3/3463 , H01L2224/29099 , H01L2924/00
摘要： A resin substrate is made of resin or a composite material containing resin. Pins each having the surface, on which Au plating is formed, are, with a soldering material made of Sn and Sb, soldered to a substrate body having a first main surface and formed into substantially a rectangular shape to project over the first main surface 2A of the substrate body. Wettability of the soldering material for securing the pins and the substrate body to one another is relatively low as compared with that of a Pb—Sn soldering material. Therefore, the height of upward movement of the soldering material along the pin can be reduced. Hence it follows that the pins can sufficiently deeply be inserted into the socket so that the gap between the first main surface of the substrate body and the upper surface of the socket is reduced. As a result, the overall height realized after the substrate made of resin has been joined to the socket can be reduced

3. 发明授权

US07291791B2 Resin substrate 有权
标题翻译：树脂基材
公开(公告)号：US07291791B2
公开(公告)日：2007-11-06
申请号：US11018393
申请日：2004-12-22
申请人： Hajime Saiki , Motohiko Itai
发明人： Hajime Saiki , Motohiko Itai
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： B23K35/262 , H01L2224/81141 , H01L2224/81191 , H01L2224/81899 , H01L2924/00013 , H01L2924/01322 , H01R12/52 , H01R12/718 , H01R13/405 , H05K3/3463 , H01L2224/29099 , H01L2924/00
摘要： A substrate is made of resin or a composite material. Pins with Au plating on their surface are soldered, with a soldering material made of Sn and Sb, to a substrate body having a first main surface, and formed into substantially a rectangular shape to project over the first main surface of the substrate body. Wettability of the soldering material for securing the pins and the substrate body is relatively low as compared with that of a Pb—Sn soldering material. Therefore, the height of upward movement of the soldering material along the pin can be reduced. Thus, the pins can be deeply inserted into socket so that the gap between the first main surface of the substrate body and the upper surface of the socket is reduced. As a result, the overall height realized the substrate made of resin has been joined to the socket can be reduced.
摘要翻译：基材由树脂或复合材料制成。在其表面上镀Au的引脚用由Sn和Sb制成的焊接材料焊接到具有第一主表面的基板主体上，并且形成为大致矩形形状以突出在基板主体的第一主表面上。与Pb-Sn焊接材料相比，用于固定销和基板主体的焊接材料的润湿性相对较低。因此，焊接材料沿销的向上运动的高度可以减小。因此，销可以深入插入插座中，使得基板主体的第一主表面和插座的上表面之间的间隙减小。结果，实现了由树脂制成的基板已经连接到插座的整体高度可以减小。

4. 发明授权

US06573458B1 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US06573458B1
公开(公告)日：2003-06-03
申请号：US09390644
申请日：1999-09-07
申请人： Hideshi Matsubara , Motohiko Itai , Kazuo Kimura
发明人： Hideshi Matsubara , Motohiko Itai , Kazuo Kimura
IPC分类号： H05K116
CPC分类号： H01L23/3128 , H01L21/4853 , H01L23/49816 , H01L2224/16225 , H01L2924/00013 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15174 , H01L2924/15311 , H05K3/4015 , H01L2924/00 , H01L2224/29099
摘要： A printed circuit board includes a number of ball-shaped terminals provided on one main surface of the board. Each of the ball-shaped terminals includes a metallic ball brazed on a pad provided on the main surface of the board. A thin gold layer is deposited by plating on the surface of the metallic ball.
摘要翻译：印刷电路板包括设置在电路板的一个主表面上的多个球形端子。每个球形端子包括钎焊在设置在板的主表面上的焊盘上的金属球。通过电镀在金属球的表面上沉积薄金层。

5. 发明申请

US20050186812A1 Resin substrate 有权
标题翻译：树脂基材
公开(公告)号：US20050186812A1
公开(公告)日：2005-08-25
申请号：US11018393
申请日：2004-12-22
申请人： Hajime Saiki , Motohiko Itai
发明人： Hajime Saiki , Motohiko Itai
IPC分类号： H01R11/01 , B23K35/26 , H01L23/12 , H01L23/50 , H01R4/02 , H01R12/52 , H01R12/71 , H01R13/405 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/34 , H05K1/00
CPC分类号： B23K35/262 , H01L2224/81141 , H01L2224/81191 , H01L2224/81899 , H01L2924/00013 , H01L2924/01322 , H01R12/52 , H01R12/718 , H01R13/405 , H05K3/3463 , H01L2224/29099 , H01L2924/00
摘要： A resin substrate is made of resin or a composite material containing resin. Pins each having the surface, on which Au plating is formed, are, with a soldering material made of Sn and Sb, soldered to a substrate body having a first main surface and formed into substantially a rectangular shape to project over the first main surface 2A of the substrate body. Wettability of the soldering material for securing the pins and the substrate body to one another is relatively low as compared with that of a Pb—Sn soldering material. Therefore, the height of upward movement of the soldering material along the pin can be reduced. Hence it follows that the pins can sufficiently deeply be inserted into the socket so that the gap between the first main surface of the substrate body and the upper surface of the socket is reduced. As a result, the overall height realized after the substrate made of resin has been joined to the socket can be reduced
摘要翻译：树脂基板由树脂或含树脂的复合材料制成。使用由Sn和Sb制成的焊接材料，其上形成有Au镀层的表面焊接到具有第一主表面并且形成为大致矩形形状的基板主体上以在第一主表面2上突出 A的基体。与Pb-Sn焊接材料相比，用于将销和基板本体彼此固定的焊接材料的润湿性相对较低。因此，焊接材料沿销的向上运动的高度可以减小。因此，可以使销钉足够深地插入插座中，使得基板主体的第一主表面和插座的上表面之间的间隙减小。结果，可以减少在由树脂制成的基板之后实现的总高度已经接合到插座

6. 发明授权

US06224703B1 Method of making laminate ceramic substrate with domed pads 有权
标题翻译：制造具有圆顶垫的叠层陶瓷基板的方法
公开(公告)号：US06224703B1
公开(公告)日：2001-05-01
申请号：US09226119
申请日：1999-01-07
申请人： Kozo Yamasaki , Hideshi Matsubara , Kazuo Kimura , Motohiko Itai
发明人： Kozo Yamasaki , Hideshi Matsubara , Kazuo Kimura , Motohiko Itai
IPC分类号： B32B3112
CPC分类号： H05K1/113 , H01L21/4853 , H01L2224/05568 , H01L2224/05573 , H01L2224/1358 , H01L2924/00014 , H01L2924/15174 , H05K1/0306 , H05K3/246 , H05K3/3436 , H05K3/4061 , H05K3/4629 , H05K2201/0347 , H05K2201/0367 , H05K2203/0156 , H05K2203/0191 , H01L2224/05599
摘要： A method of making a laminate ceramic substrate with domed pads is provided. In the method, a ceramic green sheet is prepared which has a pair of first and second opposite main surfaces and a plurality of through holes extending between the first and second main surfaces. The ceramic green sheet is placed upon a flat elastic sheet in such a manner that the first main surface of the ceramic green sheet is in contact with the flat elastic sheet. Metallizing ink is filled into the through hole so that a portion of the ink protrudes beyond the first main surface to form domed protruded portions by elastic deformation of the elastic sheet. The green sheet (optionally placed upon at least one other green sheet in such a manner that the second main surface is in contact with the other green sheet) is then sintered, thereby forming the domed, protruded portions of the metallizing ink into domed pads.
摘要翻译：提供一种制造具有圆顶垫的层压陶瓷基板的方法。在该方法中，制备具有一对第一和第二相对主表面的陶瓷生片和在第一和第二主表面之间延伸的多个通孔。将陶瓷生片放置在平坦的弹性片上，使得陶瓷生片的第一主表面与平的弹性片接触。金属化油墨被填充到通孔中，使得一部分油墨突出超过第一主表面，以通过弹性片材的弹性变形形成圆顶突出部分。然后将生片（任选地以至少一个其他生片，以使第二主表面与另一个生片接触）的方式烧结，从而将金属化油墨的圆顶突出部分形成为圆顶形垫。

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