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1. 发明授权

US06313994B1 Extended surface area heat sink 有权
标题翻译：扩展表面积散热片
公开(公告)号：US06313994B1
公开(公告)日：2001-11-06
申请号：US09625067
申请日：2000-07-25
申请人： Mohammed A. Tantoush
发明人： Mohammed A. Tantoush
IPC分类号： H05K720
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for cooling a high power consumption device, such as a central processing unit (device), has extended heat transfer areas. In an embodiment, the extended heat transfer areas may include fins protruding from portions of a heat sink base. The extended heat transfer area of the heat sink may overhang an area of a circuit board adjacent to the high power consumption device. Low power consumption components, such as memory chips, can be mounted on the circuit board in close proximity to the high power consumption device and beneath the heat sink. The low power consumption component may have separate heat sinks that attach to the low power consumption components and extend beyond the base of the high power consumption device heat sink.
摘要翻译：用于冷却诸如中央处理单元（设备）的高功率消耗装置的散热器具有扩展的传热区域。在一个实施例中，延伸的传热区域可以包括从散热器基座的部分突出的翅片。散热器的延长的传热面积可以突出在与大功率消耗装置相邻的电路板的区域上。诸如存储器芯片的低功耗组件可以安装在电路板上，靠近大功率消耗装置并在散热器下面。低功耗组件可以具有附接到低功耗组件并且延伸超过高功率消耗装置散热器的基础的单独的散热器。

2. 发明授权

US08601428B2 System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing device 失效
标题翻译：用于便携式计算设备中的启发式确定的组件组合和布局的基于用例的热分析的系统和方法
公开(公告)号：US08601428B2
公开(公告)日：2013-12-03
申请号：US13537309
申请日：2012-06-29
申请人： James D. Burrell , Zhongping Bao , Liang Cheng , Damion B. Gastelum , Gary D. Good , Mohammed A. Tantoush , Jon J. Anderson
发明人： James D. Burrell , Zhongping Bao , Liang Cheng , Damion B. Gastelum , Gary D. Good , Mohammed A. Tantoush , Jon J. Anderson
IPC分类号： G06F11/22 , G06F17/50
CPC分类号： G06F17/5018 , G06F2217/80
摘要： Various embodiments of methods and systems for heuristic determination and thermal analysis of component placement on a printed circuit board (“PCB”) for use in a portable computing device (“PCD”) are disclosed. It is an advantage of embodiments that thermal energy generating components, such as processors, may be heuristically selected and arranged on a selected PCB according to varying layouts and combinations and then evaluated for thermal dissipation efficiency under an assortment of use case scenarios. In this way, users of the system and method may quickly narrow down commercially feasible component layouts, identify the most efficient layouts and then heuristically modify the layouts to develop an optimal arrangement.
摘要翻译：公开了用于在便携式计算设备（“PCD”）中使用的印刷电路板（“PCB”）上的部件放置的启发式确定和热分析的方法和系统的各种实施例。根据变化的布局和组合，可以启发式地选择并布置在所选择的PCB上，然后在各种用例场景下评估热耗散效率的优点。以这种方式，系统和方法的用户可以快速缩小商业上可行的组件布局，识别最有效的布局，然后启发式修改布局以开发最佳布置。

3. 发明申请

US20130167103A1 System and Method For Use Case-Based Thermal Analysis of Heuristically Determined Component Combinations and Layouts In A Portable Computing Device 失效
标题翻译：用于便携式计算设备中的启发式确定的组件和布局的基于用例的热分析的系统和方法
公开(公告)号：US20130167103A1
公开(公告)日：2013-06-27
申请号：US13537309
申请日：2012-06-29
申请人： James D. Burrell , Zhongping Bao , Liang Cheng , Damion B. Gastelum , Gary D. Good , Mohammed A. Tantoush , Jon J. Anderson
发明人： James D. Burrell , Zhongping Bao , Liang Cheng , Damion B. Gastelum , Gary D. Good , Mohammed A. Tantoush , Jon J. Anderson
IPC分类号： G06F17/50
CPC分类号： G06F17/5018 , G06F2217/80
摘要： Various embodiments of methods and systems for heuristic determination and thermal analysis of component placement on a printed circuit board (“PCB”) for use in a portable computing device (“PCD”) are disclosed. It is an advantage of embodiments that thermal energy generating components, such as processors, may be heuristically selected and arranged on a selected PCB according to varying layouts and combinations and then evaluated for thermal dissipation efficiency under an assortment of use case scenarios. In this way, users of the system and method may quickly narrow down commercially feasible component layouts, identify the most efficient layouts and then heuristically modify the layouts to develop an optimal arrangement.
摘要翻译：公开了用于在便携式计算设备（“PCD”）中使用的印刷电路板（“PCB”）上的部件放置的启发式确定和热分析的方法和系统的各种实施例。根据变化的布局和组合，可以启发式地选择并布置在所选择的PCB上，然后在各种用例场景下评估热耗散效率的优点。以这种方式，系统和方法的用户可以快速缩小商业上可行的组件布局，识别最有效的布局，然后启发式修改布局以开发最佳布置。

4. 发明授权

US06661665B2 Method and apparatus for removing heat from an electronic device 有权
公开(公告)号：US06661665B2
公开(公告)日：2003-12-09
申请号：US10135172
申请日：2002-04-30
申请人： Mohammed A. Tantoush , Kenneth Kitlas
发明人： Mohammed A. Tantoush , Kenneth Kitlas
IPC分类号： H05K720
CPC分类号： G06F1/20
摘要： The electronic device with a system for enhancing the cooling of components located therein is provided. The device includes a housing with a fan positioned adjacent the housing and adapted for producing airflow within the housing. The printed circuit board is mounted within the housing, and a heat-producing device is mounted on the printed circuit board. The heatsink is coupled to the heat-producing device, and a shroud is mounted on the printed circuit board and extends up to the heatsink so as to improve airflow in the region adjacent the heatsink.

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