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    • 1. 发明申请
    • RF SYSTEM-IN-PACKAGE WITH MICROSTRIP-TO-WAVEGUIDE TRANSITION
    • 具有微波至波导转换的射频系统封装
    • US20140285389A1
    • 2014-09-25
    • US13870457
    • 2013-04-25
    • Mohammad FakharzadehMihai Tazlauanu
    • Mohammad FakharzadehMihai Tazlauanu
    • H01Q21/00H01P11/00H01P5/08
    • H01P5/08H01P5/107H01P11/00H01P11/001H01Q13/02H01Q21/0075Y10T29/49016
    • An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.
    • 一种装置包括IC封装,其包括具有第一金属层,第二金属层和设置在第一和第二金属层之间的介电层的基板。 IC封装还包括设置在衬底的表面上并包括RF电路的IC管芯。 第一金属层包括从IC芯片的引脚延伸的微带馈线。 微带馈线包括导电迹线,该导电迹线在远离销的尖端处具有探针元件。 第一金属层还包括波导开口,其包括围绕探针元件的区域,该区域基本上不含导电材料。 衬底还包括设置在该区域的周边的多个金属通孔,金属通孔从第一金属层延伸到第二金属层。
    • 5. 发明申请
    • NEAR-CLOSED POLYGONAL CHAIN MICROSTRIP ANTENNA
    • 近闭合多糖链微阵列天线
    • US20140091979A1
    • 2014-04-03
    • US13630553
    • 2012-09-28
    • Mohammad FakharzadehMehrbod Mohajer
    • Mohammad FakharzadehMehrbod Mohajer
    • H01Q1/38H05K13/00H01Q1/48
    • H01Q9/42H01Q1/36H01Q1/38Y10T29/49016
    • A microstrip antenna includes a substrate having a first surface and an opposing second surface, a ground plane disposed at the first surface of the dielectric layer, and a conductive layer disposed at the second surface of the substrate. The conductive layer includes a continuous conductive trace comprising a plurality of linear segments arranged in a near-closed polygonal chain. The near-closed polygonal chain can define a truncated square spiral shape. Alternatively, the near-closed polygonal chain can define one of a near-closed pentagonal shape, a near-closed hexagonal shape, a near-closed heptagonal shape, and a near-closed octagonal shape. The antenna can be operated to communicate electromagnetic signaling responsive to current signaling provided by the transceiver circuitry, either by driving electrical current signaling at the microstrip antenna to generate the electromagnetic signaling or by receiving the electromagnetic signaling at the microstrip antenna and converting it to electrical current signaling.
    • 微带天线包括具有第一表面和相对的第二表面的基板,设置在电介质层的第一表面处的接地平面和设置在基板的第二表面处的导电层。 导电层包括连续导电迹线,其包括布置在近闭合多边形链中的多个线性段。 近闭合的多边形链可以限定截顶的方形螺旋形状。 或者,近闭合多边形链可以限定近似闭合的五边形,近似六边形,接近闭合的七边形和近似八边形的形状。 天线可以被操作以响应于由收发器电路提供的当前信令来传送电磁信号,通过在微带天线处驱动电流信号以产生电磁信令或通过在微带天线处接收电磁信号并将其转换为电流 信令。
    • 8. 发明授权
    • RF system-in-package with microstrip-to-waveguide transition
    • 带微带至波导转换的RF系统封装
    • US09520635B2
    • 2016-12-13
    • US13870457
    • 2013-04-25
    • Mohammad FakharzadehMihai Tazlauanu
    • Mohammad FakharzadehMihai Tazlauanu
    • H01P5/08H01P11/00H01P5/107H01Q21/00H01Q13/02
    • H01P5/08H01P5/107H01P11/00H01P11/001H01Q13/02H01Q21/0075Y10T29/49016
    • An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.
    • 一种装置包括IC封装,其包括具有第一金属层,第二金属层和设置在第一和第二金属层之间的介电层的基板。 IC封装还包括设置在衬底的表面上并包括RF电路的IC管芯。 第一金属层包括从IC芯片的引脚延伸的微带馈线。 微带馈线包括导电迹线,该导电迹线在远离销的尖端处具有探针元件。 第一金属层还包括波导开口,其包括围绕探针元件的区域,该区域基本上不含导电材料。 衬底还包括设置在该区域的周边的多个金属通孔,金属通孔从第一金属层延伸到第二金属层。
    • 9. 发明授权
    • Dual-tapered microstrip-to-waveguide transition
    • 双锥形微带至波导转换
    • US09178260B2
    • 2015-11-03
    • US13870472
    • 2013-04-25
    • Behzad BiglarbegianMohammad Fakharzadeh
    • Behzad BiglarbegianMohammad Fakharzadeh
    • H01P5/08H01P11/00H01Q21/00H01P5/107H01Q13/02
    • H01P5/08H01P5/107H01P11/00H01P11/001H01Q13/02H01Q21/0075Y10T29/49016
    • An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.
    • 一种天线装置包括具有微带至波导过渡的衬底,其包括在第一金属层的第一端点和第二端点之间延伸并且包括微带元件和探针元件的微带馈线。 微带元件包括从第一端点延伸到第二点的连接段,从第二点延伸到第三点的锥形段,以及从第三点延伸到第四点的连续宽度段。 探针元件从第四点延伸到第二终点,并且具有比连续宽度段窄的宽度。 衬底还包括波导开口,其包括围绕探针元件的区域,并且包括设置在波导开口的周边并且从第一金属层延伸到第二金属层的多个金属通孔。
    • 10. 发明授权
    • Near-closed polygonal chain microstrip antenna
    • 近闭多边形链条微带天线
    • US08994593B2
    • 2015-03-31
    • US13630553
    • 2012-09-28
    • Mohammad FakharzadehMehrbod Mohajer
    • Mohammad FakharzadehMehrbod Mohajer
    • H01Q1/38H01Q9/42H01Q1/36
    • H01Q9/42H01Q1/36H01Q1/38Y10T29/49016
    • A microstrip antenna includes a substrate having a first surface and an opposing second surface, a ground plane disposed at the first surface of the dielectric layer, and a conductive layer disposed at the second surface of the substrate. The conductive layer includes a continuous conductive trace comprising a plurality of linear segments arranged in a near-closed polygonal chain. The near-closed polygonal chain can define a truncated square spiral shape. Alternatively, the near-closed polygonal chain can define one of a near-closed pentagonal shape, a near-closed hexagonal shape, a near-closed heptagonal shape, and a near-closed octagonal shape. The antenna can be operated to communicate electromagnetic signaling responsive to current signaling provided by the transceiver circuitry, either by driving electrical current signaling at the microstrip antenna to generate the electromagnetic signaling or by receiving the electromagnetic signaling at the microstrip antenna and converting it to electrical current signaling.
    • 微带天线包括具有第一表面和相对的第二表面的基板,设置在电介质层的第一表面处的接地平面和设置在基板的第二表面处的导电层。 导电层包括连续导电迹线,其包括布置在近闭合多边形链中的多个线性段。 近闭合的多边形链可以限定截顶的方形螺旋形状。 或者,近闭合多边形链可以限定近似闭合的五边形,近似六边形,接近闭合的七边形和近似八边形的形状。 天线可以被操作以响应于由收发器电路提供的当前信令来传送电磁信号,通过在微带天线处驱动电流信号以产生电磁信令或通过在微带天线处接收电磁信号并将其转换为电流 信令。