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1. 发明授权

US07498197B2 Silica nanoparticles thermoset resin compositions 有权
标题翻译：二氧化硅纳米颗粒热固性树脂组合物
公开(公告)号：US07498197B2
公开(公告)日：2009-03-03
申请号：US11531434
申请日：2006-09-13
申请人： Rafil A. Basheer , Derek B. Workman , Mohamed Bouguettaya
发明人： Rafil A. Basheer , Derek B. Workman , Mohamed Bouguettaya
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , C08G59/3227 , C08L63/00 , H01L23/295 , H01L23/296 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/73203 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01061 , H01L2924/01063 , H01L2924/0107 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , C08L2666/54 , H01L2924/00 , H01L2224/0401
摘要： A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature includes functionalized nanoscopic silica particles dispersed in a curable resin comprising a polyepoxide having at least three epoxide groups per molecule. The composition is useful as an underfill for flip-chip circuit assemblies.
摘要翻译：具有优异加工性的可固化材料，并且其固化形成热膨胀系数低和玻璃化转变温度高的热固性组合物包括分散在包含每分子具有至少三个环氧基团的聚环氧化物的可固化树脂的官能化纳米二氧化硅颗粒。该组合物可用作倒装芯片电路组件的底部填充物。

2. 发明申请

US20060252892A1 Hyperbranched polymer and cycloaliphatic epoxy resin thermosets 审中-公开
标题翻译：超支化聚合物和脂环族环氧树脂热固性材料
公开(公告)号：US20060252892A1
公开(公告)日：2006-11-09
申请号：US11121206
申请日：2005-05-03
申请人： Rafil Basheer , Derek Workman , Arun Chaudhuri , Mohamed Bouguettaya
发明人： Rafil Basheer , Derek Workman , Arun Chaudhuri , Mohamed Bouguettaya
IPC分类号： C08L63/00
CPC分类号： C08L101/005 , C08L63/00 , C08L67/04 , C08L2666/14
摘要： The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.
摘要翻译：本发明涉及由树枝状或超支化聚合物和环脂肪族环氧树脂形成的刚性和透明的热固性组合物。组合物可以用于涂层，例如电子器件包装，粘合剂，线涂和表面处理。

3. 发明申请

US20060197236A1 Curable composition having low coefficient of thermal expansion, method of making an integrated circuit, and an integrated circuit made there from 有权
标题翻译：具有低热膨胀系数的固化组合物，制造集成电路的方法以及由其制成的集成电路
公开(公告)号：US20060197236A1
公开(公告)日：2006-09-07
申请号：US11216942
申请日：2005-08-31
申请人： Rafil Basheer , Mohamed Bouguettaya
发明人： Rafil Basheer , Mohamed Bouguettaya
IPC分类号： H01L23/29
CPC分类号： C08G59/5033 , C08G59/3227 , H01L21/563 , H01L23/293 , H01L23/49811 , H01L24/10 , H01L24/13 , H01L24/29 , H01L24/81 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/81801 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01063 , H01L2924/0107 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1579 , H01L2924/00 , H01L2224/0401
摘要： Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure: X—((CH2)m—(N)—((CH2)n-(Z))2)p wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C2H3O, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/° C. when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240° C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.
摘要翻译：公开了具有低CTE的可固化组合物。在一个实施方案中，公开了一种可固化组合物，其包含（i）包含至少一种以下结构的环氧化合物的粘合剂：<？in-line-formula description =“In-line Formulas”end =“lead”→> X- （（CH 2）2） - （N） - （（CH 2）n） - （Z）） β-in-line-formula description =“In-line Formulas”end =“tail”？>其中X是芳香环或六元环脂肪族环，m为约0至约2，n为约1至约3，Z为经验式的环氧基：C 2 H 3 O，p 为约2至约3的数，和（ii）包含至少一种多胺的交联剂。该可固化组合物的特征在于在约100至240℃的温度下固化约20至约60分钟的时间时，CTE不超过60ppm /℃。还公开了制备集成电路的方法和集成电路，特别是倒装芯片。

4. 发明申请

US20130131223A1 Tackifiers For Composite Articles 审中-公开
标题翻译：复合制品的增粘剂
公开(公告)号：US20130131223A1
公开(公告)日：2013-05-23
申请号：US13813829
申请日：2011-08-03
申请人： Mohamed Bouguettaya , Nicholas Foley , John C. Norton , Stephen A. Fischer
发明人： Mohamed Bouguettaya , Nicholas Foley , John C. Norton , Stephen A. Fischer
IPC分类号： C08L97/02
CPC分类号： C09J179/02 , B32B21/02 , C08L97/02 , C09J131/04 , C09J139/02
摘要： A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder component and a tackifier component. The tackifier component comprises an acrylic or a styrene-butadiene polymer. The tackifier component is useful for maintaining orientation of the plurality of lignocellulosic pieces during manufacture of the composite article. The composite article may be various engineered lignocellulosic composites, such as particleboard.
摘要翻译：复合制品包括多个木质纤维片和设置在多个木质纤维片上用于粘合多个木质纤维素片的粘合剂系统。粘合剂体系包括粘合剂组分和增粘剂组分。增粘剂组分包括丙烯酸或丁苯聚合物。增粘剂组分可用于在复合制品的制造过程中维持多个木质纤维片的取向。复合制品可以是各种工程木质纤维素复合材料，例如刨花板。

5. 发明申请

US20080122118A1 SILICA NANOPARTICLES THERMOSET RESIN COMPOSITIONS 有权
标题翻译：二氧化硅纳米材料热固性树脂组合物
公开(公告)号：US20080122118A1
公开(公告)日：2008-05-29
申请号：US11531434
申请日：2006-09-13
申请人： Rafil A. Basheer , Derek B. Workman , Mohamed Bouguettaya
发明人： Rafil A. Basheer , Derek B. Workman , Mohamed Bouguettaya
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L21/563 , C08G59/3227 , C08L63/00 , H01L23/295 , H01L23/296 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/73203 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01061 , H01L2924/01063 , H01L2924/0107 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , C08L2666/54 , H01L2924/00 , H01L2224/0401
摘要： A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature includes functionalized nanoscopic silica particles dispersed in a curable resin comprising a polyepoxide having at least three epoxide groups per molecule. The composition is useful as an underfill for flip-chip circuit assemblies.
摘要翻译：具有优异加工性的可固化材料，并且其固化形成热膨胀系数低和玻璃化转变温度高的热固性组合物包括分散在包含每分子具有至少三个环氧基团的聚环氧化物的可固化树脂的官能化纳米二氧化硅颗粒。该组合物可用作倒装芯片电路组件的底部填充物。

6. 发明申请

US20140221580A1 High Molecular Weight Polycarbodiimide And Method Of Producing Same 审中-公开
标题翻译：高分子量聚碳化二亚胺及其生产方法
公开(公告)号：US20140221580A1
公开(公告)日：2014-08-07
申请号：US14241211
申请日：2012-08-29
申请人： Mohamed Bouguettaya
发明人： Mohamed Bouguettaya
IPC分类号： C08G18/02
CPC分类号： B05D1/02 , B05D3/02 , C08G18/025 , C08G18/7621 , C08G2105/06 , C09D179/08
摘要： A method of producing the high molecular weight polycarbodiimide comprises the steps of providing an isocyanate component comprising toluene diisocyanate (TDI), a carbodiimidization catalyst, and a first solvent. The method further comprises the step of polymerizing the isocyanate component in the first solvent and in the presence of the carbodiimidization catalyst to produce a reaction mixture including at least one carbodiimide compound and the first solvent. In addition, the method comprises the step of combining a second solvent and the reaction mixture. Finally, the method comprises the step of polymerizing the at least one carbodiimide compound for a second period of time in the first and second solvents and in the presence of the carbodiimidization catalyst to produce the high molecular weight polycarbodiimide.
摘要翻译：制备高分子量聚碳化二亚胺的方法包括提供包含甲苯二异氰酸酯（TDI），碳二亚胺化催化剂和第一溶剂的异氰酸酯组分的步骤。该方法还包括在第一溶剂中和在碳二亚胺化催化剂存在下聚合异氰酸酯组分以产生包含至少一种碳二亚胺化合物和第一溶剂的反应混合物的步骤。此外，该方法包括组合第二溶剂和反应混合物的步骤。最后，该方法包括在第一和第二溶剂中和在碳二亚胺化催化剂的存在下使至少一种碳二亚胺化合物聚合第二时间段以产生高分子量聚碳化二亚胺的步骤。

7. 发明申请

US20130131231A1 Tackifiers For Composite Articles 审中-公开
标题翻译：复合制品的增粘剂
公开(公告)号：US20130131231A1
公开(公告)日：2013-05-23
申请号：US13813852
申请日：2011-08-03
申请人： Mohamed Bouguettaya , Nicholas Foley
发明人： Mohamed Bouguettaya , Nicholas Foley
IPC分类号： C09J179/02 , C09J139/02
CPC分类号： C09J179/02 , B32B21/02 , C08L97/02 , C09J131/04 , C09J139/02
摘要： A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder component and a tackifier component. The tackifier component comprises a cationic polymer. The tackifier component is useful for maintaining orientation of the plurality of lignocellulosic pieces during manufacture of the composite article. The composite article may be various engineered lignocellulosic composites, such as particleboard.
摘要翻译：复合制品包括多个木质纤维片和设置在多个木质纤维片上用于粘合多个木质纤维素片的粘合剂系统。粘合剂体系包括粘合剂组分和增粘剂组分。增粘剂组分包含阳离子聚合物。增粘剂组分可用于在复合制品的制造过程中维持多个木质纤维片的取向。复合制品可以是各种工程木质纤维素复合材料，例如刨花板。

8. 发明申请

US20130131230A1 Tackifiers For Composite Articles 审中-公开
标题翻译：复合制品的增粘剂
公开(公告)号：US20130131230A1
公开(公告)日：2013-05-23
申请号：US13813801
申请日：2011-08-03
申请人： Mohamed Bouguettaya , Nicholas Foley
发明人： Mohamed Bouguettaya , Nicholas Foley
IPC分类号： C09J131/04
CPC分类号： C09J179/02 , B32B21/02 , C08L97/02 , C09J131/04 , C09J139/02
摘要： A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder component and a tackifier component. The tackifier component comprises a homo- and/or co-polymer of vinyl acetate. The tackifier component is useful for maintaining orientation of the plurality of lignocellulosic pieces during manufacture of the composite article. The composite article may be various engineered lignocellulosic composites, such as particleboard.
摘要翻译：复合制品包括多个木质纤维片和设置在多个木质纤维片上用于粘合多个木质纤维素片的粘合剂系统。粘合剂体系包括粘合剂组分和增粘剂组分。增粘剂组分包括乙酸乙烯酯的均聚物和/或共聚物。增粘剂组分可用于在复合制品的制造过程中维持多个木质纤维片的取向。复合制品可以是各种工程木质纤维素复合材料，例如刨花板。

9. 发明申请

US20090082528A1 HYPERBRANCHED POLYMER AND CYCLOALIPHATIC EPOXY RESIN THERMOSETS 失效
标题翻译：高分子聚合物和环氧树脂环氧树脂热稳定剂
公开(公告)号：US20090082528A1
公开(公告)日：2009-03-26
申请号：US12267157
申请日：2008-11-07
申请人： Rafil A. Basheer , Derek B. Workman , Arun K. Chaudhuri , Mohamed Bouguettaya
发明人： Rafil A. Basheer , Derek B. Workman , Arun K. Chaudhuri , Mohamed Bouguettaya
IPC分类号： C08L63/00
CPC分类号： C08L101/005 , C08L63/00 , C08L67/04 , C08L2666/14
摘要： The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.
摘要翻译：本发明涉及由树枝状或超支化聚合物和环脂肪族环氧树脂形成的刚性和透明的热固性组合物。组合物可以用于涂层，例如电子器件包装，粘合剂，线涂和表面处理。

10. 发明授权

US09221073B2 High molecular weight polycarbodiimide and method of producing same 有权
标题翻译：高分子量聚碳化二亚胺及其制造方法
公开(公告)号：US09221073B2
公开(公告)日：2015-12-29
申请号：US14241211
申请日：2012-08-29
申请人： Mohamed Bouguettaya
发明人： Mohamed Bouguettaya
IPC分类号： B05D1/02 , C08G18/76 , C08G18/02 , C09D179/08 , B05D3/02
CPC分类号： B05D1/02 , B05D3/02 , C08G18/025 , C08G18/7621 , C08G2105/06 , C09D179/08
摘要： A method of producing the high molecular weight polycarbodiimide comprises the steps of providing an isocyanate component comprising toluene diisocyanate (TDI), a carbodiimidization catalyst, and a first solvent. The method further comprises the step of polymerizing the isocyanate component in the first solvent and in the presence of the carbodiimidization catalyst to produce a reaction mixture including at least one carbodiimide compound and the first solvent. In addition, the method comprises the step of combining a second solvent and the reaction mixture. Finally, the method comprises the step of polymerizing the at least one carbodiimide compound for a second period of time in the first and second solvents and in the presence of the carbodiimidization catalyst to produce the high molecular weight polycarbodiimide.
摘要翻译：制备高分子量聚碳化二亚胺的方法包括提供包含甲苯二异氰酸酯（TDI），碳二亚胺化催化剂和第一溶剂的异氰酸酯组分的步骤。该方法还包括在第一溶剂中和在碳二亚胺化催化剂存在下聚合异氰酸酯组分以产生包含至少一种碳二亚胺化合物和第一溶剂的反应混合物的步骤。此外，该方法包括组合第二溶剂和反应混合物的步骤。最后，该方法包括在第一和第二溶剂中和在碳二亚胺化催化剂的存在下使至少一种碳二亚胺化合物聚合第二时间段以产生高分子量聚碳化二亚胺的步骤。

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